diganta@umd.edu
(301)-405-5323 

Dr. Diganta Das(Ph.D., Mechanical Engineering, University of Maryland, College Park, B.Tech, Manufacturing Science and Engineering, Indian Institute of Technology) is a member of the research staff at the Center for Advanced Life Cycle Engineering. His expertise is in reliability, environmental and operational ratings of electronic parts, uprating, electronic part reprocessing, counterfeit electronics, technology trends in the electronic parts and parts selection and management methodologies. He performs benchmarking processes and organizations of electronics companies for parts selection and management and reliability practices.

His current research interests include electronic parts supply chain, counterfeit electronics avoidance and detection, light emitting diode failure mechanisms, cooling systems in telecommunications infrastructure and their impact on reliability, and power electronics reliability. In addition, Dr. Das is involved in prognostics based risk mitigation of electronics.

Dr. Das has published more than 75 articles on these subjects, and presented his research at international conferences and workshops. He had been the technical editor for two IEEE standards and is currently vice chair of the standards group of IEEE Reliability Society. He is a sub group leader for the SAE G-19 counterfeit detection standards group.

Dr. Das leads the Educational Outreach of CALCE with responsibility to develop inter-organizational agreements on joint educational programs, training and internship program, and professional development.

He is an Associate Editor of the journal Microelectronics Reliability. He is a Six Sigma Black Belt and a member of IEEE, IMAPS and SMTA.

Recent Publications

Analysis of Indentation Measured Mechanical Properties on Multilayer Ceramic Capacitors (MLCCs) , Nga Man Li, Subramani Manoharan, Diganta Das, and Patrick McCluskey, Microelectronics Reliability, Vols. 88-90, 528-533, September 2018, doi: 10.1016/j.microrel.2018.07.116.

Managing Electonrics Part Changes in the Supply Chain, Michael Pecht, Francois Dagorn, Diganta Das, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, Issue 5, PP. 883-895, April, 2018, DOI: 10.1109/TCPMT.2017.2768999.

Shelf Life Evaluation Method for Electronic and other Components using a Physics of Failure (PoF) Approach, Nga Man Li, Diganta Das,and Michael Pecht, Proceedings of the Society for Machinery Failure Prevention Technology Conference, May 15-18, 2017, Virginia Beach, VA.

Risk Assessment of Transition to Lead-free Electronics Assembly, Guru Prasad Pandian, Diganta Das, Michael Osterman, and Michael Pecht Proceedings of the Society for Machinery Failure Prevention Technology Conference, May 15-18, 2017, Virginia Beach, VA.

Impact of Dormancy Periods on Power Cycling of Insulated Gate Bipolar Transistors (IGBTS), Nathan Valentine and Diganta Das, 2016 IEEE Accelerated Stress Testing & Reliability Conference (ASTR), Pensacola Beach, FL, 2016, pp. 1-6.

Critical review of U.S. Military environmental stress screening (ESS) handbook, Nga Man Li and Diganta Das, 2016 IEEE Accelerated Stress Testing & Reliability Conference (ASTR), Pensacola Beach, FL, 2016, pp. 1-10.

Effect of Epoxy Flux Underfill on Thermal Cycling Reliability of Sn-8Zn-3Bi Lead-Free Solder in a Sensor Application, M. Mostofizadeh, M. Najari, D. Das, M. Pecht, and L. Frisk, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2016, pp. 2169-2175.

Thermal cycling reliability of Sn-Zn lead-free solders in sensor application, M. Mostofizadeh, D. Das, M. Pecht, and L. Frisk, IEEE 65th Electronic Components and Technology Conference (ECTC), 2015.

Failure Analyses of Modern Power Semiconductor Devices, N. Valentine, B. Sood, D. Das, M. Pecht, IMAPS 48th International Symposium on Microelectronics, Orlando, FL, October 27-29, 2015.

 

Upcoming Travel: Conferences, Events, and Guest Lectures
Event and Location Date
Symposium on Counterfeit Parts and Materials June 25 - 27, 2019
CALCE 2019 Fall Technical Review and Roadmapping Meeting October 23 - 24, 2019

 


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