CALCE has had the honor of working with some of the leading organizations in the world through CALCE Consortia memberships, research contracts, and test and analysis services.

  • ABB Switzerland Ltd
  • ACell, Inc.
  • ADC
  • Advanced Bionics
  • Airpax
  • Agilent Technologies
  • Alcatel-Lucent
  • America II Electronics, Inc.
  • American Competitiveness Institute
  • Amkor
  • Amphenol
  • Anadigics, Inc
  • Ansaldo STS USA, Inc.
  • Apple Computer
  • Arbitron
  • Arcelik, Turkey
  • ARINC Engineering Services
  • ASC Capacitors
  • ASCO, China
  • ASE
  • Astec, China
  • Astronautics
  • Atlantic Inertial Systems
  • ATV Semapp
  • Austria Microsystems AG
  • Avaya Global Operations
  • AVI
  • Axsys Engineering
  • AXSYS Technologies
  • BAE Systems
  • Baker Hughes Inc.
  • Bartlit Beck Herman Palenchar & Scott LLP
  • BATELLE
  • Beijing Weibu Technology Limited Liability Company
  • Bio Assay Works
  • Blue Wave Semiconductors
  • BMP Center of Excellence
  • Boeing Co.
  • Bombardier Aerospace
  • Bose
  • Bosch
  • Branson Ultrasonics
  • Brooks Instruments
  • Brush Wellman Inc.
  • Broadwing
  • Calient Optical Components
  • CAPE, China
  • Capricorn Pharma
  • Cascade Engineering Services
  • Caterpillar
  • Celestica International
  • CEPREI Laboratory
  • Chrysler Corp.
  • CIC VIRTUHCON - the Group 'Interphase Phenomena'
  • CISCO Systems
  • Club Car Ingersoll-Rand, Inc.
  • Cochlear, Ltd.
  • Compressor Electronics
  • ConnNtext Associates
  • Cornell University
  • Crane Aerospace & Electronics
  • Curtiss-Wright, Canada
  • Daimler, Germany
  • Daktronics Inc.
  • De Brauw Blackstone Westbroek
  • Defense Logistics Agency, UK
  • Defense Microelectronics Activity
  • Dell Computer Corp.
  • Della
  • Dow Chemical Co.
  • Dow Solar Solutions
  • DRS EW Network Systems
  • DRS Technologies
  • DSO National Laboratories
  • Dynamic Details Incorporated
  • EACEVI Technology
  • EADS IW
  • EIT
  • Electrospec, Inc.
  • Embedded Computing & Power
  • EMBRAER S.A.
  • EMC Corporation
  • Emcore Corporation
  • Emerson Advanced Design
  • Emerson Electric
  • Emerson Energy
  • Emerson Appliance Controls
  • Emerson Motors
  • Emerson Network Power
  • Emerson Process Management
  • Energetics Technology Center (ETC)
  • Ericsson AB, Sweden
  • Engent
  • Essex Corporation
  • European Aeronautic Defense and Space CCR-Airbus, France
  • Exponent
  • Fairchild Controls
  • Filtronic Comtek
  • Flextronics
  • Food and Drug Administration
  • Foxconn
  • Frontier Technology
  • Fujitsu Network Communications
  • General Dynamics Advanced Information Systems
  • General Dynamics Land Systems
  • General Electric
  • General Electric Healthcare
  • General Electric Aviation
  • General Electric Faunc
  • General Electric Intelligent Platforms
  • General Electric Research
  • General Electric Oil & Gas
  • General Motors
  • Guideline
  • Gentag
  • Goodrich (Engine Control Systems, UK)
  • Goodwin Procter
  • Guardian Global Technologies Ltd.
  • Hamlin Electronics Europe
  • Hamilton Sundstrand
  • Harris Corporation
  • HDP User Group
  • Henkel
  • HP Inc.
  • Hewlett Packard Enterprise
  • Honda
  • Honeywell
  • Howrey, LLP
  • Huawei, China
  • IBM
  • iDirect
  • Impact Technologies
  • Infineon
  • In-Sink-Erator
  • Instit. Nokia de Tecnologia, Brazil
  • Intel
  • Intellipark LLC
  • Itron
  • John Deere
  • Johns Hopkins University
  • JDSU-Communications Test
  • Johns Hopkins University-Advanced Physics Laboratory
  • Johnson and Johnson
  • Jones Day
  • Juniper
  • Kemet Corp.
  • Keysight
  • Kimball Electronics
  • Kostal
  • L-3 Communications
  • L3 Telemetry East
  • Laird Technologies
  • Lansmont Corporation
  • LeBarge
  • LG Electronic, Inc.
  • Littelfuse Inc.
  • Little Optics Division, Nomadics
  • Liebert Power and Cooling
  • Lockheed Martin
  • Lucent Technologies
  • Lutron
  • M&T Co.( Division of CDI Government Services)
  • MacDermid
  • Magna Donnelly Electronics
  • Man & Machine Inc.
  • Maxion Technologies
  • Medtronic Incorporated
  • MEI - Supply Engineering
  • Microsemi
  • Microsoft
  • Milord Technology Ltd
  • MIT Lincoln Laboratory
  • MKS Instruments
  • Mobile Digital Systems
  • Motorola
  • Moog Inc.
  • MSA
  • MTEC
  • Munger, Tolles & Olson LLP
  • n-Code
  • NASA Glenn Research Center
  • NASA Goddard Space Flight Center
  • National Oilwell Varco
  • National Transportation Safety Board
  • Naval Surface Warfare Center
  • Neltek
  • Netapp
  • Nevro
  • NIC Components
  • Nokia, Finland
  • Nokia Siemens Network, Finland
  • Nordostschweizerische Kraftwerke AG (NOK)
  • nCode International
  • Northrop Grumman
  • National Transportation Safety Board
  • NXP Semiconductors
  • Oak Mitsui
  • Oracle America
  • Ortho Clinical Diagnostics
  • Paratek Microwave
  • Park Electrochemical Corp.
  • Pennsylvania State University (CISP, P/M Lab)
  • PCO Integrated Warfare Systems
  • Petra Solar
  • PEO Integrated Warfare
  • Philips Applied Technologies
  • Philips Electronics, The Netherlands
  • Philips Medical Systems
  • Philips Lighting Systems
  • Physio-Control Corp.
  • Pole Zero
  • Potomac Photonics
  • Practical Engineering
  • Pressurebiosciences
  • Qualmark
  • RadiSys
  • Rain Bird
  • Raytheon
  • Regal Beloit
  • ReliaSoft Corporation
  • Research in Motion, Ltd., Canada
  • Respironics
  • Reactive Nano Technology
  • Roadtrack
  • Robert Bosch
  • Rockwell Collins (Rockwell Automation)
  • Rolls-Royce Submarines
  • Rolls-Royce Engine Control Systems Ltd.
  • Rosemount
  • Rudolf Engineering
  • Saab Avitronics, Sweden
  • Samsung Electro-Mechanics, Korea
  • Samsung Electronics Co.
  • Samsung Mechatronics & Manufacturing Technology, Korea
  • Samsung Memory, Korea
  • Samsung Techwin Co., Ltd., Korea
  • Sandia National Labs
  • Sandisk
  • Savenia Labs.
  • S.C. Johnson Wax
  • Schlumberger WesternGeco AS
  • Schlumberger Oil Drilling Services
  • Schweitzer Engineering Labs
  • Science Application International Corporation (BD SYSTEMS)
  • Science Research Laboratory
  • Seagate Technology
  • Selex-SAS
  • Sensor Com
  • Sensors for Medicine and Sciences
  • Silicon Powers
  • Silicon Valley Expert Witness Group
  • SiliconExpert Technologies
  • Skyworks
  • SolarEdge Technologies, Israel
  • SORAA
  • Souriau
  • Space Systems Loral
  • Stanford University
  • Starkey Laboratories
  • Stratasys, Inc.
  • Sun Microsystems
  • Superconductor Technologies
  • Super Micro Computer, Inc.
  • Sychip
  • Symbol Technologies
  • Team Corporation
  • Team Pacific
  • Tech Film
  • Tekelec
  • Telcare, Inc.
  • TEMIC Servicios
  • Teradyne
  • Tessera
  • The Bergquist Company
  • The University of Michigan
  • Tin Technology
  • Tintronics Industries
  • Tollgrade Communications
  • Toshiba, Japan
  • Toyota Research Institute of N.A.
  • Trace Laboratories
  • TRW Automotive, UK
  • TruePosition
  • TUBITAK SPACE Tech. Research Institute, Turkey
  • TU CIC Virtuhcon
  • U.K. Ministry of Defense
  • University of Dayton Research Institute
  • U.S. Army
  • U.S. Army Armament Research Development Engineering Center
  • U.S. Army CECOM
  • U.S. Army Material Systems Analysis Activity
  • U.S. Army Research Lab
  • U.S. Army Preventive Maintenance Checks and Services
  • U.S. Air Force
  • U.S. AMSAA
  • U.S. Naval Surface Warfare Center
  • Unison Industries
  • United Technology Aerospace
  • Universal Lighting Technologies
  • UVA
  • Vectron
  • Vertiv
  • Vestas Wind System, Denmark
  • Virginia Tech
  • Vitesse
  • Weil Gotshal & Manges LLP
  • Whirlpool
  • White Rogers
  • WiSpy
  • Woodward Governor
  • Zentech Manufacturing

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