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CALCE Webinar - Chip Packaging Process-induced Stresses: Can We Go Beyond Prediction and Design It?

Tuesday, July 14, 2026 11:00 a.m.-12:00 p.m.

Register Today Abstract Semiconductor packaging manufacturing processes utilize thermosets, filled with inorganic fillers (e.g., silica particles), to encapsulate and protect semiconductor chips. Compression molding is more frequently employed for...


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11:00 a.m.-12:00 p.m. CALCE Webinar - Chip Packaging Process-induced Stresses: Can We Go Beyond Prediction and Design It?

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