Life Cycle Trends of Electronic Materials, Processes and Components, Chien-Ming Huang, Jose A. Romero, Michael Osterman, Diganta Das, and Michael Pecht, Microelectronics Reliability, Vol. 99, pp. 262-276, August, 2019 DOI: 10.1016/j.microrel.2019.05.023.
Development of a Microvia Fatigue Life Model Using a Response Surface Method, Yan Ning, Michael Azarian, and Michael Pecht, IEEE Access, Preprint, February 7, 2019, DOI: 10.1109/TDMR.2019.2898179.
Prediction and Mitigation of Vertical Cracking in High Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation, H. Greve, S. A. Moeini, P. McCluskey, and S. Joshi, Journal of Electronic Packaging, 140(2), 020903. (2018). BEST PAPER OF THE YEAR FOR J. ELECT. PKG.
Novel Silver Die Attach Technology on Silver Pre-Sintered DBA Substrates for High Temperature Applications, S. Nishimoto, S.A. Moeini, T. Ohashi, Y. Nagatomo, and P. McCluskey, Microelectronics Reliability, 87, pp. 232-237. (2018) DOI: 10.1016/j.microrel.2018.06.010
Viscoplastic properties of pressure-less sintered silver materials using indentation, D. Leslie, A. Dasgupta, Carlos Morillo, Microelectronics Reliability 74 (2017) 121–130
Reliability of Conformal Coated Surface Mount Packages, Deng Yun Chen and Michael Osterman, IEEE 2016 Accelerated Stress Testing and Reliability (ASTR) Conference, September 28-30, 2016, Pensacola, Florida.
Reliability of Corner Staked Surface Mount Packages, Deng Yun Chen and Michael Osterman, IEEE 2016 Accelerated Stress Testing and Reliability (ASTR) Conference, September 28-30, 2016, Pensacola, Florida.
Creep fatigue models of solder joints: A critical review, E.H. Wong, W.D. Van Driel, A. Dasgupta, and M. Pecht,Microelectronics Reliability, Vol. 59, pp 1-12, April 2016, DOI:10.1016/j.microrel.2016.01.013.
Effect of gold and copper in AUSN4 deposition and isothermal durability of SAC305 solder joints, Subhasis Mukherjee, Carlos Morillo, Lay-Ling Ong, Julie Silk and Abhijit Dasgupta, Surface Mount Technology Association, Vol 29, Issue 1, 20-30, March 2016.
Probabilistic lifetime prediction of electronic packages using advanced uncertainty propagation analysis and model calibration, Hyunseok Oh, Hsiu-Ping Wei, Bongtae han and Byeng D. Youn, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol 6, No 2, 238-248, February 2016.
Remaining-Life Prediction of Solder Joints Using RF Impedance Analysis and Gaussian Process Regression , Daeil Kwon, Michael H. Azarian, and Michael G. Pecht, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 5, No. 11, November 2015.
Thermal Fatigue Reliability Analysis and Structural Optimization Based on a Robust Method for Microelectronics FBGA Packages, Yi Wan, Hailong Huang, and Michael G. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 15, Issue. 2, PP. 206-213, 2017, DOI: 10.1109/TDMR.2015.2417888.
Effects of Voiding on Thermomechanical Reliability of Copper-Filled Microvias: Modeling and Simulation, Yan Ning, Michael Azarian, and Michael Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 15, PP. 500-510, No. 4, December 2015.
Thermal cycling reliability of Sn-Zn lead-free solders in sensor application, M. Mostofizadeh, D. Das, M. Pecht, and L. Frisk, IEEE 65th Electronic Components and Technology Conference (ECTC), 2015.
Characterization of die-attach thermal interface of high-power light-emitting diodes: An inverse approach, Dae-Suk Kim, Bongtae Han and Avram Bar-Cohen, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol 5, No 11, 1635-1643, November 2015.
Evaluation of ENEPIG and Immersion Silver Surface Finishes Under Drop Loading, Adam Pearl, Michael Osterman, and Michael Pecht, Journal of ELECTRONIC MATERIALS, @ 2015 The Minerals, Metals & Materials Society, DOI: 10.1007/s11664-015-4104-y.
Evaluating the Impact of Dwell Time on Solder Interconnect Durability under Bending Loads, Sandeep Menon, Michael Osterman and Michael Pecht , Journal of Electronic Materials. DOI: 10.1007/s11664-015-3931-1.
Assessing the value of a lead-free solder control plan using cost-based FMEA, P. Sandborn, Edwin Lillie and David Humphrey Microelectronics Reliability, Vol. 55, No. 6, pp. 969-979, May 2015.
Influence of Plating Quality on Reliability Microvias, Yan Ning, Michael Azarian, and Michael Pecht , IPC APEX EXPO Conference Proceedings, February, 2015.
An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model, Elviz George, Michael Osterman and Michael Pecht , Microelectronics Reliability 55, pp 582-587, Feb - March 2015, DOI:10.1016/S0026-2714(15)00039-6.
High Lead (over 85 %) Solder in the Electronics Industry: RoHS Exemptions and Alternatives, Sandeep Menon, Elviz George, Michael Osterman and Michael Pecht , Journal of Materials Science: Materials in Electronics, March 4 2015, DOI: 10.1007/s10854-015-2940-4
Effects of Voiding on the Degradation of Microvias in High Density Interconnect Printed Circuit Boards Under Thermomechanical Stresses, Roozbeh Bakhshi, Michael H. Azarian, and Michael G. Pecht , IEEE Transactions of Components, Packaging and Manufacturing Technology, Vol. 4, No. 8, August 2014.
LT-TLPS Die Attach for High Temperature Electronic Packaging, H. Greve, and F. P. McCluskey, J. Microelectronics and Electronic Packaging, Vol.11 No. 1, pp. 7-15. (2014)
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias , Yan Ning, Michael Azarian, and Michael Pecht , 2014 IPC APEX EXPO Conference Proceedings, February, 2014.
Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders, Elviz George, Michael Pecht, Michalel Osterman, Richard Coyle, Richard Parker and Elizabeth Benedetto ,Journal of Microelectronis and Electronic Packaging (2014) 11, 137-145.
Review of Capabilities of the ENEPIG Surface Finish, Menahem Ratzker, Adam Pearl, Michael Osterman, Michael Pecht and George Milad, Journal of Electronic Materials, Volume 43, pp 3885-3897, November 2014, DOI: 10.1007/s11664-014-3322-z.
Mapping Mechanical Properties of Lead-Free Solder Joints, Carlos Morillo, Jennifer L. Hay and Julie Silk, Proceedings of SMTA International, September 28 - October 2, 2014, Rosemont, IL.
Effects of Voiding on the Degradation of Microvias in High Density Interconnect Printed Circuit Boards Under Thermomechanical Stresses, Roozbeh Bakhshi, Michael H. Azarian and Michael G.Pecht, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, Issue 8, pp 1374-1379, August 12, 2014, DOI: 10.1109/TCPMT.2014.2322105.
In Situ Interconnect Failure Prediction Using Canaries , Preeti Chauhan, Sony Mathew, Michael Osterman and Michael Pecht, IEEE Transactions On Device and Materials Reliability, Vol. 14, No. 3, pp 826-832, September 2014, DOI: 10.1109/TDMR.2014.2326184.
Experiment and Simulation of Board Level Drop Tests With Intentional Board Slap at High Impact Accelerations, Stuart T. Douglas, Moustafa Al-Bassyiouni, and Abhijit Dasgupta, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, No. 4, pp 569-580, April 2014, DOI:10.1109/TCPMT.2013.2293761.
Strain-Range-Based Solder Life Predictions Under Temperature Cycling With Varying Amplitude and Mean, Fei Chai, Michael Osterman and Michael Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 14, No. 1, pp 351-357 March 2014, DOI:10.1109/TDMR.2013.2273121.
Board level reliability analysis of chip resistor assemblies under thermal cycling: A comparison study between SnPb and SnAgCu , Changwoon Han and Bongtae Han, Journal of Mechanical Science and Technology, Vol 28, Issue 3, 879-886, 2014.
Strength and Reliability of High Temperature Transient Liquid Phase Sintered Joints, S. Ali Moeini, Hannes Greve and F. Patrick McCluskey, HiTEC Conference, (January 2014) pp. 000355-000363
Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications, P. Quintero, P. McCluskey, and B. Koenei, Microelectronics Reliability, Vol. 54, Issue 1, pp 220-225, January 2014, DOI:10.1016/j.microrel.2013.08.002.
Modeling the Rate-Dependent Durability of Reduced-Ag SAC Interconnects for Area Array Packages Under Torsion Loads ,Vikram Srinivas, Sandeep Menon, Michael Osterman and Michael G. Pecht, Journal of ELECTRONIC MATERIALS, Vol. 42, No. 8, 2013.
The effect of joint size on the creep properties of micro-scale lead-free solder joints at elevated temperatures, Limeng Yin, Song Wei, Zhangliang Xu, Yanfei Geng , Diganta Das and Michael Pecht, Journal of Materials Science: Materials in Electronics, Vol. 24, Issue 4, pp 1369-1374, April 2013, DOI:10.1007/s10854-012-0936-x.
Thermal Cycling Reliability of Alternative Low-Silver Tin-based Solders, Elviz George, Michael Osterman, Michael Pecht, Richard Coyle, Richard Parker, and Elizabeth Benedetto, 46th International Symposium on Microelectronics, Orlando, September 30 - October 3, 2013.
Effect of ENEPIG Surface Finish on the Vibration Reliability of Solder Interconnects, Sandeep Menon, Adam Pearl, Michael Osterman, and Michael Pecht, 46th International Symposium on Microelectronics, Orlando, September 30 - October 3, 2013.
Multi-scale Modeling of Anisotropic Creep Response of Heterogeneous Single Crystal SnAgCu Solder , S.Mukherjee and A.Dasgupta, International Conference on Electronics Packaging (2013).
Examination of Solder Interconnects formed on ENEPIG finished Printed Wiring Boards under Drop Loading Conditions, Adam Pearl and Michael Osterman , SME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013), Burlingame, CA, July 16-18, 2013.
Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 solder - A Micromechanics Approach, Preeti Chauhan, Subhasis Mukherjee, Michael Osterman, Abhijit Dasgupta, and Michael Pecht , SME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013), Burlingame, CA, July 16-18, 2013.
Vibration Durability of Mixed Solder Ball Grid Array Assemblies, Sandeep Menon, Michael Osterman and Michael Pecht , Electronic Systems Technology Conference, Las Vegas, NV, May 21-23, 2013.
Investigation of Harmonic Vibration Loading on Package on Package Assemblies, Nikhil Lakhkar, Sandeep Menon and Michael Osterman , Electronic Systems Technology Conference, Las Vegas, NV, May 21-23, 2013.
Reliability Monitoring of a Separable Land Grid Array Using Time Domain Reflectometry, Michael H. Azarian, 17 th IEEE Workshop on Signal and Power Integrity (SPI2013), Paris, France, May 12-15, 2013.
Use of Temperature as a Health Monitoring Tool for Solder Interconnect Degradation in Electronics, P. Chauhan, M. Osterman, M. Pecht, and Q. Yu IEEE Prognostics & System Health Management Conference, PHM, Beijing, 2012.
An Analysis of the Electronic Assembly Repair Process for Lead-Free Parts Under Combined Loading Conditions, A. Konoza, P. Sandborn, and A. Chaloupka, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No. 9, pp. 1558-1567, September 2012.
A Canary Device Based Approach for Prognosis of Ball Grid Array Packages, S.Mathew, M.Osterman and M.Pecht, IEEE Conference on Prognostics and Health Management (PHM), Denver, CO, June 18 - 22, 2012.
Effects of Extended Dwell Time on Thermal Fatigue Life of Ceramic Chip Resistors, Elviz George, Michael Osterman, Michael Pecht and Richard Coyle, 45th International Symposium on Microelectronics, San Diego, California, USA, 9-13 September, 2012.
Reliability of Gull-Wing and Leadless Packages Subjected to Temperature Cycling After Rework, F. Chai, M. Osterman, and M. Pecht, IEEE Transactions on Device and Materials, 2012.
Canary Approach for Monitoring BGA Interconnect Reliability Under Temperature Cycling, P. Chauhan, M. Osterman and M. Pecht, The MFPT 2012 Proceedings, 2012.
Temperature Cycling Reliability of High-Temperature Lead-Free Die-Attach Technologies, Pedro O. Quintero and F. Patrick McCluskey, IEEE Transactions on Device and Materials Reliability, Vol. 11, No. 4, Pages 531 - 539, December 2011, DOI:10.1109/TDMR.2011.2140114.
Physics of Failure Based Reliability Assessment of Electronic Hardware, Sandeep Menon, Elviz George, Michael Osterman and Michael Pecht, 6th Annual World Congress on Engineering Asset Management, Cincinnati, Ohio, USA, 2-5 October, 2011.
Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High-Temperature Applications, E. George, D. Das, M. Osterman, and M. Pecht, Device and Materials Reliability, IEEE Transactions on , vol.11, no.2, pp.328-338, June 2011.
Thermal Cycling Ramifications of Lead-Free Solder on the Electronic Assembly Repair Process, A. Chaloupka, P. Sandborn, A. Konoza, Components, Packaging and Manufacturing Technology, IEEE Transactions on , vol.1, no.6, pp.964-974, June 2011.
Solder Joint Reliability of SnAgCu Solder Refinished Components Under Temperature Cycling Test, W. Wang, M. Osterman, D. Das, M. Pecht, Components, Packaging and Manufacturing Technology, IEEE Transactions on , vol.1, no.5, pp.798-808, May 2011.
Thermal Cycling Reliability of Sn96.5Ag3.0Cu0.5 Solder Assembled with ENIG and OSP Pad Finishes, P. Chauhan, M. Osterman and M. Pecht, IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications, Linthicum Heights, MD, May 17-19, 2011.
CLCC Solder Joint Life Prediction under Complex Temperature Cycling Loading, F. Chai, M. Osterman, M. Pecht, IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications, Linthicum Heights, MD, May 17-19, 2011.
Modeling Temperature Cycle Fatigue Life of SN100C Solder, M. Osterman, 2011 SMTA International Conference on Soldering and Reliability, Toronto Canada, May 3-4, 2011.
Non-Destructive Sensing of Interconnect Failure Mechanisms Using Time Domain Reflectometry, D. Kwon, M. H. Azarian, and M. Pecht, IEEE Sensors J., Vol. 11, No. 5, pp. 1236-1241, May 2011.
Micro-structural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test, L. Nie, M. Mueller, M. Osterman, and M. Pecht, Journal of Electronic Materials, Vol. 39, No. 8, 2010.
The Use of “Canaries” for Adaptive Health Management of Electronic Systems, A. Dasgupta, R. Doraiswami, M. Azarian, M. Osterman, S. Mathew, and M. Pecht, ADAPTIVE 2010, IARIA Conference, Lisbon Portugal, Nov 21-26, 2010.
Viscoplastic Creep Response and Microstructure of As- fabricated Micro-scale Sn3.0Ag0.5Cu Solder Interconnects, G. Cuddalorepatta, M. Williams, and A. Dasgupta, Journal of Electronic Materials, Vol. 39, No.10, pp. 2292-2309, 2010.
Multi-scale Modeling of the Viscoplastic Response of As-fabricated Micro-scale Pb-free Sn3.0Ag0.5Cu Solder Interconnects, G. Cuddalorepatta and A. Dasgupta, Acta Materialia, Vol. 58, No. 18, pp. 5989-6001, 2010.
Durability of Pb-free Solder Between Copper Interconnect and Silicon in Photovoltaic Cells, G. Cuddalorepatta, D.A., et. al, Progress in Photovoltaics: Research and Applications, No. 18, pp.168–182, 2010.
Thermal Cycling Reliability of Package on Packages Assembled by One-Pass and Two-Pass Techniques, N. Williard, P. Chauhan, V. Srinivas, M. Osterman, M. Pecht and R. Farrell, Proceedings of the 2010 SMTA International Conference and Exhibition, Orlando, FL, October 24-28, 2010.
Impact of Thermal Aging on the Thermal Fatigue Durability and Interfacial Intermetallic Compounds Thickness in Pb-free Solder Joints, P. Chauhan, M. Mueller, M. Osterman and M. Pecht, Electronics Systems Integration Conferences (ESTC), Sept. 2010.
Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-frame under Temperature Cycling, W. Wang, M. Osterman, D. Das and M. Pecht, Journal of ASTM International (JAI), Vol. 7, Issue 8, September 2010.
Prognostics of Interconnect Degradation using RF Impedance Monitoring and Sequential Probability Ratio Test, D. Kwon, M. Azarian and M. Pecht, International Journal of Performability Engineering, Vol. 6, No. 5, pp. 443-452, September 2010.
Harmonic and Random Vibration Durability of SAC305 and Sn37Pb Solder Alloys, Y. Zhou, M. Al-Bassyiouni and A. Dasgupta, IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 2, pp. 319-328, June 2010.
Micro-structural Analysis of Reworked Ball Grid Array Assemblies Under Thermomechanical Loading Conditions, L. Nie, M. Osterman and M. Pecht, IEEE Trans. on Device and Materials Reliability, Vol. 10, No. 2, pp. 276-286, June 2010.
Board Level Reliability Evaluation of Low Silver (Ag) Content Lead-free Solder Joints at Low Strain Rates, V. Srinivas, N. Williard, P. Chauhan and M. Osterman, SMTA International Conference on Solder Reliability, May 2010.
Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment, P. Quintero, F. P. McCluskey, International J. Microelectronics and Electronic Packaging, Vol 6, No. 1, pp. 66-74 (2009).
Impact of Thermal Aging on the Growth of Cu-Sn Intermetallic Compounds in Pb-free Solder Joints in 2512 Resistors, P. Chauhan, M. Osterman and M.Pecht, Proceedings of the ASME 2009 International Mechanical Engineering Congress & Exposition (IMECE2009), Lake Buena Vista, Florida, USA, November 13-19, 2009.
Physics of Failure Based Virtual Testing of Communication Hardware, Elviz George, Diganta Das, Michael Osterman, and Michael Pecht, ASME International Mechanical Engineering Congress and Exposition, Lake Buena Vista, Florida, US, 13-19 Nov, 2009.
Reliability of SAC305 and Sn3.5Ag Solders under High Temperature Thermal Cycling, Elviz George, Diganta Das, Michael Osterman, and Michael Pecht, International Conference on Soldering & Reliability (SMTA), Toronto, Ontario, Canada, 20-22 May, 2009.
Use of the Skin Effect for Detection of Interconnect Degradation, M. H. Azarian, D. Kwon, and M. Pecht, IMAPS 42nd Int. Symposium on Microelectronics, San Jose, CA, Nov. 1-5, 2009.
Comparative Assessment of Electrochemical Migration on PCBs with Lead-Free and Tin-Lead Solders, X. He, M. Azarian and M. Pecht, SMT Magazine, August 2009.
Effect of temperature cycling parameters on the durability of Pb-free solders, M. Osterman and P. Chauhan, IMAPS 2009 42nd International Symposium on Microelectronics, San Jose Convention Center - San Jose, California, USA, November 1-5, 2009.
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages, Lei Nie, Michael Osterman, Fubin Song, Jeffery Lo, S. W. Ricky Lee and Michael Pecht, IEEE Transactions on Components and Packaging Technology, Vol. 32, No. 4, pp. 901-908, December 2009.
Health Monitoring and Prognostics of Electronics Subject to Vibration Load Conditions, J. Gu, D. Barker, and M. Pecht, IEEE Sensors Journal, Vol. 9, No. 11, pp. 1479-1485, November 2009.
Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability, P. Chauhan, M. Osterman, M. Pecht and S.W.R. Lee, IEEE Transactions on Components and Packaging Technologies, Vol. 32, No. 3, pp. 693-700, September 2009.
A Rapid Life-Prediction Approach for PBGA Solder Joints Under Combined Thermal Cycling and Vibration Loading Conditions, H. Qi, M. Osterman and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 32, No. 2, pp. 283-292, June 2009.
Detecting Failure Precursors in BGA Solder Joints, Rubyca Jaai, Michael Pecht, and Jason Cook, 2009 Annual Reliability and Maintainability Symposium, 26 - 29 January, 2009.
Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblies using RF Impedance Analysis, D. Kwon, M. H. Azarian, M. Pecht, IEEE Electronic Components and Technology Conference, San Diego, CA, pp. 663-667, May 2009.
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages, L. Nie, M. Osterman, M. Pecht, F. Song, J. Lo and S.K. Lee, Equipment for Electronic Products Manufacturing (Chinese), pp. 1-5, February 2009.
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Packages in Lead-free and Mixed Assemblies, L. Nie, M. Osterman, and M. Pecht, SMTA Journal, Vol. 22, No. 2, pp. 13-20, 2009.
A Meso-scale Damage Evolution Model for Cyclic Fatigue of Viscoplastic Materials, L. Ladani and A. Dasgupta,International Journal of Fatigue Vol. 31, pp. 703–711, 2009.
Vibration Durability of Mixed Solder Interconnects, Gustavo Plaza, Dr. Michael Osterman, Prof. Michael Pecht, 41st International Symposium on Microelectronics, Providence, RI, Nov. 4-6, 2008.
Electro-migration and thermo-migration behaviour of flip chip solder joints in high current density packages, D. Yang, Y.C. Chan, B.Y. Wu, M. Pecht, Journal of Material Research, Vol. 23, No. 9, pp. 2333-2339, Sep 2008.
Application of FPGA units in combined temperature cycle and vibration reliability tests of lead-free interconnections,Matkowski P., Urbanski K., Falat T., Felba J., Zaluk Z., Zwierta R., Dasgupta A., Pecht M., 2nd Electronics System integration Technology Conference, London-Greenwich, p.1375-1379, 2008.
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Co-planarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies, D. Farley, A. Dasgupta, and J.F.J. Caers, Journal of Adhesion Science and Technology, Vol. 22,pp. 1757-1780, 2008.
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of An-isotropically Conductive Adhesive Interconnects, J. Haase, D. Farley, P. Iyer, P. Baumgartner, A. Dasgupta, and J. F. J. Caers, Journal of Adhesion Science and Technology, vol. 22, pp. 1733-1756, 2008.
Anisotropic Conductive Adhesives for Flip-chip Interconnections, Weiqiang Wang, Y.C. Chan, and Michael Pecht, in Electrically Conductive Adhesives, R. Gomatam and K. L. Mittal, editors, VSP, Leiden, the Netherlands, 2008.
Effect of Selected Process Parameters on Durability and Defects in Surface-Mount Assemblies for Portable Electronics, Ladani, L., Dasgupta, A., Cardoso, I., and Monlevade, E., IEEE Trans on Electronics Packaging and Manufacturing, Vol 31, No. 1, 2008.
Dynamic Recrystallization of Sn3.0Ag0.5Cu Pb-Free Solder Alloy, K. Holdermann, G. Cuddalorepatta, and A. Dasgupta, ASME IMECE, Paper Number IMECE2008-67671, Boston, MA, Nov 2008.
Dominant Mechanism for Crack Propagation in Non-planar Interfaces, K. Sinha, J. Varghese, A. Dasgupta, XXII International Congress of Theoretical and Applied Mechanics, Paper Number 12063,Adelaide, Australia, August, 2008.
Prognostics of Electronics under Vibration Using Acceleration Sensors, Jie Gu, Donald Barker, and Michael Pecht, Proceeding for 62nd Meeting of the Society for Machinery Failure Prevention Technology (MFPT), pp. 253-263, Virginia Beach, VA,May 2008.
Effect of Primary Creep Behaviour on Fatigue Damage Accumulation Rates in Accelerated Thermal Cycling of Sn3.0Ag0.5Cu Pb-Free Interconnects, G. Cuddalorepatta, and A. Dasgupta, Proceedings, EuroSiME Conference,Freiburg, Germany, April 2008.
Damage Initiation and Propagation in Voided Joints, Ladani, L. and Dasgupta, A., ASME Journal of Electronic Packaging, Vol 130, Issue 1, 011008, March 2008.
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages, L. Nie, M. Osterman, M. Pecht, F. Song, J. Lo and S.K. Lee, APEX 2008, Las Vegas, Nevada, March 30th-April 3rd, 2008.
Microstructure and Intermetallics Formation in SnAgCu BGA Components attached with SnPb Solder under Isothermal Aging, A. Choubey, M. Osterman, and M. Pecht. IEEE Transactions on Device and Materials Reliability, Vol 8, Issue 1, pp 160-167, 2008.
Intermetallics Characterization of Lead-free Solder Joints under Isothermal Aging, A. Choubey, H. Yu, M. Osterman, M. Pecht, F. Yun, L., Youghong and X. Ming., JJournal of Electronic Materials, Vol. 37, No. 8, pp. 1130-1138, August 2008.
Effect of Solder Joint Degradation on RF Impedance, D. Kwon, M. Azarian, and M. Pecht, 12th IEEE Workshop on Signal Propagation on Interconnect, Avignon, France, pp. 1-4, 2008.
Detection of Solder Joint Degradation Using RF Impedance Analysis, D. Kwon, M. Azarian, and M. Pecht, IEEE Electronic Components and Technology Conference, Lake Buena Vista, FL, pp. 606-610, 2008.
Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder, X. He, M. Azarian, and M. Pecht, Journal of Electronic Materials, Vol. 36, No. 2, February 2007.
Analysis of Solder Joint Failure Criteria and Measurement Techniques in the Qualification of Electronic Products, H. Qi, N. Vichare, M. Azarian, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, 2007.
Design of Experiments for Board Level Solder Joint Reliability of PBGA Package under Various Manufacturing and Multiple Environmental Loading Conditions, H. Qi, M. Osterman, and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, 2007.
High Cycle Cyclic Torsion Fatigue of PBGA Pb-Free Solder Joints, H, Qi, Q, Zhan, E. Tinsley, M. Osterman, and M Pecht, IEEE Transactions on COmponents and Packaging Technologies, 2007.
Life Expectancies of Pb-free SAC Solder Interconnects in Electronic Hardware, M. Osterman and A. Dasgupta, Lead-free Electronic Solders, A Special Issue of Journal of Materials Science: Materials in Electronics,, Springer, pp. 229-236, 2007.
Carbon Fiber-Based Grid Array Interconnects, Y. Deng, M. Pecht, J. Swift, and S. Wallace, IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 4, pp. 716-723, Dec, 2007.
Strain Range Fatigue Life Assessment of Lead-free Solder Interconnects Subject to Temperature Cycle Loading, M. Osterman and M. Pecht, Soldering & surface Mount Technology, Vol. 19, No. 2, pp. 12-17, 2007.
Creep and Stress Relaxation of Hypo-Eutectic Sn3.0Ag0.5Cu Pb-free Alloy: Testing and Modeling, G. Cuddalorepatta and A. Dasgupta, 2007 ASME International Mechanical Engineering Congress and Exposition, Seattle, Washington, November 11-17, 2007.
Vibration Durability Assessment of Sn3.0Ag0.5Cu & Sn37Pb SOlders under Harmonic Excitation, Y. Zhou and A. Dasgupta, 2007 ASME International Mechanical Engineering Congress and Exposition, Seattle, Washington, November 11-17, 2007.
Uncertainty Assessment of Prognostics of Electronics Subject to Random Vibration, J. Gu, D. Barker, and M. Pecht, AAAI Fall Symposium on Artificial Intelligence for Prognostics, pp.50-57, 2007.
Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications, H. Qi, M. Osterman, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 2, pp. 242-247, June 2007.
Reliability Assessment on Insertion Mount Assembly under Vibration Conditions, H. Qi, G. Plaza, S. Ganesan, M. Osterman, and M. Pecht, 2007 Electronic Components and Technology Conference, Reno, Nevada, pp. 407-414, May 29-June 1, 2007.
Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads, S. Mathew, D. Das, M. Osterman, M. Pecht, R. Ferebee, and J. Clayton, Journal of the IEST, Vol. 50, No. 1, pp 86-97, April 2007.
Durability of Repaired and Aged Lead-free Electronic Assemblies, A. Choubey, M. Osterman, M. Pecht, and D. Hillman, IPC Printed Circuits Expo, APEX, and Designers Summit, Los Angeles, CA. Feb 18-22, 2007.
Test Methodology for Durability Estimation of Surface Mount Interconnects under Drop Testing Conditions, J. Varghese and A. Dasgupta, Microelectronics Reliability, Vol. 47, Issue 1, pp. 93-107, January, 2007.
Vibration Durability Comparison of Sn37Pb vs SnAgCu Solders, Y. Zhou, E. Scanff, and A. Dasgupta, 2006 ASME International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 5-10, 2006.
A Strain Range Based Model for Life Assessment of Pb-free SAC Solder Interconnects , M. Osterman, A. Dasgupta, B. Han, 56th Electronic Component and Technology Conference, pp. 884 - 890, May 30-June 2, 2006.
Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells - Experimental Approach, G. Cuddalorepatta, A. Dasgupta, S. Sealing, J. Moyer, T. Tolliver, and J. Loman, Capacitor and Resistor Technology Symposium, Orlando, FL, pp. 15-25, April 3-6, 2006.
Effect of Aging on Pull Strength of SnPb, SnAgCu and Mixed Solder Joints in Peripheral Surface Mount Components, A. Choubey, D. Menschow, S. Ganesan, and M. Pecht, Journal of SMTA, Vol. 19, Issue 2, pp. 33-37, April 2006.
Predicting Plated Through Hole Life at Assembly and in the Field from Thermal Stress Data, M. Freda and D. Barker, IPC-APEX Exposition, Anaheim, California, February 8-10, 2006.
Reliability of High Temperature Solder Alternatives, F. P. McCluskey, M. Dash, Z. Wang, and D. Huff, Microelectronics Reliability, Vol. 46, No. 9, pp. 1910-1914 (2006). DOI: 10.1016/j.microrel.2006.07.090
Cyclic Mechanical Durability Of Sn3.0Ag0.5Cu Pb-Free Solder Alloy, G. Cuddalorepatta and A. Dasgupta, ASME International Mechanical Engineering Congress and RD&D Expo, Orlando, FL, November 5-11, 2005.
Effects of Printed Circuit Board Materials on Lead-free Interconnect Durability, H. Qi, S. Ganesan, J. Wu, M. Pecht, P. Matkowski, and J. Felba, 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 140-144, Wroclaw, Poland, October 23-26, 2005.
Carbon Fiber Electrical Interconnects, Y. Deng, J. Wu, and M. Pecht, 38th International Symposium on Microelectronics, Emerging Technologies, pp. 169-176, Philadelphia, PA, September 25-29, 2005.
Effect of Stress Relaxation on Board Level Reliability of Sn Based Pb-Free Solders, S. Yoon, Z. Chen, M. Osterman, B. Han, and A. Dasgupta, 55th ECTC, pp. 1210-1214, June 2005.
Failure Analysis and Virtual Qualification of PBGA Under Multiple Environmental Loadings, H. Qi, C. Wilkinison, M. Osterman, and M. Pecht, Electronic Components and Technology Conference, Proceedings. 54th, Vol, 1. No. 1-4, pp. 413-420, June 2004.