The Center for Advanced Life Cycle Engineering
The Center for Advanced Life Cycle Engineering has conducted research and practical work with over 300 companies for more than 35 years. Providing a knowledge and resource base for the development and sustainment of competitive electronic products and systems.
We provide assistance and research in advanced electronic systems through private consulting.
Research areas include, reliability analysis, accelerated testing, risk mitigation and management, life cycle analysis, and electronic systems design and analysis.
International Microelectronics Assembly and Packaging Society
The IMAPS student chapter at the University of Maryland is composed of several graduate students whose focus is in the field of microelectronics and electronics packaging. Many members are involved in microelectronics reliability through their graduate research at CALCE.
The mechanical engineering graduate program at the University of Maryland is ranked 17th in the nation.
The A. James Clark School of Engineering is ranked 22nd in the nation with Mechanical Engineering at #17 and three other programs in the top 20 (U.S. News & World Report).
News & Events
Ph.D. Student Abhishek Deshpande Awarded IEEE EPS Fellowship
Fellowship promotes, recognizes and supports Ph.D.-level study within the field of electronic packaging.