Course Overview

This course will present a methodology for identifying potential failure mechanisms based on the failure history. Appropriate failure analysis techniques for various failure mechanisms will be discussed, with step-by-step details provided. Example pictures and case studies will be presented. The course will conclude with corrective and preventative actions, the most crucial part of a failure analysis report.

Course Outline

1. Failure Mode Identification
2. Failure Mechanism Identification
  • Component packaging
  • Boards and substrates
  • Interconnects (solder joints)
  • Contacts and connectors
3. Failure Analysis Techniques
  • Non-destructive Analysis (NDA)
  • Destructive analysis
  • Materials characterization
  • Accelerated testing
4. Corrective and Preventative Actions

Related Texts

Contact

Dr. Diganta Das
301-405-7770 | diganta@calce.umd.edu
 
Dr. Michael H. Azarian
301-405-7555 | mazarian@calce.umd.edu

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