Dr. Michael Osterman (Ph.D., University of Maryland, 1991) is a Senior Research Scientist and the director of the CALCE Electronic Products and System Consortium at the University of Maryland. He heads the development of simulation assisted reliability assessment software for CALCE and simulation approaches for estimating time to failure of electronic hardware under test and field conditions. Dr. Osterman served as a subject matter expert on phase I and II of the Lead-free Manhattan Project sponsored by Office of Naval Research in conjunction with the Joint Defense Manufacturing Technical Panel (JDMTP). He has consulted with automotive, medical, defense, and industrial electronic companies on the transition to lead-free materials. He organized and chaired the International Symposium on Tin Whiskers from 2007 to 2013. He has written eight book chapters and over 120 articles. He is a senior member of IEEE and a member of ASME, IMAPS and SMTA.
Risk Assessment of Transition to Lead-free Electronics Assembly, Guru Prasad Pandian, Diganta Das, Michael Osterman, and Michael Pecht Proceedings of the Society for Machinery Failure Prevention Technology Conference, May 15-18, 2017, Virginia Beach, VA.
Reliability of Conformal Coated Surface Mount Packages, Deng Yun Chen and Michael Osterman, IEEE 2016 Accelerated Stress Testing and Reliability (ASTR) Conference, September 28-30, 2016, Pensacola, Florida.
Reliability of Corner Staked Surface Mount Packages, Deng Yun Chen and Michael Osterman, IEEE 2016 Accelerated Stress Testing and Reliability (ASTR) Conference, September 28-30, 2016, Pensacola, Florida.
A Life Model for Supercapacitors, Nick Williard, Dongcheon Baek, Jong Won Park, Byung-Oh Choi, Michael Osterman, and Michael Pecht, IEEE Transactions On Device and Materials Reliability, Vol. 15, No. 4, December 2015.
Influence of Varying H2S Concentration and Humidity Levels on ImAg and OSP Surface Finishes, Amer Charbaji, Michael Osterman, and Michael Pecht, International Journal of Mechanical Engineering and Technology (IJMET), December 2015.
Evaluation of ENEPIG and Immersion Silver Surface Finishes Under Drop Loading, Adam Pearl, Michael Osterman, and Michael Pecht, Journal of ELECTRONIC MATERIALS, @ 2015 The Minerals, Metals & Materials Society, DOI: 10.1007/s11664-015-4104-y.
Evaluating the Impact of Dwell Time on Solder Interconnect Durability under Bending Loads, Sandeep Menon, Michael Osterman and Michael Pecht , Journal of Electronic Materials. DOI: 10.1007/s11664-015-3931-1.
An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model, Elviz George, Michael Osterman and Michael Pecht , Microelectronics Reliability 55, pp 582-587, Feb - March 2015, DOI:10.1016/S0026-2714(15)00039-6.
High Lead (over 85 %) Solder in the Electronics Industry: RoHS Exemptions and Alternatives, Sandeep Menon, Elviz George, Michael Osterman and Michael Pecht , Journal of Materials Science: Materials in Electronics, March 4 2015, DOI: 10.1007/s10854-015-2940-4.
|Upcoming Travel: Conferences, Events, and Guest Lectures|
|Event and Location||Date|
|CALCE 2019 Fall Technical Reivew and Roadmapping Meeting||October 23 - 24, 2019|
|Four-Day Failure Analysis of Electronics Short Course||November 19 - 22, 2019|