bthan@calce.umd.edu
(301)-405-5255

Dr. Bongtae Han is Keystone Professor of Engineering and APT Chair of the Mechanical Engineering Department of the University of Maryland; and is currently directing the LOMSS (Laboratory for Optomechanics and Micro/nano Semiconductor/Photonics Systems) of CALCE (Center for Advanced Life Cycle Engineering).  

Dr. Han has co-authored a text book entitled "High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials", Springer-Verlag (1997) and edited two books.  He has published 12 book chapters and over 250 journal and conference papers in the field of microelectronics, photonics and experimental mechanics.  He holds 2 US patents and 4 invention disclosures.  
 
Dr. Han received the IBM Excellence Award for Outstanding Technical Achievements in 1994.  He was a recipient of the 2002 Society for Experimental Mechanics (SEM) Brewer Award for his contributions to development of photomechanics tools used in semiconductor packaging.  Most recently, he was named the 2016 American Society of Mechanical Engineering (ASME) Mechanics Award winner in Electronic and Photonic Packaging Division for his contributions to structural mechanics of electronic systems.  His publication awards include (1) the Year 2004 Best Paper Award of the IEEE Transactions on Components and Packaging Technologies, (2) the Gold Award (best paper in the Analysis and Simulation session) of the 1st Samsung Technical Conference in 2004 and (3) the Year 2015 Best Paper Award of the 16th International Conference on Electronic Packaging Technology (ICEPT 2015).  His contributions to an innovative 1,500-face lumen LED luminaire, jointly developed with GE, have been recognized in a Press Release (Oct. 21, 2010, MarketWatch.com, The Wall Street Journal).  He served as an Associate Technical Editor for Experimental Mechanics, from 1999 to 2001, and also served as an Associate Technical Editor for Journal of Electronic Packaging, Transaction of the ASME from 2003 to 2012.  He is currently serving as an Associate Editor for Microelectronics Reliability.  
 
He was elected a Fellow of the SEM and the ASME in 2006 and 2007, respectively.

 

Current Students
Name Research Area
JongKeun Moon (Visiting Scholar) Warpage handling in semi-conductor package products
Hyun-Seop Lee Electronic packaging and reliability, characterization of polymers
Jack Yang Reliability of semiconductor packaging, Uncertainty propagation analysis
Changsu Kim Electronic packaging and reliability, characterization of polymers
Sukrut Phansalkar Reliability of semiconductor packaging, Uncertainty propagation analysis
Artur Roman Modeling of diffusive humidity transport through housing materials

 

Recent Graduates
Name Year and Placement
Bulong Wu, Ph.D. 2018, Apple (Display)
Hsiu-Ping Wei, Ph.D. 2018, Apple (Reliability)
Byung Kim, M.S. 2018, Northrup Grumman
Dae-Suk Kim, Ph.D. 2017, Qualcomm

Recent Publications

Challenges and Research Issues of Data Management in IoT for Large-Scale Petrochemical Plants , Lei Shu, Mithun Mukherjee, Michael Pecht, Noel Crespi, and Son N. Han, IEEE Systems Journal, Vol. 12, No. 3, PP. 2509 - 2523, September, 2018, doi: 10.1109/JSYST.2017.2700268.

Characterization of Linear Viscoelastic Behavior of Epoxy Molding Compound Subjected to Uniaxial Compression and Hydrostatic Pressure, Hyun-Seop Lee, Yong Sun, Changsu Kim, and Bongtae Han, IEEE Transactions on Components, Packaging and Manufacturing Technology, July 2018.

Advanced Mechanical/Optical Configuration of Real-Time Moiré Interferometry for Thermal Deformation Analysis of Fan-Out Wafer Level Package, Bulong Wu, Bongate Han, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2805873.

In Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor, Alexandru Prisacaru, Alicja Palczynska, Przemyslaw Gromala, Andreas Theissler, Bongtae Han, Guo Qi Zhang, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2816259.

Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit Using Stress Sensor as In Situ Load Counter, Bulong Wu1, Alexandru Prisacaru, Alicja Palczynska, Przemyslaw Gromala, Bongtae Han, Dae-Suk Kim, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2816259.

Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment, Bongtae Han, Chandradip Patel, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2816259.

Measurement of Elastic Properties of Epoxy Molding Compound by Single Cylindrical Configuration with Embedded Fiber Bragg Grating Sensor, Yimao Sun, Hyun-Seop Lee, Bongate Han, Experimental Mechanics, Vol: 57, Issue: 2, pp. 313-324, 2017 .

Measurement of Temperature-Dependent Elastic Constants of Epoxy Molding Compound by Fiber Bragg Grating Sensor Method, Y. Sun, H.-S. Lee, and B. Han, Experimental Mechanics , 57, pp. 313-324: DOI: 10.1007/s11340-016-0215-5 (2017).

Deconvolution of Spectral Power Distribution of HighPower, Pu Zhang, Dae-Suk Kim, Bongate Han, Applied Optics, Vol: 56, Issue: 20, pp. 5590-5598.

Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method, Hsiu-Ping Wei, Byeng Dong Yuon, Bongtae Han, Hyuk Shin, Ilho Kim, and Hojeong Moon, Microelectronics Reliability, Vol: 78, pp. 319-330, November 2017.

Deconvolution of spectral power distribution of high-power laser diode arrays, Pu Zhang, Dae-Suk Kim, and Bongtae Han ,Applied Optics, Vol. 56, Issue 20, pp. 5590-5598, July 2017.

 

Upcoming Travel: Conferences, Events, and Guest Lectures
Event and Location Date

 


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