Dr. Bongtae Han is Keystone Professor of Engineering and APT Chair of the Mechanical Engineering Department of the University of Maryland; and is currently directing the LOMSS (Laboratory for Optomechanics and Micro/nano Semiconductor/Photonics Systems) of CALCE (Center for Advanced Life Cycle Engineering).
|JongKeun Moon (Visiting Scholar)||Warpage handling in semi-conductor package products|
|Hyun-Seop Lee||Electronic packaging and reliability, characterization of polymers|
|Jack Yang||Reliability of semiconductor packaging, Uncertainty propagation analysis|
|Changsu Kim||Electronic packaging and reliability, characterization of polymers|
|Sukrut Phansalkar||Reliability of semiconductor packaging, Uncertainty propagation analysis|
|Artur Roman||Modeling of diffusive humidity transport through housing materials|
|Name||Year and Placement|
|Bulong Wu, Ph.D.||2018, Apple (Display)|
|Hsiu-Ping Wei, Ph.D.||2018, Apple (Reliability)|
|Byung Kim, M.S.||2018, Northrup Grumman|
|Dae-Suk Kim, Ph.D.||2017, Qualcomm|
|Yong Sun, Ph.D.||2016, Intel|
|Kenny Mahan, Ph.D.||2016, Apple|
Challenges and Research Issues of Data Management in IoT for Large-Scale Petrochemical Plants , Lei Shu, Mithun Mukherjee, Michael Pecht, Noel Crespi, and Son N. Han, IEEE Systems Journal, Vol. 12, No. 3, PP. 2509 - 2523, September, 2018, doi: 10.1109/JSYST.2017.2700268.
Characterization of Linear Viscoelastic Behavior of Epoxy Molding Compound Subjected to Uniaxial Compression and Hydrostatic Pressure, Hyun-Seop Lee, Yong Sun, Changsu Kim, and Bongtae Han, IEEE Transactions on Components, Packaging and Manufacturing Technology, July 2018.
Advanced Mechanical/Optical Configuration of Real-Time Moiré Interferometry for Thermal Deformation Analysis of Fan-Out Wafer Level Package, Bulong Wu, Bongate Han, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2805873.
In Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor, Alexandru Prisacaru, Alicja Palczynska, Przemyslaw Gromala, Andreas Theissler, Bongtae Han, Guo Qi Zhang, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2816259.
Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit Using Stress Sensor as In Situ Load Counter, Bulong Wu1, Alexandru Prisacaru, Alicja Palczynska, Przemyslaw Gromala, Bongtae Han, Dae-Suk Kim, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2816259.
Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment, Bongtae Han, Chandradip Patel, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2816259.
Measurement of Elastic Properties of Epoxy Molding Compound by Single Cylindrical Configuration with Embedded Fiber Bragg Grating Sensor, Yimao Sun, Hyun-Seop Lee, Bongate Han, Experimental Mechanics, Vol: 57, Issue: 2, pp. 313-324, 2017 .
Measurement of Temperature-Dependent Elastic Constants of Epoxy Molding Compound by Fiber Bragg Grating Sensor Method, Y. Sun, H.-S. Lee, and B. Han, Experimental Mechanics , 57, pp. 313-324: DOI: 10.1007/s11340-016-0215-5 (2017).
Deconvolution of Spectral Power Distribution of HighPower, Pu Zhang, Dae-Suk Kim, Bongate Han, Applied Optics, Vol: 56, Issue: 20, pp. 5590-5598.
Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method, Hsiu-Ping Wei, Byeng Dong Yuon, Bongtae Han, Hyuk Shin, Ilho Kim, and Hojeong Moon, Microelectronics Reliability, Vol: 78, pp. 319-330, November 2017.
Deconvolution of spectral power distribution of high-power laser diode arrays, Pu Zhang, Dae-Suk Kim, and Bongtae Han ,Applied Optics, Vol. 56, Issue 20, pp. 5590-5598, July 2017.
|Upcoming Travel: Conferences, Events, and Guest Lectures|
|Event and Location||Date|
|Intel||October 11 - 12, 2018|
|CALCE Fall 2018 EPS Consortium Meeting||October 23 - 24, 2018|