Current offering Nov. 14-17, 2023
Course Overview
An intensive 4-day course on Failure Analysis of Electronics is being offered by CALCE. The four day course will cover specimen preparation and materials analysis techniques applicable to electronic assemblies, components, and devices. The course consists of a combination of classroom instruction, demonstrations, and hands-on laboratory training. Lecture topics includes physics-of-failure root cause analysis, guidelines for selection of analytical tools and, practical instruction on laboratory techniques. The laboratory portion of the course includes demonstrations and step-by-step hands-on sample preparation using metallographic techniques on the latest failure analysis equipment. In addition, a number of important non-destructive and destructive analysis techniques will be demonstrated.
Each course attendee is invited to submit one sample to CALCE at least three weeks before the course starts. Several of the submitted samples will be prepared and analyzed in advance, for use during course demonstrations. Some of the other samples will also be used for hands-on training sessions during the course, to illustrate specimen preparation procedures and analysis techniques. All unused samples will be returned. However, no guarantee can be offered that any specific sample will be used during the course.
Course Outline
- Failure mechanisms of electronic products
- Root cause analysis
- Physics of failure
- Failure analysis techniques
- Non-destructive analysis techniques
- Destructive analysis
Course Instructor
Dr. Michael Azarian | mazarian@calce.umd.edu
Dr. Michael H. Azarian is an Associate Research Scientist at CALCE. He holds a Ph.D. in Materials Science and Engineering from Carnegie Mellon University, a Master's degree in Metallurgical Engineering and Materials Science from Carnegie Mellon, and a Bachelor's degree in Chemical Engineering from Princeton University. His current research interests include failure mechanisms in electronic components and assemblies and effects of solder joint degradation on reliability of RF electronic products. Dr. Azarian has been leading CALCE's efforts in developing a methodology for reliability capability assessment of electronics manufacturers and suppliers.
Contact
Dr. Michael Osterman
301-405-8023 | osterman@umd.edu
University of Maryland
College Park, MD 20742
Top