“Very educational and interesting course. Hands-on demos were excellent. Highly recommended.” – Michael Cascio, Northrop Grumman Corporation

We work with you to tune courses to cater to your needs.
 
  • Course Length: Most courses are one day classes with 6.5 hours contact time. 
  • Prerequisites: Courses are open to all practicing professionals. (Participants must have appropriate college degrees to earn continuing education credit (CEC) for courses.)
  • Facility: Client is responsible for providing room suitable for expected number of participants with presentation screen and computer projection equipment.
  • Materials: A single set of handouts will be shipped to a designated location. Client is responsible for making additional copies available to course participants. Please allow one week for shipment of handouts. At an additional cost, handouts for a specified number of course participants can be provided.
  • Cost: Cost for each one day class is between $4500-6000 USD, depending on the level of customization. Continuing education credits can be provided at an additional cost per participant.
  • Scheduling: Scheduling courses is subject to availability of instructors. Contact education@calce.umd.edu

Planning Your Course

Review the general course outlines and background information from the list on the right then select the course or courses that you would like to be offered at your company using this link. Tell us the date(s), locations and any additional information about your needs. We prefer a lead time of at least three weeks for planning.

Accelerated Product Qualification. Accelerated stress testing is one of the key resources in the PoF approach and helps simulate product life cycles over compressed time periods by accelerating the damage accumulation rate for relevant wearout damage mechanisms. If done early in the development phase, in conjunction with physics-of-failure (PoF) design, accelerated testing can enhance process and design maturity and enable early introduction of mature products with robust design margins. Efficient testing requires an understanding of test methods, test stresses, test results, and correlation to field life.

Participants will learn how to make accelerated stress testing a value-added activity and use test results to take pro-active, corrective measures early in the design and production phases to ensure reliability and quality.

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Component Authentication and Screening. This workshop begins with an introduction to electronic parts supply chain--the sources of authorized and unauthorized parts. Attendees will learn about the status of the electronic part distribution market and how it has changed over the past decade. The movement of the manufacturing and technology know-how across the globe will be covered to help understand the international aspect of the counterfeit electronics supply chain--followed by information on the extent of the counterfeit electronics problem.
 
Additionaly, the workshop covers the tools and techniques for identifying and understanding risk levels of counterfeit parts , basic inspection and electrical testing, and cost-effective specialisized electrical and material testing.
 
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Counterfeit Electronics: Detection and Avoidance. The course will cover various authentication techniques that are being used and developed to make counterfeiting of electronics more difficult. It will include overt and covert methods of authentications. The course will close with specific suggestions and recommendations how you can protect your supply chain including how to select distributors and monitor your suppliers. It will also have recommendations to the electronic part manufacturers, regulators, government enforcement and procurement agencies on how to reduce the risks from counterfeit electronic parts.

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Electronic Part Obsolescence Forecasting Mitigation and Management. This course reviews DMSMS management best practices, the various mitigation approaches, and available methods of forecasting the obsolescence of parts.  In addition, pro-active methods for managing obsolescence are discussed, including design refresh planning and the use of ASICs. The course is divided into 6 sections that cover introduction to electronic part obsolescence, forecasting, mitigation, management plan and case resolution, strategic management, total ownership cost modeling, and software obsolescence.

The course includes a review of commercial databases and associated decision support tool offerings.
 
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Electronic Product and System Cost Analysis. This course provides an in-depth understanding of predicting cost of systems.  Elements of traditional engineering economics are melded with manufacturing process modeling, life-cycle cost management concepts, and selected concepts from environmental life-cycle cost assessment to form a practical foundation for predicting the real cost of electronic products.

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CALCE-Buehler Failure Analysis of Electronics. The course covers specimen preparation and materials analysis techniques applicable to electronic assemblies, components, and devices and consists of a combination of classroom instruction, demonstrations, and hands-on laboratory training. Topics include physics-of-failure root cause analysis, guidelines for selection of analytical tools, and practical instruction on laboratory techniques. The laboratory portion of the course includes demonstrations and step-by-step hands-on sample preparation using metallographic techniques on the latest failure analysis equipment from Buehler. In addition, a number of important non-destructive and destructive analysis techniques will be demonstrated.
 
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High-Temperature Electronics. This course details the performance and reliability issues involved in designing electronic systems for use at temperatures above 125°C.  It will provide the attendee with the tools and information needed to design electronic systems that will perform reliably in extreme temperature environments, such as are found in defense, avionic and automobiles applications.

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Lead-Free Readiness. This short course is intended to provide the audience with the current status of lead-free reliability and consideration of issues arising from the transition to lead-free assembled electronic hardware. The course provides up to date information on what companies should understand about lead-free materials, the reliability of lead-free assemblies, the risk posed by tin whiskers, as well as mixed solder reliability and rework and repair lead-based and lead-free assemblies.

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Light Emitting Diode (LED) Reliability. This course will cover the latest progress in understanding of failure mechanisms of LEDs that occur at the die, interconnects, and within the package including electrostatic discharge, delamination, and phosphor thermal quenching. The driving factors for precipitating these mechanisms will be discussed to help the developers and users of LEDs control the mechanisms and assess reliability. The course will also inform on the relevant standards for LED testing and reliability assessment, the qualification methods currently in use by major LED manufacturers, and the qualification philosophies that will be most suitable to meet future needs for LED lighting applications.

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Optical Methods for Microelectronics. This course teaches the basic concepts of optical methods as applied to microelectronics product development. It reviews numerous applications, which treat a great diversity of mechanics and materials studies in electronic packaging. Practical aspects of the technology are discussed in the final section.

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Physics of Failure and Reliability. This course introduces the classical reliability concepts and relates the concepts to the physics of failure approach. The information provided in this course will be useful for implementing a physics-of-failure methodology for the life cycle of a product. The participants will learn how to develop and migrate to physics-of-failure based reliability assessment programs. The course will also teach how to facilitate the introduction of the physics-of-failure methodology among the complete supply chain of the product.

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Prognostics and Health Management. The course presents the tools and techniques for development and implementation of prognostics and health monitoring in terms of novel methods for in-situ monitoring, approaches for resource efficient data collection, algorithms for data reduction and parameter extraction, methods for identifying and analyzing precursors based on failure mechanisms, and techniques for predictions that can be used for assisting maintenance and logistics decisions. Different approaches for prognostics are presented along with implementation case-studies.

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Plastic Materials for Microelectronics. Historically, PEMs have been used in commercial and telecommunications electronics and consequently have a large manufacturing base. With major advantages in cost, size, weight, performance, and availability, plastic packages have attracted 97% of the market share of worldwide microcircuit sales, although they encountered formidable challenges in gaining acceptance for use in government and military applications. Today, high-quality, high-reliability, high-performance, and low-cost plastic-encapsulated microcircuits are common. Thanks to new packaging materials, improved design, increased reliability testing, and other important developments, PEMs are not, in many cases, the most cost-effective option for a wide range of electronic systems applications.

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Root-Cause Failure Analysis of Electronic Products. This course will present a methodology for identifying potential failure mechanisms based on the failure history. Appropriate failure analysis techniques for various failure mechanisms will be discussed, with step-by-step details provided. Example pictures and case studies will be presented. The course will conclude with corrective and preventative actions, the most crucial part of a failure analysis report.

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Uprating. The ratings on electronic parts and selection of their use for an application environment are a matter of concern for engineers in all industries. There are standards available for derating of parts that are not application specific and often outdated. This course will discuss the part ratings, how ratings are developed, and what their implications are in selecting the use environment for parts to meet the reliability and performance requirements of the system. This course will also introduce the participants to the design, assembly, test, legal and cost issues related to uprating. To stay competitive, both technically and economically, industries may need to consider using parts whose data sheet temperature limits are not broad enough to meet the application environment. 

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Virtual Qualification and Reliability Assessment. This course will provide the attendees with the knowledge necessary to apply such a methodology to the qualification of components and the reliability assessment of electronic systems. Each section provides introduction to physics-of-failure based virtual qualification and application specific reliability assessment. The course will also demonstrate how to use manufacturer's test data together with failure modeling to qualify a component for use in a particular application and application of this virtual qualification technique to the insertion of commercial components into high-temperature, high-power, automotive, and avionic applications. 

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