Course Overview

This short course is intended to provide the audience with the current status of lead-free reliability and consideration of issues arising from the transition to lead-free assembled electronic hardware. The course provides up to date information on what companies should understand about lead-free materials, the reliability of lead-free assemblies, the risk posed by tin whiskers, as well as mixed solder reliability and rework and repair lead-based and lead-free assemblies.

Course Outline

1. Introduction
2. Lead-free Materials and Assemblies
  • Lead-free Solders
3. Lead-free Assembly Reliability
  • PWB reliability
  • Part reliability
  • Solder interconnect reliability
4. Mixed Solder and Rework and related issues
5. Tin Whiskers and Failure Risk
6. Summary

Past Customers

  • Arbitron, Columbia, MD
  • CEPREI - China
  • Emerson Divisions - Missouri and China
  • Emerson Electronics - Missouri
  • Halliburton - Texas
  • L3 Electronic Systems - Canada
  • Lockheed Martin - California, Georgia, Texas
  • Schlumberger - Texas

Related Texts

Contact

Michael Pecht
301-405-5323 | education@calce.umd.edu 
Bldg. 89, Room 1103
University of Maryland
College Park, MD 20742

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