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Prof. Patrick McCluskey is a Professor of Mechanical Engineering at the University of Maryland. He is the principal investigator for topics related to computer aided risk assessment of microelectronics, electronic packaging design for high temperature and high power applications, and the insertion of commercial components into high reliability applications. He is the author or co-author of numerous papers and presentations on his research, and is the co-editor of the book High Temperature Electronics. He has taught graduate level and executive short courses covering all levels of electronics packaging and assembly. Dr. McCluskey received his Ph.D. from Lehigh University in 1991. He is a member of IEEE, ASM, ECS, MRS, and serves on the IPC and JEDEC Moisture Sensitivity task forces.
| Current Students | |
|---|---|
| Name | Research Area |
| He Yun | Reliability of Power Converters in Aerospace Application |
| Erick Guiterez |
Transient Liquid Phase Sintering Power Module Reliability
|
| Nga Man Jennifa Li |
Multilayer Ceramic Capacitor Behavior and Reliability Storage Reliability
|
| Subramani Manoharan |
Reliability of Wire Bonds Study of Underfills for BGA/WLP packages
|
| Yonatan Soddon | Thermal Management of Aerospace Electronics |
| Zhaoxi Yao | Thermal Management of Aerospace Electronics |
| Recent Graduates | |
|---|---|
| Name | Year and Placement |
| Seyed Ali Moeini, Ph.D. | 2018, Apple |
| Hannes Greve, Ph.D. | 2017, Intel |
| David Squiller, Ph.D. | 2017, Northrop Grumman |
| Daniel Power, M.S. | 2016, Northrop Gruman |
Recent Publications
Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment, Subramani Manoharan, Chandradip Patel, Patrick McCluskey, and Michael Pecht, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2816259
Analysis of Indentation Measured Mechanical Properties on Multilayer Ceramic Capacitors (MLCCs) , Nga Man Li, Subramani Manoharan, Diganta Das, and Patrick McCluskey, Microelectronics Reliability, Vols. 88-90, 528-533, September 2018, doi: 10.1016/j.microrel.2018.07.116.
Mechanism of Wire Bond Shear Testing, Subramani Manoharan, Chandradip Patel, Stevan hunter, and Patrick McCluskey, Microelectronics Reliability, Vols. 88-90, September 2018, doi: 10.1016/j.microrel.2018.06.061.
Physics-of-Failure, Condition Monitoring and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review, Hyunseok Oh, Bongtae Han, Patrick McCluskey, Changwoon Han and Byeng D. Youn. IEEE Transactions of Power Electronics, Vol. 30, No. 5, May 2015.
Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications, P. Quintero, P. McCluskey, and B. Koenei, Microelectronics Reliability, Vol. 54, Issue 1, pp 220-225, January 2014, DOI:10.1016/j.microrel.2013.08.002.
| Upcoming Travel: Conferences, Events, and Guest Lectures | |
|---|---|
| Event and Location |
Date |
| IMAPS High Temperature Electronics Network, Oxford, UK | July 8 - 10, 2019 |
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