Dr. Bongtae Han is currently a Keystone Professor at the Mechanical Engineering Department of the University of Maryland. Dr. Han has co-authored a textbook entitled "High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials", Springer-Verlag (1997), and edited two books. He has published 13 book chapters and over 350 journal and conference papers in the field of microelectronics, photonics, and experimental mechanics. He holds 2 US patents and 4 invention disclosures.
Dr. Han received the IBM Excellence Award for Outstanding Technical Achievements in 1994. He was a recipient of the 2002 Society for Experimental Mechanics (SEM) Brewer Award for his contributions to developing photomechanics tools used in semiconductor packaging. He was named the 2015 American Society of Mechanical Engineering (ASME) Mechanics Award winner in the Electronic and Photonic Packaging Division for his contributions to structural mechanics of electronic systems
Dr. Han served as an Associate Technical Editor for Experimental Mechanics, from 1999 to 2001; for the Journal of Electronic Packaging, Transaction of the ASME from 2003 to 2012; for Microelectronics Reliability from 2017 to 2020. He is currently serving as a Co-Editor-in-Chief for Microelectronics Reliability and will serve as an Editor-in-Chief beginning Jan. 2023. He was elected a Fellow of the SEM and the ASME in 2006 and 2007, respectively.