With electronics being use in every widening applications, the ability of electronics survive in harsh environments is becoming increasingly important. Recent financial forecasts indicate strong growth for materials used to protect electronics from corrosion. CALCE corrosion research is focused on
- Issues with Witness Coupons
- Comparison of MFG Tests
- Effectiveness of Conformal Coat to Prevent Corrosion
- Assessment of ENEPIG and ImAg Surface Finishes under Mixed Flowing Gas Test Environment
Influence of Varying H2S Concentration and Humidity Levels on ImAg and OSP Surface Finishes, Amer Charbaji, Michael Osterman, and Michael Pecht, International Journal of Mechanical Engineering and Technology (IJMET), December 2015.
Impact of Dust on Printed Circuit Assembly Reliability, Bo Song, Michael H. Azarian and Michael G. Pecht, Proc. of IPC Apex Expo Conference, San Diego, CA, Feb. 2012.
An Evaluation of the Insulation Resistance and Surface Contamination of Printed Circuit Board Assemblies, Xiaofei He, Michael H. Azarian, Mark Kostinovsky, and Michael G. Pecht, Proc. of IPC Apex Expo Conf., San Diego, CA, Feb. 2012.
Corrosion of ImAg-Finished PCBs Subjected to Elemental Sulfur Environments, S. Zhang, R. Kang, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 11, No. 3, pp. 391-400, September 2011.
The Influence of H2S Exposure on Immersion-Silver-Finished PCBs Under Mixed-Flow Gas Testing, S. Zhang, M. Osterman, A. Shrivastava, R. Kang and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol.10, No.1, pp. 71-81, March 2010.
, Shuang Yang, Ji Wu and Michael G. Pecht , IEEE Transactions on Reliability, Vol. 58, No. 4, pp. 634-640, December 2009.
, Y. Zhou and M. Pecht, 55th Annual IEEE Holm Conference, Vancouver, British Columbia, Canada, pp. 321-330, September 14-16, 2009.
, Shunong Zhang, Michael Osterman, Anshul Shrivastava, Rui Kang and Michael G. Pecht, International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09., Vol., No., pp 116-122, August 10-13 2009, DOI: 10.1109/ICEPT.2009.5270782.
, P. Zhao, M. Pecht, S. Kang, and S. Park, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 4, pp. 818-826, December, 2006.
, P. Zhao, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 5, No. 2, pp. 268-276, June 2005.
, J. Xie and M. Pecht, Advanced Packaging, pp. 39-42, February 2001.
, J. Xie, M. Pecht, D. Barbe, S. Das, J. Nuebel, and B. Zand, IEEE Transactions on Electromagnetic Compatibility, Vol. 42, No. 1, pp. 71-76, February 2000.
, J. Xie, M. Pecht, S. Das, J. Nuebel, and B. Zand, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 136-142, March 2000.
, S. Das, J. Neubel, B. Zand, D. Hockanson, J. Xie, and M. Pecht, the 1998 IEEE International Symposium on Electromagnetic Compatibility, pp. 1041-1046, Denver CO, August 1998.
M. Sun, S. Javadpour, R. Martens, and M. Pecht, Proceeding of 30th International Connector & Interconnection Technology Symposium 1997, USA, pp. 227-244, 1997.
, S. Bhagath and M. Pecht, ASME Journal of Electronic Packaging, Vol. 115, pp. 404-409, Dec. 1993.
, A. Christou, X. Shan, and M. Pecht, International Journal of Microcircuits and Electronic Packaging, Vol. 15, No. 1, First Quarter 1992.
, M. Pecht and W. Ko, The International Journal for Hybrid Microelectronics, Vol. 13 (2), pp. 41-52, June 1990.
, M. Pecht, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13 (2), pp. 383-389, June 1990.