Course Overview
This course details the performance and reliability issues involved in designing electronic systems for use at temperatures above 125°C. It will provide the attendee with the tools and information needed to design electronic systems that will perform reliably in extreme temperature environments, such as are found in defense, avionic and automobiles applications.
Course Outline
- Extreme temperature electronics: technology for the 21st Century
- Active component selection for extreme temperature environments
- Passive component selection for extreme temperature environments
- Module level packaging of extreme temperature environments
- Board assembly and process compatibility issues
- Power electronics in extreme temperature environments
- MEMs + Sensors for extreme temperature environments
- Thermal management for extreme temperature power electronics
- Applications of high temperature electronics
- Silicon carbide devices and packaging above 250°C
- Design for reliability tools for extreme temperature electronics
Past Customers
- 4th Int'l High Temp. Conference - New Mexico
- 5th Int'l High Temp. Conference - New Mexico
- IMAPS Nordic - Norway
- Lear Astronics- California
- Tubitak Ujay - Turkey
Related Links and Texts
- Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach
- High Temperature Electronics
- Electronic Packaging: Materials and Their Properties
Contact
Michael Pecht
301-405-5323 | education@calce.umd.edu
Bldg. 89, Rm. 1103
University of Maryland
College Park, MD 20742
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