Professor Abhijit Dasgupta conducts his research on the mechanics of engineered, heterogeneous, active materials, with special emphasis on the micromechanics of constitutive and damage behavior. He applies his expertise to several multifunctional material systems. His research contributions include solution techniques for coupled boundary value problems in multifunctional particulate and laminated composites, micromechanics approaches for constitutive properties of advanced 3-D composites, dynamic behavior and failure of thick composites, micromechanics of fatigue damage in viscoplastic eutectic-alloy composites and in short-fiber polymeric composites, and self-health monitoring in “smart” systems.
Prof. Dasgupta applies these principles for developing effective virtual qualification tools, for optimizing manufacturing process windows, for real-time health monitoring and for devising quantitative accelerated testing strategies used in qualification and quality assurance of complex electronic, electromechanical and structural systems. He has published over 150 journal articles and conference papers on these topics, presented over 20 short workshops nationally and internationally, served on the editorial boards of three different international journals, organized several national and international conferences, and received six awards for his contributions in materials engineering research and education.
|Daniel Breu||Undergraduate Intern|
|Dengyun Chen||Accelerated Testing of Electronic Assemblies Under Thermal Cycling and Drop Loading|
|Abhishek Nitin Deshpande||Solder Characterization and Modeling|
|Qian Jiang||Modeling for Solder Virtual Characterizatin|
|Jonathan Kordell||Fiber Optic Sensors for Health Monitoring|
|David Leslie||Combined Thermal Cycling and Vibration Fatigue of PWAs, Moisture Ingress into Electronics Enclosures, Characterization of Sintered Silver Interconnects|
|Xiao Lin||Multiaxial Vibration Durability of Electronic Assemblies|
|Dennis Shaefer||Undergraduate Intern|
|William Sinton||Undergraduate Intern|
|Name||Year and Placement|
|Hao Huang, Ph.D.||2019|
|Neil Dalal, M.S.||2018, Johns Hopkins Applie Physics Laboratory|
|Sam Massa, M.S.||2018, Northrop Grumman|
|Raman Sridharan, M.S.||2017, Data Physics Inc.|
|Elaine Lin, M.S.||2016, Aerospace Corp.|
Viscoplastic Properties of pressure-less sintered silver materials using indentation, D. Leslie, A. Dasgupta, and Carlos Morillo, Microelectronics Reliability, Vol. 74, 121-130, 2017.
Influence of Secondary Impact on Printed Wiring Assemblies Part II: Competing Failure Modes in Surface Mount Components, Jingshi Meng and Abhijit Dasgupta, J. Electron. Packag, June 2017.
MEMS Packaging Reliability in Board-Level Drop Tests Under Severe Shock and Impact Loading Conditions Part I: Experiment, Jingshi Meng, Abhijit Dasgupta, and Stuart Douglas, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 6, Issue 11 , pp. 1595-1603. November 2016.
Influence of Secondary Impact on Printed Wiring Assemblies Part I: High Frequency 'Breathing Mode' Deformations in the Printed Wiring Board, Jingshi Meng, Abhijit Dasgupta, Journal of Electronic Packaging, Vol. 138, pp. 010914 1-12, March 2016.
Creep fatigue models of solder joints: A critical review, E.H. Wong, W.D. Van Driel, A. Dasgupta, and M. Pecht,Microelectronics Reliability, Vol. 59, pp 1-12, April 2016, DOI:10.1016/j.microrel.2016.01.013.
Effect of gold and copper in AUSN4 deposition and isothermal durability of SAC305 solder joints, Subhasis Mukherjee, Carlos Morillo, Lay-Ling Ong, Julie Silk and Abhijit Dasgupta, Surface Mount Technology Association, Vol 29, Issue 1, 20-30, March 2016.
|Upcoming Travel: Conferences, Events, and Guest Lectures|
|Event and Location||Date|
|20th Eurosime, Hanover, Germany||March 24-27|