(301)-405-5255
Prof. Bongtae Han is currently a Keystone Professor, the Mechanical Engineering Department of the University of Maryland. Dr. Han started his career at IBM Microelectronics in 1991, where he was involved in the first development of flip-chip, build-up, and ball grid array technologies. He returned to academia in 1996. Since then, his research interest has been the design and analysis of semiconductor and photonics systems for optimum reliability – "design for reliability". The current LOMSS projects address: (1) mechanical design and reliability assessment of microelectronics devices; (2) advanced characterizations of semiconductor packaging materials; (3) accelerated test and life prediction of packages and package assemblies; (4) adhesion analysis of critical interfaces; (5) experimental characterization of package stresses and warpages; and (6) moisture ingress, behavior and prediction inside semiconductor packaging.
Dr. Han has co-authored a textbook entitled "High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials", Springer-Verlag, 1994. He edited two books and has published 13 book chapters and over 300 journal and conference papers in the fields of microelectronics and experimental mechanics (https://scholar.google.com/citations?hl=en&user=-giPkhcAAAAJ). He holds 2 US patents and 4 invention disclosures.
He served as an Associate Technical Editor for Experimental Mechanics, from 1999 to 2001; for Journal of Electronic Packaging, Transaction of the ASME from 2003 to 2012; for Microelectronics Reliability from 2017 to 2020. He is currently serving as Editor-in-Chief for Microelectronics Reliability.
He was elected a Fellow of the SEM and the ASME in 2006 and 2007, respectively.
Top