Office: (301)-405-8725
Lab: (301)-405-5471
Dr. Sukrut Prashant Phansalkar joined the Department of Mechanical Engineering as an Assistant Research Professor in September 2026. He earned his Ph.D. in Mechanical Engineering in 2024, conducting his doctoral research in the Laboratory for Optomechanics and Micro/nano Semiconductor Systems (LOMSS) under the guidance of Prof. Bongtae Han. Following his Ph.D., he continued at UMD as a postdoctoral researcher. He also holds a Master of Technology (M.Tech.) in thermal engineering and a Bachelor of Technology (B. Tech) from the Indian Institute of Technology (IIT) Kharagpur, awarded in 2018.
Dr. Phansalkar’s research focuses on the mechanical characterization and numerical modeling of polymeric materials used in advanced electronic packaging technologies, including fan-out wafer-level packaging (FO-WLP) and heterogeneous integration. His work aims to improve the understanding of material behavior, reliability, and thermo-mechanical performance in next-generation microelectronic and semiconductor packaging systems.
He has authored or co-authored 11 journal publications and 18 conference papers. His research contributions have been recognized through several awards and fellowships, including the ECTC Student Travel Award in 2024, the Irwin Centennial Research Award in 2022, and Dean’s Research Fellowships in 2020 and 2022.
Some of his Publications:
Warpage Prediction After Compression Molding Using Cure-dependent Viscoelastic Properties, Sukrut Prashant Phansalkar and Bongtae Han , 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), doi: doi.org/10.1109/ECTC51846.2026.00257
Characterization of Young’s and Bulk Equilibrium Modulus Evolution of Filled Thermoset During Curing, Sukrut Prashant Phansalkar, and Bongtae Han, Mechanics of Materials, Volume 219, Available online 1 May 2026, doi: doi.org/10.1016/j.mechmat.2026.105714.
Transitioning from Warpage "Control" to Warpage "Design": A Paradigm Shift, Sukrut Prashant Phansalkar, Bongtae Han, and Gun Lee, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 4, pp. 743-746, April 2024, DOI: doi.org/10.1109/TCPMT.2024.3382133.
Novel Test Method To Measure Time-cure Superposition Shift Factors of Filled-Thermoset Under Isocure Testing Conditions, Sukrut Prashant Phansalkar and Bongtae Han, Journal of Materials Science, 03 February 2026, doi: 10.1007/s10853-026-12287-w.
Time-dependent Bulk Behavior of Cured Epoxy Molding Compound, Sukrut Prashant Phansalkar, Roshith Mittakolu, and Bongtae Han, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 2093-2100, DOI: 10.1109/ECTC51909.2023.00358.
Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, Ran Tao, Sukrut Prashant Phansalkar, Aaron M. Forster, and Bongtae Han, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1319-1326, DOI: 10.1109/ECTC51909.2023.00225.
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