Faculty and Research Scientists
| Bio | Research Areas | Contact |
| Prof. Michael Pecht | Reliability & Supply Chain Policies | 301-405-5323 pecht@umd.edu |
| Dr. Michael Osterman | Testing and Simulation-Based Failure Assessment | 301-405-8023 osterman@umd.edu |
| Prof. Damena Agonafer | The Intersection of Thermal-fluid Sciences, Interfacial Transport Phenomena, and Renewable Energy | agonafer@umd.edu |
| Dr. Michael H. Azarian | Failure Analysis, Prognostics and Health Management, Electrical Contacts, Passive Components, Counterfeit Detection and Mitigation | 301-405-7555 mazarian@umd.edu |
| Prof. David Bigio | Polymers | 301-405-5258 dbigio@umd.edu |
| Prof. Aris Christou | Power Electronics, Device Reliability, Flexible Electronics and Displays | 301-405-5208 christou@umd.edu |
| Dr. Diganta Das | Parts Selection & Management, Uprating, Component Reliability | 301-405-5323 diganta@umd.edu |
| Prof. Siddhartha Das | Soft Capillarity and Wetting, Micro-nanoscale transport | 301-405-6633 sidd@umd.edu |
| Prof. Abhijit Dasgupta | Interconnect Reliability, Accelerated Testing | 301-405-5251 dasgupta@umd.edu |
| Prof. Bongtae Han | Reliability Assessment of Packaging Materials, Components and Assemblies | 301-405-5255 bthan@umd.edu |
| Janesh Hasija | Artificial Intelligence Intellectual Property Review | jhasija@umd.edu |
| Prof. Jay Lee | Manufacturing, Artificial Intelligence | 301-405-5205 leejay@umd.edu |
| Prof. Patrick McCluskey | Power Electronics, Component Reliability | 301-405-0279 mcclupa@umd.edu |
| Prof. Michael Ohadi | Thermal Management | 301-405-5263 ohadi@umd.edu |
| Dr. Sukrut Prashant Phansalkar | Mechanical Characterization and Numerical Modeling of Polymers Used in Advanced Electronics Packaging Technologies. | 301-405-5471 sukrutp@umd.edu |
| Anwoy Talukder Ranjak | Solder material characterization and Failure analysis of electronic packages | anwoy45@umd.edu |
| Prof. Peter Sandborn | Technology Tradeoff Analysis, Life Cycle Cost | 301-405-3167 sandborn@umd.edu |
| Ashwin Sudarshan | Product Reliability | ashwin23@umd.edu |
| Dr. Robert Utter | Electronic Product Development, Failure Analysis | (301)-405-3884 rgutter@umd.edu |
Research Students
| Name | Research Areas | Contact |
| Aaron Mendelsohn | Solder Joint Reliability | amendel1@umd.edu |
| Akshaya Sridhar | Microfluid Cooling using Microencapsulated Phase Change Materials | asridha2@umd.edu |
| Alessandra Contreras | Radiation Hardened Power Module | acontre1@terpmail.umd.edu |
| Amir Hossein Zabihi Tari | Reliability Assessment of Cooling System | azabihit@umd.edu |
| Aniket Ajitkumar Bharamgonda | Microstructure-based Modelling of Lead Free Solder Joints | abharamg@umd.edu |
| Andoniaina Mariah Randriambololona | Composite Phase Change Materials for Power Electronics | arandria@umd.edu |
| Brett Setera | Wide Bandgap Semiconductor Reliability | bsetera@umd.edu |
| Chris A. Martinez | Drop Durability of Additively Manufactured Electronics | cmart714@umd.edu |
| Christopher Riso | 3D Printed Electronic Components | chriso@umd.edu |
| Christopher Thomas | Space Power Advanced Module | cthoma02@umd.edu |
| Clifton Buxbaum | Reliability of Solar PV Inverters | cbux6@umd.edu |
| Dane Miller | Diamond Thin Film Synthesis | dlee13@terpmail.umd.edu |
| Dengyun Chen | Solder Interconnect Life Modelings | dchen925@umd.edu |
| Devon Richman | Detection of Degradation and Counterfeits Using Side-channel Power Modulation Analysis (PMA) | drichman@umd.edu |
| Emils Gustav Jurcik | Thermal Analysis of Power Amplifiers | egjurcik@umd.edu |
| Erick Gutierrez | Transient Liquid Phase Sintering | eguti007@umd.edu |
| Maj. Hayden Richards, USAF |
Effects of Mechanical Shock on Printed Hybrid Electronics at Room and Elevated Temperatures |
hkricha@umd.edu |
| Hisham Abusalma | Reliability of Electronics | abusalma@umd.edu |
| Huwei Dong | Prognostics and Health Management | donghw@umd.edu |
| Ibaad Gandikota | Data Center Cooling Reliability | gandikot@umd.edu |
| Idowu Olatunji | Effect of Thermal and Mechanical Stresses on Reliability of Lead-Free Interconnection | iolatunj@umd.edu |
| Jack Yang | Reliability of Semiconductor Packaging, Uncertainty Propagation Analysis | yhyangv@umd.edu |
| Jacob Welch | Fatigue Damage Caused by Repeated Impacts in Electronic Assemblies | jwelch23@terpmail.umd.edu |
| Jonathan Hower | Drop Shock Reliability of Area Array Packages | jhower@umd.edu |
| Jonathan Martin | Vibration Fatigue of Printed Wiring Assemblies | johnny01@umd.edu |
| Kidus Jeglalo Guye | Novel Evaporative Cooling Solutions for the Thermal Management of Electronics | kguye@umd.edu |
| Lucas Dietz (Undergraduate) | Electronic Assembly Storage | ldietz@terpmail.umd.edu |
| Md Asif Faisal Beg | Thermal and Mechanical Characterization of Polymers | masifb@umd.edu |
| Paul Kim | 3D Printed Electronics Reliability | pkim1235@umd.edu |
| Prabhat Janamanchi | Adhesive Joint Reliability | prabhatj@umd.edu |
| Pranav Srinivasan | Advanced Packaging | pranav22@umd.edu |
| Rachel McAfee | Electronics Cooling with Novel Materials | mcafeera@umd.edu |
| Randall Silvestro | Vibration Durability | rsilvest@umd.edu |
| Roshith Mittakolu | Data Center Digital Twins, Thermal Management of Electronics. | mroshith@umd.edu |
| Rutvik Davuluri | Reliability of Optical Coatings | dvcr@umd.edu |
| Sai Achyut Madhira | Additive Manufacturing and Drop Experiments | smadhira@umd.edu |
| Sahithi Maddipatla | Battery Swelling and Prognostics | sahithi@umd.edu |
| Sadib Fardin | Microelectronic Devices, Characterization of Polymers | sadibf@umd.edu |
| Sebastian Winther | Additive Manufacturing of Hybrid Circuits | swinther@umd.edu |
| Seongyo Kim | Semiconductor Packaging | seongyo@umd.edu |
| Shao-Peng Chen | Open-Systems Procurement and Sustainment | spchen@umd.edu |
| Shohreh Soltani | Development of Reliability Prediction for New Product Introduction | soltani1@umd.edu |
| Soma Roy | Tribology | somaroy@umd.edu |
| Swarup Kumar Subudhi | Development, Printing, and Testing of Soft Magnetic Films and CNT-GO-based Electronics | swarupks@umd.edu |
| Tali Schlenoff (Undergraduate) | Corrosion in Liquid Cooled Data Centers | tschleno@terpmail.umd.edu |
| Trinity Aguilar | Radiation Hardened Power Module | trinity@terpmail.umd.edu |
| Vishal Raavi | Data Center Software Development | vraavi@umd.edu |
| Vivek Vardhan Manepalli | Advanced Two-phase Cooling Techniques in Electronic Systems | vmanepal@umd.edu |
| Xiao Lin | Fatigue Damage Caused by Multiaxial Vibration Excitation in Electronic Assemblies | xiao365@umd.edu |
| Zhou He | Thermal Runaway of Lithium-ion Batteries | zhe12@umd.edu |
Interns and Visitors
| Name | Supervisor or Host | Home Institution |
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