Faculty and Research Scientists
| Bio | Research Areas | Contact |
| Prof. Michael Pecht | Reliability & Supply Chain Policies | 301-405-5323 pecht@umd.edu |
| Dr. Michael Osterman | Testing and Simulation-Based Failure Assessment | 301-405-8023 osterman@umd.edu |
| Prof. Damena Agonafer | The Intersection of Thermal-fluid Sciences, Interfacial Transport Phenomena, and Renewable Energy | agonafer@umd.edu |
| Dr. Michael H. Azarian | Failure Analysis, Prognostics and Health Management, Electrical Contacts, Passive Components, Counterfeit Detection and Mitigation | 301-405-7555 mazarian@umd.edu |
| Prof. David Bigio | Polymers | 301-405-5258 bigio@eng.umd.edu |
| Prof. Aris Christou | Power Electronics, Device Reliability, Flexible Electronics and Displays | 301-405-5208 christou@umd.edu |
| Dr. Diganta Das | Parts Selection & Management, Uprating, Component Reliability | 301-405-5323 diganta@umd.edu |
| Prof. Siddhartha Das | Soft Capillarity and Wetting, Micro-nanoscale transport | 301-405-6633 sidd@umd.edu |
| Prof. Abhijit Dasgupta | Interconnect Reliability, Accelerated Testing | 301-405-5251 dasgupta@umd.edu |
| Prof. Bongtae Han | Reliability Assessment of Packaging Materials, Components and Assemblies | 301-405-5255 bthan@umd.edu |
| Prof. Jay Lee | Manufacturing, Artificial Intelligence | 301-405-5205 leejay@umd.edu |
| Prof. Patrick McCluskey | Power Electronics, Component Reliability | 301-405-0279 mcclupa@umd.edu |
| Prof. Michael Ohadi | Thermal Management | 301-405-5263 ohadi@eng.umd.edu |
| Dr. Sukrut Prashant Phansalkar | Mechanical Characterization and Numerical Modeling of Polymers Used in Advanced Electronics Packaging Technologies. | 301-405-5471 sukrutp@umd.edu |
| Prof. Peter Sandborn | Technology Tradeoff Analysis, Life Cycle Cost | 301-405-3167 sandborn@umd.edu |
| Dr. Robert Utter | Electronic Product Development, Failure Analysis | (301)-405-3884 rgutter@umd.edu |
Research Students
| Aaron Mendelsohn | Solder Joint Reliability | amendel1@umd.edu |
| Akshaya Sridhar | Microfluid Cooling using Microencapsulated Phase Change Materials | asridha2@umd.edu |
| Aniket Ajitkumar Bharamgonda | Microstructure-based Modelling of Lead Free Solder Joints | abharamg@umd.edu |
| Andoniaina Mariah Randriambololona | Composite Phase Change Materials for Power Electronics | arandria@umd.edu |
| Brett Setera | Wide Bandgap Semiconductor Reliability | bsetera@umd.edu |
| Christopher Riso | 3D Printed Electronic Components | chriso@umd.edu |
| Clifton Buxbaum | Integrated 3D Packaged DC-DC Converter | cbux6@umd.edu |
| Dane Miller | Diamond Thin Film Synthesis | dlee13@terpmail.umd.edu |
| David Leslie | Physics of Failure of Complex Outdoor Lighting Systems | dleslie@umd.edu |
| Declan Mallamo | Prognostics and Reliability of Complex Aircraft Systems | dmallamo@umd.edu |
| Dengyun Chen | Solder Interconnect Life Modelings | dchen925@umd.edu |
| Devon Richman | Identifying Counterfeit or Clone Electronic Component | drichman@umd.edu |
| Emils Gustav Jurcik | Thermal Analysis of Power Amplifiers | egjurcik@umd.edu |
| Erick Gutierrez | Transient Liquid Phase Sintering | eguti007@umd.edu |
| Harsha Walvekar | Component Selection Process | hwalveka@umd.edu |
| Hisham Abusalma | Reliability of Electronics | abusalma@umd.edu |
| Huwei Dong | Prognostics and Health Management | donghw@umd.edu |
| Ibaad Gandikota | Composite Potting for Electronic Packaging | gandikot@umd.edu |
| Jack Yang | Reliability of Semiconductor Packaging, Uncertainty Propagation Analysis | yhyangv@umd.edu |
| Jacob Welch | Fatigue Damage Caused by Repeated Impacts in Electronic Assemblies | jwelch23@terpmail.umd.edu |
| Johnny Martin (Undergraduate) | Vibration Fatigue of PWAs | johnny01@terpmail.umd.edu |
| Kidus Jeglalo Guye | Novel Evaporative Cooling Solutions for the Thermal Management of Electronics | kguye@umd.edu |
| Lincoln Vandegriff (Undergraduate) | Environmental Degradation and Delamination of Paints | lincolnv@terpmail.umd.edu |
| Md Asif Faisal Beg | Thermal and Mechanical Characterization of Polymers | masifb@umd.edu |
| Nikhil Bharadwaj | Electronics Component Reliability | nbkulkar@umd.edu |
| Prabhat Janamanchi | Adhesive Joint Reliability | prabhatj@umd.edu |
| Pranav Srinivasan (Undergraduate) | Advanced packaging | pranav22@umd.edu |
| Roshith Mittakolu | Electronics Packaging and Reliability | mroshith@umd.edu |
| Rudra Bipinbhai Vora | Component Reliability | rvora1@umd.edu |
| Rutvik Davuluri | Reliability of Optical Coatings | dvcr@umd.edu |
| Sahithi Maddipatla | Battery Swelling and Prognostics | sahithi@umd.edu |
| Sadib Fardin | Microelectronic devices, characterization of polymers | sadibf@umd.edu |
| Sebastian Winther | Additive Manufacturing of Hybrid Circuits | swinther@umd.edu |
| Seongyo Kim | Semiconductor Packaging | seongyo@umd.edu |
| Shao-Peng Chen | Open-Systems Procurement and Sustainment | spchen@umd.edu |
| Soma Roy | Tribology | somaroy@umd.edu |
| Swarup Kumar Subudhi | Development, Printing, and Testing of Soft Magnetic Films and CNT-GO-based Electronics | swarupks@umd.edu |
| Thais Pirez Alves Ferreira | Regeneration Process of Porous Membranes for Dehumidification | tpirez@umd.edu |
| Vivek Vardhan Manepalli | Advanced Two-phase Cooling Techniques in Electronic Systems | vmanepal@umd.edu |
| Xiao Lin | Fatigue Damage Caused by Multiaxial Vibration Excitation in Electronic Assemblies | xiao365@umd.edu |
| Zhou He | Water Ingress Protection Testing and Assessment of Portable Electronics | zhe12@umd.edu |
Interns and Visitors
| Name | Supervisor or Host | Home Institution |
| Philipp Baer | Prof. Abhijit Dasgupta | University of Mannheim |
| Louis Hardock | Prof. Abhijit Dasgupta | University of Mannheim |
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