Faculty and Research Scientists
| Bio | Research Areas | Contact |
| Prof. Michael Pecht | Reliability & Supply Chain Policies | 301-405-5323 pecht@calce.umd.edu |
| Dr. Michael Osterman | Testing and Simulation Based Failure Assessment | 301-405-8023 osterman@calce.umd.edu |
| Dr. Michael Azarian | Materials Science, Photonic Devices, Tribology, and Reliability | 301-405-7555 mazarian@calce.umd.edu |
| Prof. Avram Bar-Cohen | Photo Optics and Thermal | 301-405-3173 abc@umd.edu |
| Prof. David Bigio | Polymers | 301-405-5258 bigio@eng.umd.edu |
| Prof. Aris Christou | Flexible Displays, Semiconductor Reliability | 301-405-5208 christou@umd.edu |
| Dr. Diganta Das | Parts Selection & Management, Uprating, Component Reliability | 301-405-5323 diganta@umd.edu |
| Prof. Siddhartha Das | Soft Capillarity and Wetting, Micro-nanoscale transport | 301-405-6633 sidd@umd.edu |
| Prof. Abhijit Dasgupta | Interconnect Reliability, Accelerated Testing | 301-405-5251 dasgupta@calce.umd.edu |
| Prof. Bongtae Han | Reliability Assessment and Prognostics | 301-405-5255 bthan@calce.umd.edu |
| Prof. Patrick McCluskey | Power Electronics, Component Reliability | 301-405-0279 mcclupa@calce.umd.edu |
| Prof. Michael Ohadi | Thermal Management | 301-405-5263 ohadi@eng.umd.edu |
| Prof. Peter Sandborn | Technology Tradeoff Analysis, Life Cycle Cost | 301-405-3167 sandborn@calce.umd.edu |
| Dr. Robert Utter | Electronic Product Development | (301)-405-3884 rgutter@umd.edu |
Research Students
| Ryan Aalund | System Reliability and Accelerated Life Testing | raalund@umd.edu |
| Kunal Ahuja | Trench Capacitor Reliability | kahuja@terpmail.umd.edu |
| Deepak Manohar Bondre | Fretting in Connectors | deepakb@umd.edu |
| Clifton Buxbaum | Integrated 3D Packaged DC-DC Converter | cbux6@umd.edu |
| Rishabh Chaudhary | Electrical Contacts | rish5251@umd.edu |
| Deng Yun Chen | Solder Interconnect Life Modelings | dchen925@terpmail.umd.edu |
| Abhishek Nitin Deshpande | Fatigue Characterization and Anisotropic Modeling of Solder Alloys, Vibration Fatigue and Thermal Cycling of PWAs | despande@umd.edu |
| Weiping Diao | Battery Reliability | wdiao@terpmail.umd.edu |
| Aishwarya Gaonkar | Evaluation of FIDES Reliability Methodology | agaonkar@umd.edu |
| Erick Gutierrez | Transient Liquid Phase Sintering | eguti007@terpmail.umd.edu |
| Mauricio Gutierrez | Prognostics and Lithion Batteries | mgutierr@umd.edu |
| Zhou He | AI Funding & Waterproofing of Smartphones | zhe12@umd.edu |
| Hamidreza Habibollahi Najaf Abadi | Artificial Intelligence and Prognostics of Electronics | hamidh@umd.edu |
| Prabhat Janamanchi | Adhesive Joint Reliability | prabhatj@umd.edu |
| Sriram Jayanthi | Reliability Impacts of Underfill Selection | jayanthi@umd.edu |
| Qian Jiang | Characterization and Anisotropic Modeling for Solders, Reliability of Copper RDL in WLCSP | qjiang@umd.edu |
| Varun Khemani | Prognostics and Health Management of Electronics | vkheman@terpmail.umd.edu |
| Changsu Kim | Electronic Packaging and Reliability, Characterization of Polymers | csk@umd.edu |
| Kong Lingxi | Lithium-ion Batteries | lkong@umd.edu |
| Jonathan Kordell | Fiber Optics | jkordell@terpmail.umd.edu |
| Hyun-Seop Lee | Electronics Reliability | hlee0715@umd.edu |
| Namkyoung Lee | Prognostics and Health Management | nklee@umd.edu |
| David Leslie | Physics of Failure of Complex Outdoor Lighting Systems | dleslie@calce.umd.edu |
| Xiao Lin | Fatigue Damage Caused by Multiaxial Vibration Excitation in Electronic Assemblies | xiao365@umd.edu |
| Yizhou Lu | Reliability of Power Electronic Modules for Off Shore Wind Turbines | lvyz123@umd.edu |
| Gilad Nave | Transient Liquid Phase Solder Pastes | gnave@terpmail.umd.edu |
| Anto Peter | Physics-Of-Failure and Reliability Testing of Capacitor Technologies | anto@calce.umd.edu |
| Sukrut Phansalkar | Reliability of Semiconductor Packaging, Uncertainty Propagation Analysis | sukrutp@umd.edu |
| Suraj Ravimanalan | Storage Reliability for Electronic Components | surajr97@umd.edu |
| Devon Richman | Identifying Counterfeit or Clone Electronic Component | drichman@umd.edu |
| Christopher Riso | 3D Printed Electronic Components | chriso@umd.edu |
| Yonatan Saadon | Power Module Reliability | yonsa22@gmail.com |
| Ravin Singh | Waterproofing of Smartphones | rsingh10@umd.edu |
| Jack Yang | Reliability of Semiconductor Packaging, Uncertainty Propagation Analysis | yhyangv@umd.edu |
| Zhaoxi Yao | Aircraft Smart Motor Thermal Management and Reliability | zxyao@terpmail.umd.edu |
| Andy Yun | 3D Printing of Planar Magnetics | hey318@umd.edu |
| Beihan Zhao | 3D Printable Inks Characterization and Reliability Testing of 3D Printed Electronics | bzhao12@umd.edu |
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