Course Overview
This course (Component level and PCB level) will provide the attendees with the knowledge necessary to apply such a methodology to the qualification of components and the reliability assessment of electronic systems. Each section provides introduction to physics-of-failure based virtual qualification and application specific reliability assessment. The course will demonstrate how to use manufacturer's test data together with failure modeling to qualify a component for use in a particular application. The course will also demonstrate the application of this virtual qualification technique to the insertion of commercial components into high-temperature, high-power, automotive, and avionic applications. The use of virtual qualification for building reliability into power modules will also be discussed. The course will conclude with a discussion of the probabilistic nature of reliability assessment and with a demonstration of computer-aided tools for virtual qualification and application-specific reliability assessment.
Course Outline
1. Introduction
2. Failure Mechanisms and Models
- Board Level
- Component Level
3. Life Cycle Loads and Load Transformation
- Life Cycle Loads
- Thermal
- Vibration
4. Virtual Qualification
5. VQ Examples
- Board Level
- Component Level
Past Customers
- British Aerospace - United Kingdom
- Compaq Computers - Texas
- General Motors - Michigan
- Honeywell - Arizona
- CanadaSmiths Industries - Michigan
- Visteon Automotive Systems - Michigan
*This course has also been presented as a public offering in College Park, MD.
Related Texts
- Electronic Packaging: Materials and Their Properties
- High Performance Printed Circuit Boards
- Handbook of Electronic Package Design
- Calce PWA Software
Contact
Michael Osterman
301-405-5323 | education@calce.umd.edu
Bldg. 89, Room 1103
University of Maryland
College Park, MD 20742
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