Alumni

2016

Ph.D.

Yuxun Zhou (Google, CA) 
Ph.D. Mechanical Engineering 
Harmonic and Random Vibration Durability Investigation for SAC305 (Sn3.0Ag0.5Cu) Solder Joint
Advisor: Prof. Abhijit Dasgupta

Jie Gu (Syracuse University) 
Ph.D. Mechanical Engineering 
Prognostics of Solder Joint Reliability Under Vibration Loading Using Physics of Failure Approach
Prof. Michael Pecht and Prof. Donald Barker

Vinh Khuu (MITRE)
Ph.D. Mechanical Engineering 
Evaluation of Thermal Interface Materials and the Laser Flash Method
Advisor: Prof. Michael Pecht

Sachin Kumar (ICU Medical)
Ph.D. Mechanical Engineering 
Prognostic and Health Management of Electronic Products
Advisor: Prof. Michael Pecht

Leoncio Lopez (Illumina)
Ph.D. Mechanical Engineering 
Quality and Reliability of Land Grid Array Sockets
Advisor: Prof. Michael Pecht

Lei Nie (Apple, CA)
Ph.D. Mechanical Engineering
Reliability of Reballed and Reworked Ball Grid Array Packages in SNPB and SAC Assembly 
Advisor: Prof. Michael Pecht

M.S.

Alex F. Askari (U.S. Navy, MD) 
M.S. Mechanical Engineering 
Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems
Advisor: Prof. Abhijit Dasgupta

Garry Brock(CED Technologies, Inc.)
M.S. Mechanical Engineering
Reliability of Multilayer Ceramic Capacitors
Advisor: Prof. Michael Pecht

Rachel Emmel (General Dynamics - AIS)
M.S. Mechanical Engineering
Development of a Test Metohdology to Determine Dynamic Fracture Strength in Microfabricated MEMS Structures
Advisor: Prof. Donald Barker

Lyudmyla Panashchenko (NASA Goddard, MD)
M.S. Mechanical Engineering
Evaluation of Environmental Tests for Tin Whisker Assessment
Advisor: Dr. Michael Osterman

Shaughn M. Roettele (JHU-APL, MD) 
M.S. Mechanical Engineering 
Probabilistic Physics of Failure Assessment of Thermomechanical Fatigue of High-I/O Area-Array Interconnects
Advisor: Prof. Abhijit Dasgupta

Weiqiang Wang (Baker Hughes, TX) 
M.S. Mechanical Engineering 
Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages under Temperature Cycling Test
Advisor: Prof. Michael Pecht

Ph.D.

Hongbo Bi (CGGVeritas)
Ph.D. Mechanical Engineering
Development Of Displacement Measurement Technique For Nano-Scale Structures
Advisor: Dr. Bongtae Han

Arindam Goswami (Apple, CA)
Ph.D. Mechanical Engineering
Quantitative Hermeticity Assessment of Packages with Micro to Nano-Liter Cavities
Advisor: Dr. Bongtae Han

Kevin A. Moores (U.S. Department of Defense, MD) 
Ph.D. Mechanical Engineering - 2002 
Thermal and Hydrodynamic Investigation of Shrouded Pin Fin Heat Sinks With Liquid Cooling

Rui Wu (ASML Inc., CT)
Ph.D. Mechanical Engineering
Influence of Cryogenic Temperature and Microstructure on Fatigue Failure of Indium Solder Joint
Advisor: Prof. Patrick McCluskey

M.S.

Leah Pike (Johnson Space Flight Center, NASA, TX)
M.S. Mechanical Engineering

Gustavo Alberto Plaza (Schlumberger, TX) 
M.S. Mechanical Engineering
Impact of Board Pad Finish on the SNPB and Lead-Free Solder Interconnect Reliability for Leadless Chip Resistors Under Random Vibration Loading
Advisor: Prof. Michael Pecht

Ravikumar Sanapala (KLA-Tencor, India)
M.S. Mechanical Engineering 
Characterization of FR-4 Printed Circuit Board Laminates Before and After Exposure to Lead-Free Soldering Conditions
Advisor: Prof. Michael Pecht

Ph.D.

Anupam Choubey (Jet Propulsion lab, Pasadena, CA) 
Ph.D. Mechanical Engineering 
Microsturctural Changes Under Isothermal Aging and Their Influence on Thermal Fatigue Reliability for Tin-Lead and Lead-free Solder Joints, Including Microstructural Changes Under Isothermal Aging in Mixed Solder Joints
Advisor: Prof. Michael Pecht

Jon Elerath (Jon Elerath Reliability Engineering Consulting) 
Ph.D. Mechanical Engineering 
Reliability Model and Assessment of Redundant Arrays of Inexpensive Disks (RAID) Incorporating Latent Defects and Non-Homogenous Poisson Process Events
Advisor: Prof. Michael Pecht

M.S.

Dan Feng (Booz Allen Hamilton) 
M.S. Mechanical Engineering 
Optimizing Lifetime Buy Quantities To Minimize Lifecycle Costs
Advisor: Prof. Peter Sandborn

Jessica Myers (U.S. PTO) 
M.S. Mechanical Engineering 
Integration of Technology Roadmapping Information into DMSMS-Driven Design Refresh Planning of the V-22 Advanced Mission Computer
Advisor: Prof. Peter Sandborn

Brian Tuchband (Boeing, PA) 
M.S. Mechanical Engineering 
Implementation of Prognostics and Health Management for Electronic Systems
Advisor: Prof. Michael Pecht

Ph.D.

Manas Dash (GE Healthcare, MA)
Ph.D. Mechanical Engineering 
Thermo-Mechanical Durability Assessment and Microstructural Characterization Study of 95.5Pb2Sn2.5Ag High Temperature Solder
Advisor: Prof. Patrick McCluskey

Yuliang Deng (Keirton, Inc.)
Ph.D. Mechanical Engineering 
Carbon Fiber Electronic Interconnect
Advisor: Prof. Michael Pecht

Leila Jannesari Ladani (Arizona State University) 
Ph.D. Mechanical Engineering 
Damage Initiation and Evolution in Voided and Unvoided Lead Free Solder Joints Under Cyclic Thermo-Mechanical Loading
Advisor: Prof. Abhijit Dasgupta

Mohammedreza Keimasi (BD)
Ph.D. Mechanical Engineering 
Flex cracking and temperature-humidity-bias effects on reliability of multilayer ceramic capacitors
Advisor: Advisor: Prof. Michael Pecht

Yan Liu (Medtronic, Inc. - MN) 
Ph.D. Mechanical Engineering 
Reduction of Skin Stretch Induced Motion Artifacts in Electrocardiogram Monitoring Using Adaptive Filtering
Advisor: Prof. Michael Pecht

Haiyu Qi (Transamerica Financial Advisors)
Ph.D. Mechanical Engineering 
Plastic Ball Grid Array Solder Joint Reliability Assessment Under Combined Thermal Cycling and Vibration Loading Conditions
Advisor: Prof. Michael Pecht

Joseph Varghese (Google, China) 
Ph.D. Mechanical Engineering 
Drop Testing of Portable Electronic Devices
Advisor: Prof. Abhijit Dasgupta

Nikhil Vichare (Maxim Integrated) 
Ph.D. Mechanical Engineering 
Prognostics and Health management of Electronics by Utilizing Environmental and Usage Loads
Advisor: Prof. Michael Pecht

Mei-Ling Wu (National Cheng Kung University, Taiwan) 
Ph.D. Mechanical Engineering 
Dissertation: Rapid Assessment Methodology of BGA Fatigue Life under Vibration Loading
Advisor: Prof. Donald Barker

Sheng Zhan, (Baker Hughes, TX) 
Ph.D. Mechanical Engineering 
Surface Insulation Resistance Degradation and Electrochemical Migration on Printed Circuit Boards
Advisor: Prof. Michael Pecht

M.S.

Krishna Kumar Jinka (Director of Technology & Development, Mitchell & Johnson, Ltd., UK) 
M.S. Mechanical Engineering 
Thermo-mechanical Analysis of Encapsulated Ball-Wedge Wire Bonds in Microelectronics, using Raleigh-Ritz Modeling
Advisor: Prof. Abhijit Dasgupta

Shirsho Sengupta (Apple) 
M.S. Mechanical Engineering 
Effects of Solder-Dipping as A Termination Re-Finishing Technique
Advisor: Prof. Michael Pecht

Wang, Zhixiang 
M.S. Mechanical Engineering

Ph.D.

Seungmin Cho 
Ph.D. Mechanical Engineering 
Development of Moiré Interferometry for Real-time Observation of Nonlinear Thermal Deformations of Solder and Solder Assembly
Advisor: Dr. Bongtae Han

Bevin Etienne 
Ph.D. Reliability Engineering 
The Development of Cost and Size Analysis for the Assessment of Embedded Passives in Printed Circuit Boards
Advisor: Prof. Peter Sandborn

Tong Fang (Vitesse, CA) 
PH.D. Mechanical Engineering 
Tin Whisker Risk Assessment Studies
Advisor: Prof. Michael Pecht

Yuki Fukuda (Polycom Inc., TX) 
PH.D. Mechanical Engineering 
Experimental Investigations of Whisker Formation on Tin Platings
Advisor: Prof. Michael Pecht

Changwoon Han (KETI, Korea)
Ph.D. Mechanical Engineering
Shadow Moiré Using Non-zero Talbot Distance and Application of Diffraction Theory to Moiré Interferometry

Yu-Chul Hwang (Samsung, Korea) 
Ph.D. Materials and Nuclear Engineering 
Electrostatic Discharge and Electrical Overstress Failures of Non-Silicon Devices
Advisor: Prof. Michael Pecht

Sanjay Tiku (Microsoft Inc., WA) 
Ph.D. Mechanical Engineering 
Reliability Capability Evaluation for Electronics Manufacturers
Advisor: Prof. Michael Pecht

Ping Zhao (Google)
Ph.D. Mechanical Engineering 
Creep Corrosion over Plastic Encapsulated Microcircuit Packages with Noble Metal Pre-plated Leadframes
Advisor: Prof. Michael Pecht

Yunqi Zheng (General Motors Technical Center, MI) 
Ph.D. Mechanical Engineering 
Effect of Surface Finishes and imtermetallics on power Cycling Reliability of Snagcu Die Attach
Advisor: Prof. Patrick McCluskey

M.S.

Rajeev Mishra (Indian Foreign Service) 
M.S. Mechanical Engineering 
An Uprateability Risk Assessment Methodology
Advisor: Prof. Michael Pecht

Ph.D.

Nathan J. Blattau (Entrepeneur) 
Ph.D. Mechanical Engineering 
Models For Rapid Assessment of Surface Mount Component FailuresDuring Printed Wiring Board Bending
Advisor: Prof. Donald Barker

Sungyeol Cho (Intel) 
Ph.D. Mechanical Engineering 
Development of Optical Measurement Technique for Nano-Mechanics

Steve Cho (Intel) 
Ph.D. Mechanical Engineering 
Advisor: Prof. Michael Pecht

Daniel Donahoe (1000 kilometers, UT)
Ph.D. Mechanical Engineering 
Moisture in Multilayer Ceramic Capacitors
Advisor: Prof. Michael Pecht

Lin Li 
Ph.D. Mechanical Engineering 
Analysis and Mitigation of Electromagnetic Noise in Resonant Cavities and Apertures

Karumbu Nathan Meyyappan (Intel Corp., OR) 
Ph.D. Mechanical Engineering 
Failure Prediction of Wire Bonds due to Flexure
Advisor: Prof. Patrick McCluskey

Keith Rogers (U.S. Department of Defense, MD) 
Ph.D. Mechanical Engineering 
An Analytical and Experimental Investigation of Filament Formation in Glass/Epoxy Composites
Advisor: Prof. Michael Pecht

Pameet Singh (GE)
Ph.D. Mechanical Engineering 
Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Obsolescence Sensitive Sustainment-Dominated Systems
Advisor: Prof. Peter Sandborn 
M.S. Mechanical Engineering - 2001 
Design Refresh Planning Optimization Driven by Electronic Part Obsolescence

Qian Zhang (Carefusion, CA) 
Ph.D. Mechanical Engineering 
Isothermal Mechanical and Thermo-Mechancial Durability Characterizaton of Selected Pb-free Solders
Advisor: Prof. Abhijit Dasgupta

M.S.

Arvind Chandrasekaran (MBA student, UCLA) 
M.S. Mechanical Engineering 
Effect of mold compound on Au-Al wirebond-bondpad intermetallic formation
Advisor: Prof. Patrick McCluskey

Sathyanarayan Ganesan (Intel, AZ) 
M.S. Mechanical Engineering 
Virtual Design and Improved System Level Approach for Life Consumption Monitoring of Electronics
Advisor: Prof. Michael Pecht

Zhen Shi 
M.S. Mechanical Engineering 
Test of Electronic Systems Assembly

Anshul Shrivastava (CALCE-UMD, MD) 
M.S. Mechanical Engineering

Ph.D.

Leon Lantz (Department of Defense) 
Ph.D. Mechanical Engineering 
The Measurement of Ion Diffusion in Epoxy Molding Compounds Used to Encapsulate Microelectronic Devices

Thomas Stadterman (U.S. AMSAA, MD) 
Ph.D. Mechanical Engineering 
Practical Assessment Methodologies for Circuit Cards Under Mechanical Shock Loading

Ricky Valentin (University of Puerto Rico, Mayaguz, Puerto Rico) 
Ph.D. Mechanical Engineering 
A Rapid Failure Assessment Approach for Insertion Mounted Solder Interconnects Under Thermomechanical Cycling

Zhaoyang Wang (The Catholic University of America, DC) 
Ph.D. Mechanical Engineering 
Development and Application of Computer-aided Fringe Analysis
Advisor: Dr. Bongtae Han

Ji Wu (Intel, AZ) 
Ph.D. Mechanical Engineering 
Electrical Characterizaton and Reliability Assessment of Lead-Free Solder Separable Contact Interfaces

Xin Wu 
Ph.D. Mechanical Engineering 
Developing Highly Accurate and Stable Open-region Electromagnetic Simulations
Advisor: Prof. Omar M. Ramahi

Yubing Yang 
Ph.D. Mechanical Engineering 
Reliability Assessment of Optical Fibers Under Tension and Bending Loads
Advisor: Prof. Donald Barker

M.S.

Elissa Bumiller (NSWC, MD) 
M.S. Mechanical Engineering 
Electrochemical Migration on FR-4 Printed Wiring Board Surface

Derya Calhan 
M.S. Mechanical Engineering 
An Application of the 3-Parameter Weibull Distribution to the Estimation of the Failure Free Operating Period of Electronic Systems

Paul Casey (Cargill) 
M.S. Mechanical Engineering 
Managementof Lead-Free Solder Alloy Intellectual Property for Lead-Free Electronics
Advisor: Prof. Michael Pecht

Shirish Gupta (Dell, TX) 
M.S. Mechanical Engineering 
Temperature and Rate Dependent Partitioned Constitutive Relationships for 95.5PB2SN2.5AG Solder Alloy
Advisor: Prof. Patrick McCluskey

Satchidananda Mishra (Dell Computer Crop., TX) 
M.S. Mechanical Engineering 
Life Consumption Monitoring for Electronics
Advisor: Prof. Michael Pecht

Deborah Pollack (NIST) 
M.S. Mechanical Engineering 
Validity of Constitutive Properties of Mechanical Deformation Analysis of Eutectic Solder

Subramanian Rajagopal (Capital One, VA) 
M.S. Mechanical Engineering 
Transition of Low-Volume Complex Electronics System Industries to Lead-free Electronics

Anoop Rawat (Chrysler, MD) 
M.S. Mechanical Engineering 
Thermomechanical Characterization and Evaluation of Conformal Coatings

Vidyasagar Shetty 
M.S. Mechanical Engineering 
Remaining Life Assessme nt Process of Electronic Systems
Advisors: Prof. Michael Pecht, Prof. Patrick McCluskey and Prof. Peter Sandborn

Eric Stellrecht (Cobham Mission Systems) 
M.S. Mechanical Engineering 
Hygroscopic Swelling in Plastic Encapsulated Microelectronics: An Experimental Study Using Moiré Interferometry
Advisor: Prof. Michael Pecht

Niranjan Vijayaragavan (Expedia)
M.S. Mechanical Engineering 
Physics of Failure Based Reliability Assessment of Printed Circuit Boards Used Permanent Downhole Monitoring Sensor Gauges
Prof. Michael Pecht

Ph.D.

Casey O'Connor (Sensors for Medicine and Science, Inc. MD) 
Ph.D. Mechanical Engineering 
Influence of Rapid Altitude Cycling on the Reliability of Plastic Encapsulated Microcircuits
Advisor: Prof. Patrick McCluskey

M.S.

Daniel V. Becker (Northrop, MD) 
M.S. Mechanical Engineering 
Development and Application of Yielded Cost in Electronic Manufacturing Process Improvement

Harish Bhaskaran (Yale University) 
M.S. Mechanical Engineering 
Die Shear Experimental and Modeling Verification of Chip-to-Chip Bonded Microelectromechanical Systems

Vijaya B. Chebolu (Professor, Texas A&M University, TX) 
M.S. Mechanical Engineering 
Frequency-Domain Simulation of Open-Region Radiation and Scattering Problems Using the Complementary Operators Method

Advisor: Dr. Omar M. Ramahi

Jeremy Cunningham (Honeywell, AZ) 
M.S. Mechanical Engineering 
Demonstration of Physics-of-Failure Assessment of an Avionic Controller

Brent M. Mager (Systems Engineering Group, MD) 
M.S. Mechanical Engineering 
Analytic Characterization of Interconnect Shear Force Behavior

Vinay Subramanian (Goldman Sachs)
M.S. Mechanical Engineering 
Modeling and Predictions of Switching Noise in High Speed Circuts and Packages
Advisor: Dr. Omar M. Ramahi

Zeke Topolosky 
M.S. Mechanical Engineering 
Reliability Analysis of Springs Used as Interconnects in Press-Pack Power Electronic Modules

Ph.D.

Haleh Ardebili (University of Houston, TX ) 
Ph.D. Mechanical Engineering 
Moisture Diffusion and Reliability Issues Associated with Moisture in Plastic Encapsulated Microelectronics

Keita Broadwater (HP, OR) 
Ph.D. Mechanical Engineering 
Characterization and Health Monitoring of Epoxy-Cured Fiber Optic Connectors Via Fiber Optic Sensing

Richard Ciocci (Pennsylvania State University, PA) 
Ph.D. Mechanical Engineering 
Assessing the Migration to Lead-free Electronic Products

Peter L. Haswell (Hamilton Sunstrand, CT) 
Ph.D. Mechanical Engineering
Durability Assessment and Microstructural Observations of Selected Solder Alloys
Advisor: Prof. Kenneth T. Kiger

Weifeng Liu, (Flextronics) 
Ph.D. Mechanical Engineering 
Reliability Assessment of IC Component Sockets
Advisor: Prof. Michael Pecht

Nicoletta Sangalli (Cascade Engineering, WA)
Ph.D. Mechanical Engineering 
Development of Creep-Fatigue Crack Propagation Models for Solder Joint

M.S.

Jon Haase (U.S. Navy)
M.S. Mechanical Engineering
Selective Characterization of an Anisotropic Conductive Adhesive
Advisor: Prof. Abhijit Dasgupta

Samuel Bardhan (Zygo Corporation, CT)
M.S. Mechanical Engineering 
Electronics Technology Insertion into Low Volume Complex Electronic Systems (LVCES)
Advisor: Prof. Michael Pecht

Pavan Davuluri (Microsoft, WA) 
M.S. Mechanical Engineering 
A multi- scale modeling approach for stress analysis of electronic interconnects
Advisor: Prof. Abhijit Dasgupta

Deepak Gopinath (GE, MI) 
M.S. Mechanical Engineering 
Multi-Objective Placement Optimization of Power Electronic Modules on Liquid Cooled Heat Sinks

Kunal Goray (GE, Germany) 
M.S. Mechanical Engineering 
Durability of Surface mount components under flexural loads

Shantanu Kalchuri (Qualcomm, CA) 
M.S. Mechanical Engineering 
Effects of Low Temperature Power Cycling on Reliability of Power Electronic Devices
Advisor: Prof. Patrick McCluskey

Majed Majeed (University of Kuwait)
M.S. Mechanical Engineering 
Multifunctional Dual-Stiffness Sensor for Insitu Real-time Stiffness and Energy-Density

Steve Murray (Northrop Grumman, MD) 
M.S. Mechanical Engineering 
Aging and Qualification of Polyimide Dielectric Film

Jagadeesh Radhakrishnan (Intel, CA) 
M.S. Mechanical Engineering 
A Process-Based Cost of Ownership Model for Inclusion of High-Frequency Micromachined Structures in a Conventional
Advisor: Prof. Peter Sandborm

Ravi Raghavan (Hughes Network Systems, MD) 
M.S. Mechanical Engineering 
Analysis of Test/Diagnosis/Rework Operation Placement in the Technical Cost Modeling of Advanced Electrical Power System Modules
Advisor: Prof. Peter Sandborm

Arun Ramakrishnan (Broadcom)
M.S. Mechanical Engineering 
Healthand Life Consumption Monitoring Using Sensor Technologies
Advisor: Prof. Michael Pecht

Daniel Ragan (Price WaterHouse Cooper, VA) 
M.S. Mechanical Engineering 
Detail Cost Modeling for use with Hardware/Software Co-Design of a System on a Chip

Shubhada Sahasrabudhe (Intel, AZ) 
M.S. Mechanical Engineering 
Implementation and interpretation of Failure Free Operating Periods and Associated Confidence Limits in Electronic Systems Using 3-Parameter Weibull Distribution

Kontay V. Sexton (U.S. Department of Defense, MD) 
M.S. Mechanical Engineering 
Formulation of Simple Model to Assess Microvia Thermal Cycle Fatigue Life
Advisor: Prof. Donald Barker

Jaspreet Sidhu 
M.S. Mechanical Engineering 
Reliability Assessment of Thinpak Power Module for Thermal Cycling Environments
Advisor: Prof. Patrick McCluskey

Rajesh Swaminathan (Manager, Office of the CTO at Applied Materials) 
M.S. Mechanical Engineering 
Experimental and Theoretical Methods for Estimating the Delamination of MEMS Chip-to-Chip Bonded Devices in a LIGA-Based Safety and Arming System

Tobias Syrus (Schlumberger, Texas) 
M.S. Mechanical Engineering 
Refinement of Part and Manufacturer Assessment and Update to Include Discrete Passive Parts
Advisor: Prof. Michael Pecht

Dong-won Yoo (LGA, S. Korea) 
M.S. Mechanical Engineering 
Smart Thermal Management Systems Based on Solid Liquid Phase Change Materials (PCM)
Advisor: Prof. Yogendra K. Joshi

Lang Yuan (Fujitsu Network Communications, NY) 
M.S. Mechanical Engineering 
The Effect of Orientation and Imposed Circulation on the Performance of A Compact Two-Phase Thermosyphon

Ph.D.

Juscelino Hozumi Okura (Self Employed) 
Ph.D. Mechanical Engineering 
Assessment of Reliability of Low-cost Flip Chip Assembiles

C. Scott Sealing (General Electric, Corp.) 
Ph.D. Mechanical Engineering 
Accelerated Testing and Health Monitoring Methods for Electronic Circuit Cards and Electronic Box Assemblies
Advisor: Prof. Abhijith Dasgupta

Pradeep Sharma (University of Houston, TX) 
Ph.D. Mechanical Engineering 
Micro-Structural Modeling of Cyclic Creep Damage in Tin-lead Eutectic Solder

P. S. R. Shekhar (IBM Corp.) 
Ph.D. Mechanical Engineering 
Enhancement of Test-Time Compression for Thermal Cycling Based Accelerated Testing of Surface Mount electronics

Jingsong Xie (RelEng Technologies) 
Ph.D. Mechanical Engineering 
Characterization of Conductive Elastomer Button Style Integrated Circuit Component Sockets
Advisor: Prof. Michael Pecht

M.S.

James Cho (Quantum Photonics, MD) 
M.S. Mechanical Engineering 
Accelerated Thermomechancial Qualification of an Automotive Electronic Module
Advisor: Prof. Abhijith Dasgupta

Andrew Green (NSWC, VA) 
M.S. Mechanical Engineering 
Development of Edge-Card Connector Vibration Testing Device

Zhenya Huang (Fidelity Investment) 
M.S. Mechanical Engineering 
Parts Selection and Management - ASICs: A Life Cycle Perspective to Supply Chain Management and Technology Trend Analyses
Advisor: Prof. Michael Pecht

Raghuram Iyengar (Ph.D. Student at Columbia University, NY) 
M.S. Mechanical Engineering 
Investigation into New Attach Materials for Power Devices

Raj Narayan 
M.S. Mechanical Engineering 
Management and Decision Support for the Contract Manufacturing of Electronic Products

Rajesh Natarajan (Comcast, MD) 
M.S. Mechanical Engineering 
Screening of Electronic Assemblies

Srinivasan Parthasarathy (Advanced Micro Devices, CA) 
M.S. Mechanical Engineering 
Reliability of Die Attach Materials

Neeraj Pendse (Elo TouchSystems, Menlo Park, CA. )
M.S. Mechanical Engineering 
Stress Balancing: A Method of uprating and Uprating Case Studies
Advisor: Prof. Michael Pecht

Bharatwaj Ramakrishnan (Applied Materials) 
M.S. Mechanical Engineering 
Interval Estimation and Qualification for Failure Free Operating Periods in Electronic Systems
Advisor: Prof. Michael Pecht

Rajdeep Sharma (General Electric, Corp.) 
M.S. Mechanical Engineering 
A Probabilistic Methodology for Virtual QUalification
Advisor: Prof. Patrick McCluskey

Santosh Shetty (BP America, TX) 
M.S. Mechanical Engineering 
Effect of Cyclic Bending on Chip Scale Package Assemblies

Gowrishankar Subramanian (AMD, CA) 
M.S. Mechanical Engineering 
Analysis Methods for Size/Cost Tradeoffs for PWBs with Embedded Passives

Rajiv Subrahmanyam (Netapps, AZ) 
M.S. Mechanical Engineering 
The Economic Impact of Component Replacement in Electronic Systems

Thiagarajan Trichy (Oracle CA) 
M.S. Mechanical Engineering 
Full Monte Carlo Technical Cost Modeling with Detailed Test/Rework Analysis for Inclusion in a Multi-Attribute Optimization Environment 
Advisor: Prof. Peter A. Sandborn

Kang Zhang (Dell) 
M.S. Mechanical Engineering 
Reliability Assessment and Failure Analysis of Plastic Ball Grid Array

Ph.D.

Krishna Darbha (Microsoft, WA) 
Ph.D. Mechanical Engineering 
A Physics of Failure (PoF) Approach for Virtual Qualification of Area Array Interconnect Technologies
Advisor: Prof. Abhijith Dasgupta

Diganta Das (CALCE EPSC, MD) 
Ph.D. Mechanical Engineering 
Effect of thermal profile on performance and reliability of microelectronics
Advisor: Prof. Michael Pecht

Prateek J. Dujari (Intel, OR) 
Ph.D. Mechanical Engineering 
Analysis of Random Vibration on Repetitive Shock and Electrodynamic Shakers for Accelerated Fatigue of Electronic Interconnects

Chandrashekhar Ramaswamy (IBM) 
Ph.D. Mechanical Engineering 
Compact thermosyphons for passive thermal control of high heat flux electronic components

Rajeev Solomon (Raytheon, AZ) 
Ph.D. Mechanical Engineering 
Life Cycle Mismatch Assessment and Obsolescence Management of Electronic Components
Advisor: Prof. Michael Pecht

Ming Sun (Broadcom, CA) 
Ph.D. Mechanical Engineering 
Lifetime Resistance Models of Electrical Contact and Interconnect
Advisor: Prof. Michael Pecht

M.S.

Dhiraj Bansal (Spansion, CA) 
M.S. Mechanical Engineering 
Effect of Voids on Electromigration in Solder Bumps for Power Flip Chips

Michael Dean Blattau (Applied Data Systems, Inc., MD) 
M.S. Mechanical Engineering 
Evaluation of Ist Test Technology for Plated Through Hole Reliability

Mark Henry 
M.S. Mechanical Engineering 
A Methodology for Determining Root Causes of Failures due to Contamination of Electronic Assemblies
Advisor: Prof. Michael Pecht

Kofi Mensah (Intel, AZ) 
M.S. Mechanical Engineering 
Relative Reliability of Plastic and Ceramic Microelectronic Components at Elevated Temparature
Advisor: Prof. Patrick McCluskey

Aravind Ramamoorthy (Intel) 
M.S. Mechanical Engineering 
Investigation of Variable Frequency Microwave technology for rapid curing of flip chip underfills

Ramgopal Venkata Uppalapati (Applied Materials) 
M.S. Mechanical Engineering 
A Case Study Assessment of Electronic Part Manufacturers and Part Families
Advisor: Prof. Michael Pecht

Daniel Sagrario 
M.S. Mechanical Engineering 
Optoelectronic Packaging and Reliability

Dawn A. McNeil (Teledyne) 
M.S. Mechanical Engineering 
Analysis of Cannot Duplicate Failures

Cheng-Chieh Tu (Taiwan) 
M.S. Mechanical Engineering 
Effect of Exposure and Wettability of Solder on Various Board Finishes

Ph.D.

Vance H. Adams (Motorola) 
Ph.D. Mechanical Engineering 
Three-Dimensional Study of Combined Conduction, Radiation, and Natural Convection from an Array of Discrete Heat Sources in a Horizontal Narrow-Aspect-Ratio Enclosure

Kristen Marie Hines (Clark School of Engineering, UMD) 
Ph.D. Mechanical Engineering 
The Effect of Metal Vias on the Strength of Ceramic Printed Wiring Board

Lan Tang(Cisco Systems, MA) 
Ph.D. Mechanical Engineering 
A Multi-Scale, Conjugate Thermal Analysis Methodology for Convectively Cooled Electronic Enclosures

Kumar Upadhyayula (Cascade Engineering, CA) 
Ph.D. Mechanical Engineering 
An Incremental Damage Superposition Approach for Surface Mount Electronic Interconnect Durability Under Combined Temperature and Vibration Environments

M.S.

Ritesh Jain (Intel, OR) 
M.S. Mechanical Engineering 
Evaluation of Wire Bond Systems in High Temperature Electronics
Advisor: Prof. Patrick McCluskey

Young-Do Kweon (Flip Chip Technologies Inc., AZ) 
M.S. Mechanical Engineering 
Experimental degradation analysis and remaining life assessment for electronic assemblies
Advisor: Prof. Patrick McCluskey

Anant Mathur (Apple, Cupertino CA)
M.S. Mechanical Engineering 
Manufacturer, Electronic Part Quality and Integrity, and Distributor Assessment

Manpreet Nagvanshi(General Motors, MI) 
M.S. Mechanical Engineering 
Electrical and Mechanical Characterization of Particle Filled Extrinsic Polymer Composites
Advisor: Prof. Patrick McCluskey

Naveen Palli (i2, Dallas, TX)
M.S. Mechanical Engineering
An Interactive Multistage Method for Multiple Objectives Decision Making
Advisor: Prof. S. Azarm

Nivedan Tiwari 
M.S. Mechanical Engineering 
Computer Aided Design of Microelectronic Packages

Yibin Zhang (CommerceOne Inc.) 
M.S. Mechanical Engineering 
Case Studies of Semiconductor Component Reliability
Advisor: Prof. Michael Pecht

Ph.D.

Michael Cushing 
Ph.D. Reliability Engineering 
Monte Carlo Reliability Simulations Of An Electrical-Overstress Model Using Symbolic Math Tools

Sharon X. Ling (Applied Physics Laboratory, Johns Hopkins University, MD) 
Ph.D. Mechanical Engineering 
A Multi-domain Rayleigh Ritz Thermomechanical Stress Analysis Model for Surface-mount Interconnects
Advisor: Prof. Abhijith Dasgupta

M.S.

John Neel 
M.S. Mechanical Engineering 
Semi-analytic Durability Models for Surface Mount Solder Joints

Damion Searls (Intel, OR) 
M.S. Mechanical Engineering 
Uprating of Components for Use Outside Their Temperature Specifications

Hala To'mey (Applied Physics Labs, Johns Hopkins University, MD) 
M.S. Mechanical Engineering 
Qualification of IBM Laptop for Ruggedized Environment

Kellie A. Turner (ELDEC Corporation, WA) 
M.S. Mechanical Engineering 
Uprating the IBM 730TE Thinkpad Computer for use in a Public Safety Mobile Computing Environment

Donald James Walker 
M.S. Mechanical Engineering 
Circuit Card Assembly Failure Mechanism Model Handbook

Ph.D.

Rodney Martens (Harrisburg Research Center TE Connectivity) 
Ph.D. Mechanical Engineering 
Advisor: Prof. Michael Pecht

Kevin Cluff (Abbot Lab, TX) 
Ph.D. Mechanical Engineering 
Characterizing the Humidity and Thermal Environments of Commercial Avionics for Accelerated Test Tailoring

Rod Martens (FormFactor, Inc., CA) 
Ph.D. Mechanical Engineering 
Automated Contact Resistance Probe

Debabrata Pal (Hamilton Sundstrand, IL) 
Ph.D. Mechanical Engineering 
Application of Phase Change Materials to Passive Thermal Control of Electronic Modules

Enchao Yu (CFD Research Corp., AL) 
Ph.D. Mechanical Engineering 
Passive Cooling of Vented and Closed Enclosures by Natural Convection, Conduction and Radiation

M.S.

Andre Fowler (Intel, AZ) 
M.S. Mechanical Engineering 
Storage Reliability Assessment Modeling of PEMs

Anand Govind (Morgan Stanley) 
M.S. Mechanical Engineering 
Real-Time Measurement and Characterization of Deformations in Surface Mount Packages during Infra-Red Reflow Soldering

Margaret Jackson (Emergency Response Services, MD) 
M.S. Mechanical Engineering 
Developing a Part Selection Plan using Benchmarking and Other Techniques

Jill Jordan (Northrup Grumman Corp., MD) 
M.S. Mechanical Engineering 
Effectiveness of Screening Procedures

Nikhil V. Kelkar (National Semiconductor Corp., CA) 
M.S. Mechanical Engineering 
Phenomenological Reliability Modeling of Plastic Encapsulated Microcircuits

Kevin Lyons (NIST, MD) 
M.S. Mechanical Engineering 
Product Realization Process Modeling: A Study of Requirements and Needs for Successful Implementation

Anindya Poddar (National Semiconductor Corp., CA) 
M.S. Mechanical Engineering 
Development of a Ruggedized Laptop Computer for Mobile Applications
Advisor: Prof. Donald Barker

Yogendra Ranade (LSI Logic Corp., CA) 
M.S. Mechanical Engineering 
Delamination and Cracking Effects in PEMs

Timothy Rothman (Intel, CA) 
M.S. Mechanical Engineering 
Acceleration Transform Model for Leadless Solder Joint

Anand Shukla (Qualcomm) 
M.S. Mechanical Engineering 
Sorption Characterization of Laminates Used in Electronic Packaging Substrates

Vani Verma (Cypress Corp., CA) 
M.S. Mechanical Engineering 
Mechanical and Thermal Analysis of a Unit Cell of a Microbridge Uncooled Focal Plane Array Infrared Detector

Ph.D.

An-Tung Chen (National Semiconductor, CA) 
Ph.D. Mechanical Engineering 
Plated Through Hole Life Estimation in Rigid Flex Using Finite Element Analysis
Advisor: Prof. Donald Barker

Jillian Evans (D.C. Public Schools)
Ph.D. Reliability Engineering 
Effects of Thermal and Humidity Cycling on 3-D Electronic Packaging Technology 
M.S. Mechanical Engineering - 1993 
Qualification and Quality Assurance of 3-D Technology

Prasad Yalamanchili (Analog Devices, Inc., CA)
Ph.D. Mechanical Engineering 
Evaluation of Electronic Packaging Reliability Using Acoustic Microscopy

M.S.

Richard A. Bauernschub (AAI Systems, MD) 
M.S. Mechanical Engineering 
A Physics-of-failure Approach to Defect-related Reliability

Qing Yan Jenny Chen (AT&T, NJ) 
M.S. Mechanical Engineering 
Failure Mechanisms and Reliability Assessment of Optoelectronic and Electronic Packages

Gautam Ganguly (Juniper Systems, CA) 
M.S. Mechanical Engineering 
Damage Due To Lead Insertion in Through-Hole Compliant Pin Connectors

Ranjit Gannamani (Microsoft, CA) 
M.S. Mechanical Engineering 
Assembly of PEMs Without Popcorning

Ramesh Munamarty (International SOS) 
M.S. Mechanical Engineering 
Failure Mechanisms of Plastic Encapsulated Microcircuits

Tanmay Panchwagh (Icertis) 
M.S. Mechanical Engineering 
Reliability of Surface Mount Capacitor Subjected to Wave Soldering

Loren Louis Roy (Silicon Video Corp., CA) 
M.S. Mechanical Engineering 
Experimental Determination of the Shear Modulus of Compliant Adhesives Using Single Lap-Shear Tests
Advisor: Prof. Donald Barker

S. Sidharth (Microsoft Corp., WA) 
Ph.D. Mechanical Engineering 
Fatigue Life Estimation of Leads in Local Electronic Assemblies Subject to Vibration

G. B. Vasanth (Texas Instruments, TX) 
M.S. Mechanical Engineering 
Physics of Failure of Power MOSFETs

Ph.D.

Vineet K. Gupta (Delco Electronics, IN) 
Ph.D. Mechanical Engineering (Solid Mechanics) 
Modeling Solder Joint Reliability For Surface Mount Compliant Leaded Electronic Components
Advisor: Prof. Donald Barker

Choupin Huang (Analog Devices, Inc., CA) 
Ph.D. Materials and Nuclear Engineering 
Degradation Analysis and Modeling of Bi-Sb-Te(Se) Semiconductor Thermoelectric Power Modules

Sundaram Sridhar (Philips Electronics - North America Corporation, NJ) 
Ph.D. Mechanical Engineering 
Heat Transfer and Pressure Drop in Flows Perpendicular to an Offset Fin Structure

M.S.

Balu Rudra (Marvel Realtors Group) 
M.S. Mechanical Engineering 
Conductive Filament Formation in Printed Wiring Boards
Advisor: Prof. Michael Pecht

Vikram Chandra (Becton Dickinson, MD) 
M.S. Mechanical Engineering 
Computer Tools for Reliability Modelling and Assessment of Microelectronic Packages
Advisor: Prof. Michael Pecht

Anupam Malhotra (Connected Vehicles & Data) 
M.S. Mechanical Engineering 
Standard Program for Reliable Product Development

Ashok S. Prabhu (Innovation Coach) 
M.S. Mechanical Engineering 
Stress Analysis of the G.E. High Density Interconnect

Seshadri Vikram (National Semiconductor, CA) 
M.S. Mechanical Engineering 
Correlation of Natural Convection Heat Transfer from a Horizontal Printed Circuit Board in an Enclosure

Ph.D.

Ten-ken Hwang (Synergies Sourcing Agency) 
Ph.D. Materials and Nuclear Engineering 
Monte Carlo Reliability Model for Monolithic Microwave Integrated circuits (MMICs)
Advisor: Prof. Michael Pecht

Pradeep Lall (Auburn University, AL) 
Ph.D. Mechanical Engineering 
The Influence of Temperature on Microelectronic Device Failures

Xin Wu (Corona Optical Systems, IL) 
Ph.D. Mechanical Engineering 
An Experimental Study of Polyimide Films Used in High Density Interconnects
Advisor: Prof. Michael Pecht

M.S.

Christopher W. Argento (Motorola, TX) 
M.S. Mechanical Engineering 
Forced Convection Air Cooling of a Commercial Electronic Chassis: Experiments and Computations

Shrikar Bhagath (SanDisk, CA) 
M.S. Mechanical Engineering 
Mechano-Stochastic Modeling of Connector Reliability
Advisor: Prof. Michael Pecht

Kamran Gohari (Thomas & Betts) 
M.S. Mechanical Engineering 
Effect of Temperature and Humidity Cycling on FR-4, BT and CE Printed Wiring Boards

Jong-Shyang Kuo (Lockheed-Martin, CA) 
M.S. Mechanical Engineering 
Temperature Dependent Performance Simulation and Failure Mechanisms of Heterostructure Field Effect Transistors and Inverter Circuits

Barry Mathieu (Raytheon Co., MD) 
M.S. Mechanical Engineering 
Stress Analysis of Glass Lead Seals Under General Mechanical Loading

Vijay Ramappan (Ford Motor Corp., MI) 
M.S. Mechanical Engineering 
A Numerical Simulation of Selected Manufacturing Variabilities in Plated Through Holes
Advisor: Prof. Abhijit Dasgupta

Ph.D.

Rakesh K. Agarwal (BP America Inc.) 
Ph.D. Mechanical Engineering 
Prediction of Thermal, Dielectric and Thermo-Mechanical Properties of Woven-Fabric Composites for PWB Substrate Materials
Advisor: Prof. Michael Pecht and Prof. Abhijit Dasgupta

Sarvotham M. Bhandarkar(Navin) (National Semiconductor: Packaging & Process Development Division, Singapore) 
Ph.D. Mechanical Engineering 
Thermomechanical Analysis and Fatigue Life Prediction of Multilayer PWB PTHs

Yeong-Shu Chen (NJIT, NJ) 
Ph.D. Mechanical Engineering 
Predicting the Vibration Fatigue Lives of Electronic Components Mounted on a Printed Wiring Board

Chandrasekhar Pusarla (Cisco) 
Ph.D. Mechanical Engineering 
Design Guidelines for Flip-Chip Bonding for Hermetic Microelectronic Packages
Advisor: Prof. Michael Pecht

M.S.

Ajay K. Arora (Visteon Automotive Systems, MI) 
M.S. Mechanical Engineering 
Design Guidelines for Lid Seals and Lids of Hermetic Microelectronic Packages
Advisor: Prof. Michael Pecht

Sudha Balakrishnan (Voltas Limited)
M.S. Mechanical Engineering 
A Concurrent Approach to Printed Wiring Board Assembly Design

Gary Bonadies (Westinghouse, MD) 
M.S. Mechanical Engineering - 1992 
A Computer Integrated Product Development Environment: An Implementation of Concurrent Engineering for the Conceptual Design of Electronic Systems
Advisor: Prof. Michael Pecht

David Harris (SpaceX) 
M.S. Mechanical Engineering 
Fuzz Button Design Variation and Performance Effects
Advisor: Prof. Michael Pecht

Scott David Johnson (Westinghouse, MD) 
M.S. Mechanical Engineering 
Experimental Determination of Mechanical Properties of Single Crystal Gallium Arsenide (GaAs) Wafers
Advisor: Prof. Donald Barker

Douglas Lawton (Lawton Rogers, LLC) 
M.S. Mechanical Engineering 
Interface Heat Transfer and Wedgelock Assemblies
Advisor: Prof. Michael Pecht

Nabil Mofid (Piemont, NC) 
M.S. Mechanical Engineering 
Transient Thermal Stress Analysis of Surface Mounted MLC Capacitors Subjected to Wave Soldering

Shailendra Verma (Fourth Partner Energy) 
M.S. Mechanical Engineering 
Screening Guidelines for Electronics at the Assembly Level
Advisor: Prof. Michael Pecht

Zhan Zhang (Life Science Advanced Technologies) 
M.S. Mechanical Engineering 
Project Planning and Scheduling in a Concurrent Engineering Environment
Advisor: Prof. Michael Pecht

Lily Hui Zhu (NIST, MD) 
M.S. Electrical Engineering 
High Temperature Modeling and Thermal Characteristics of GaAs Mesfets on Diamond Heat Sinks

M.S.

Paul Eric Biegel 
M.S. Mechanical Engineering 
A Framework for Decision Support in Concurrent Product Development
Advisor: Prof. Michael Pecht

Gregory C. Braunberg (iDirect Technologies) 
M.S. Mechanical Engineering 
Computer Aided Infrared Thermography Using Emissivity Compensated Imaging
Advisors: Prof. James W. Dally and Prof. Michael Pecht

Wing Fu Ko (Hong Kong) 
M.S. Mechanical Engineering 
A Systems Engineering Approach to Design a Smart Tool Post Structure

Syed Ali Naved Naqvi (Citi)
M.S. Mechanical Engineering 
Transient Thermal Stress Analysis of Plated Through Holes Subjected to Wave Soldering
Advisor: Prof. Michael Pecht

Michael Osterman (CALCE EPSC) 
Ph.D. Mechanical Engineering 
Placement Methods for Electronic Components on Printed Wiring Boards Based on Reliability and Routability Measures 
M.S. Mechanical Engineering - 1987 
Component Placement for Reliability and Routability
Advisor: Prof. Michael Pecht

Hugh Steven Reinhart (Mackson Consulting)
M.S. Mechanical Engineering 
Automated Maintanability (M) Modeling and Analysis
Advisor: Prof. Michael Pecht

Scott A. Roza 
M.S. Mechanical Engineering 
Vibrational Modeling of Wedge-lock Edge Guides

Irfan Sharif 
M.S. Mechanical Engineering 
Effect of Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life

Jieyu She (Pan America)
M.S. Mechanical Engineering 
A New Algorithm for Evaluating Complex System Reliability
Advisor: Prof. Michael Pecht

John Vodzak (Crate and Barrel)
M.S. Mechanical Engineering 
Coupled Thermal and Vibrational Fatigue Analysis of Solder Joints for Surface Mounted Components
Advisor: Prof. Michael Pecht

Jonathon David Watts (nMetric, LLC)
M.S. Mechanical Engineering 
Placement for Producibility and Assembly
Advisor: Prof. Michael Pecht

M.S.

Amir Afzali (Amkor) 
M.S. Mechanical Engineering 
Contamination Induced Failures in Microelectronic Packages

Harry Joseph Hoffman 
M.S. Mechanical Engineering 
Application of the Hopkinson Split Bar to Gun Propellant Testing

Sohail Ahmad Khan 
M.S. Mechanical Engineering 
A Constitutive Stress-Strain Model for Linerboard Under Various Constant Moisture and Temperature States

Prathviraj Rao (Manipal Technologies Limited)
M.S. Mechanical Engineering 
Application of Infrared Thermography for Quantitative Detection of Surface Flaws
Advisor: Prof Michael Pecht

Stewart Genberg
M.S. Mechanical Engineering 
Advisor: Prof Michael Pecht

Mohammad Salman (Synergies Sourcing Agency)
M.S. Mechanical Engineering 
Advisor: Prof Michael Pecht

Ahmer Syed (Amkor) 
M.S. Mechanical Engineering 
Vibration Analysis of Printed Wiring Boards

Pradeep Lall (Auburn University) 
M.S. Mechanical Engineering 
Wire and wire bond failures in microelectronic packages

M.S.

Cheryl Lynn Resch (John Hopkins University, Applied Physics Labs, MD) 
M.S. Mechanical Engineering 
Calculation and Measurement of Temperature Profiles of Electronic Printed Wiring Boards
Advisor: Prof. Michael Pecht

Yeun Tsun Wong (Fuji Xerox Singapore) 
M.S. Mechanical Engineering 
Steiner Tree Oriented Placement
Advisor: Prof. Michael Pecht

Syed Hassan (CGI) 
M.S. Mechanical Engineering 
Advisor: Prof. Michael Pecht

Amir Afzali (Southern Company Services) 
M.S. Mechanical Engineering 
Advisor: Prof. Michael Pecht

Hong Fang (Boston University) 
M.S. Mechanical Engineering 
Advisor: Prof. Michael Pecht

Gajanan Deshmukh (Moldtek Technologies, Inc.) 
M.S. Mechanical Engineering 
Advisor: Prof. Michael Pecht

Lakshmi Chandrabhatla 
M.S. Mechanical Engineering 
Advisor: Prof. Michael Pecht

M.S.

Timothy Mason Johnson 
M.S. Mechanical Engineering 
High Strain Rate Testing of Cement Paste with a Split Hopkinson Pressure Bar

Srinibas Praharai 
M.S. Mechanical Engineering 
Advisor: Prof. Michael Pecht

Dar-Zen Chen (National Taiwan University) 
M.S. Mechanical Engineering 
Advisor: Prof. Michael Pecht