Root-Cause Failure Analysis of Electronic Products

This course provides a systematic approach to root cause failure analysis of electronic products. A methodology will be presented for identifying potential failure mechanisms based on the failure history and the results of failure analysis and testing. Failure analysis techniques will be introduced, including non-destructive inspection, destructive analysis, and materials characterization methods. Example case studies are included. The course will include discussions on the determination of root cause based on the information gathered, and selection of corrective and preventative actions.

 

Several hours, taught as either a one day or two half-day sessions

1.    Introduction: Closed Loop Root Cause Analysis Process
2.    Non-Destructive Analysis (NDA) Methods

• Optical Microscopy
• SEM Imaging and Analysis 
• X-ray Imaging
• Acoustic Microscopy

3.    Electrical Testing
4.    Destructive Analysis Techniques 

• Cross-sectional Sample Preparation for Failure Analysis
• Focused Ion Beam Etching
• Dye and Pry, Decapsulation
• Nano-indentation, Other (Micro-)Mechanical Characterization Techniques
• Thermal Characterization

5.    Spectroscopic, Surface Analytical, and Materials Characterization Techniques

• FTIR, Raman, XPS, SIMS, Contact Angle, etc.

6.    Concluding Steps of Root Cause Failure Analysis Process

 

Related CALCE Courses

• Physics of Failure of Electronic Products
• Introduction to Electronic Packaging Materials

301-405-7770

University of Maryland

College Park, 20742

 

(301) 405-7555    
mazarian@umd.edu
University of Maryland
College Park, MD 20742

 

For more information about CALCE Courses and how to schedule them, Please contact: education@umd.edu