Prof. Patrick McCluskey is a Professor of Mechanical Engineering at the University of Maryland. He is the principal investigator for topics related to computer aided risk assessment of microelectronics, electronic packaging design for high temperature and high power applications, and the insertion of commercial components into high reliability applications. He is the author or co-author of numerous papers and presentations on his research, and is the co-editor of the book High Temperature Electronics.  He has taught graduate level and executive short courses covering all levels of electronics packaging and assembly.  Dr. McCluskey received his Ph.D. from Lehigh University in 1991. He is a member of IEEE, ASM, ECS, MRS, and serves on the IPC and JEDEC Moisture Sensitivity task forces.



Current Students
Name Research Area
He Yun Reliability of Power Converters in Aerospace Application
Erick Guiterez
Transient Liquid Phase Sintering Power Module Reliability
Nga Man Jennifa Li
Multilayer Ceramic Capacitor Behavior and Reliability Storage Reliability
Subramani Manoharan
Reliability of Wire Bonds Study of Underfills for BGA/WLP packages
Yonatan Soddon  Thermal Management of Aerospace Electronics
Zhaoxi Yao  Thermal Management of Aerospace Electronics


Recent Graduates
Name Year and Placement
Seyed Ali Moeini, Ph.D. 2018, Apple
Hannes Greve, Ph.D. 2017, Intel 
David Squiller, Ph.D. 2017, Northrop Grumman
Daniel Power, M.S. 2016, Northrop Gruman

Recent Publications

Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment, Subramani Manoharan, Chandradip Patel, Patrick McCluskey, and Michael Pecht, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2816259

Analysis of Indentation Measured Mechanical Properties on Multilayer Ceramic Capacitors (MLCCs) , Nga Man Li, Subramani Manoharan, Diganta Das, and Patrick McCluskey, Microelectronics Reliability, Vols. 88-90, 528-533, September 2018, doi: 10.1016/j.microrel.2018.07.116.

Mechanism of Wire Bond Shear Testing, Subramani Manoharan, Chandradip Patel, Stevan hunter, and Patrick McCluskey, Microelectronics Reliability, Vols. 88-90, September 2018, doi: 10.1016/j.microrel.2018.06.061.

Physics-of-Failure, Condition Monitoring and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review, Hyunseok Oh, Bongtae Han, Patrick McCluskey, Changwoon Han and Byeng D. Youn. IEEE Transactions of Power Electronics, Vol. 30, No. 5, May 2015.

Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications, P. Quintero, P. McCluskey, and B. Koenei, Microelectronics Reliability, Vol. 54, Issue 1, pp 220-225, January 2014, DOI:10.1016/j.microrel.2013.08.002.


Upcoming Travel: Conferences, Events, and Guest Lectures
Event and Location


IMAPS High Temperature Electronics Network, Oxford, UK July 8 - 10, 2019