Course Overview

This course will present a methodology for identifying potential failure mechanisms based on the failure history. Appropriate failure analysis techniques for various failure mechanisms will be discussed, with step-by-step details provided. Example pictures and case studies will be presented. The course will conclude with corrective and preventative actions, the most crucial part of a failure analysis report.

Course Outline

1. Failure Mode Identification
2. Failure Mechanism Identification
  • Component packaging
  • Boards and substrates
  • Interconnects (solder joints)
  • Contacts and connectors
3. Failure Analysis Techniques
  • Non-destructive Analysis (NDA)
  • Destructive analysis
  • Materials characterization
  • Accelerated testing
4. Corrective and Preventative Actions

Related Texts


Dr. Diganta Das
301-405-7770 |
Dr. Michael H. Azarian
301-405-7555 |