Course Overview

This course (Component level and PCB level) will provide the attendees with the knowledge necessary to apply such a methodology to the qualification of components and the reliability assessment of electronic systems. Each section provides introduction to physics-of-failure based virtual qualification and application specific reliability assessment. The course will demonstrate how to use manufacturer's test data together with failure modeling to qualify a component for use in a particular application. The course will also demonstrate the application of this virtual qualification technique to the insertion of commercial components into high-temperature, high-power, automotive, and avionic applications. The use of virtual qualification for building reliability into power modules will also be discussed. The course will conclude with a discussion of the probabilistic nature of reliability assessment and with a demonstration of computer-aided tools for virtual qualification and application-specific reliability assessment.

Course Outline

1. Introduction  
2. Failure Mechanisms and Models
  • Board Level   
  • Component Level  
3. Life Cycle Loads and Load Transformation
  • Life Cycle Loads   
  • Thermal    
  • Vibration 
4. Virtual Qualification 
5. VQ Examples
  • Board Level   
  • Component Level   

Past Customers

  • British Aerospace - United Kingdom
  • Compaq Computers - Texas
  • General Motors - Michigan
  • Honeywell - Arizona
  • CanadaSmiths Industries - Michigan
  • Visteon Automotive Systems - Michigan
*This course has also been presented as a public offering in College Park, MD.

Related Texts


Michael Osterman
301-405-5323 | 
Bldg. 89, Room 1103
University of Maryland
College Park, MD 20742