Overview Test Capabilities Current and Recent Studies Team Publications
Influence of Varying H2S Concentration and Humidity Levels on ImAg and OSP Surface Finishes, Amer Charbaji, Michael Osterman, and Michael Pecht, International Journal of Mechanical Engineering and Technology (IJMET), December 2015.
Impact of Dust on Printed Circuit Assembly Reliability, Bo Song, Michael H. Azarian and Michael G. Pecht, Proc. of IPC Apex Expo Conference, San Diego, CA, Feb. 2012.
An Evaluation of the Insulation Resistance and Surface Contamination of Printed Circuit Board Assemblies, Xiaofei He, Michael H. Azarian, Mark Kostinovsky, and Michael G. Pecht, Proc. of IPC Apex Expo Conf., San Diego, CA, Feb. 2012.
Corrosion of ImAg-Finished PCBs Subjected to Elemental Sulfur Environments, S. Zhang, R. Kang, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 11, No. 3, pp. 391-400, September 2011.
The Influence of H2S Exposure on Immersion-Silver-Finished PCBs Under Mixed-Flow Gas Testing, S. Zhang, M. Osterman, A. Shrivastava, R. Kang and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol.10, No.1, pp. 71-81, March 2010.
Reliability Assessment of Land Grid Array Sockets Subjected to Mixed Flowing Gas Environment, Shuang Yang, Ji Wu and Michael G. Pecht , IEEE Transactions on Reliability, Vol. 58, No. 4, pp. 634-640, December 2009.
Investigation on Mechanism of Creep Corrosion of Immersion Silver Finished Printed Circuit Board by Clay Tests, Y. Zhou and M. Pecht, 55th Annual IEEE Holm Conference, Vancouver, British Columbia, Canada, pp. 321-330, September 14-16, 2009.
The influence of SO2 environments on immersion silver finished PCBs by mixed flow gas testing, Shunong Zhang, Michael Osterman, Anshul Shrivastava, Rui Kang and Michael G. Pecht, International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09., Vol., No., pp 116-122, August 10-13 2009, DOI: 10.1109/ICEPT.2009.5270782.
Assessment of Ni/Pd/Au-Pd and Ni/Pd/Au-Ag Pre-Plated Lead-frame Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests, P. Zhao, M. Pecht, S. Kang, and S. Park, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 4, pp. 818-826, December, 2006.
Mixed Flowing Gas Studies of Creep Corrosion on Plastic Encapsulated Microcircuit Packages with Noble Metal Pre-Plated Lead-frames, P. Zhao, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 5, No. 2, pp. 268-276, June 2005.
Palladium-plated Packages: Creep Corrosion and Its Impact on Reliability, J. Xie and M. Pecht, Advanced Packaging, pp. 39-42, February 2001.
Effect of Corrosion on the Transfer Impedance of Zinc-Coated Steel Enclosures, J. Xie, M. Pecht, D. Barbe, S. Das, J. Nuebel, and B. Zand, IEEE Transactions on Electromagnetic Compatibility, Vol. 42, No. 1, pp. 71-76, February 2000.
Corrosion of a Zinc-coated Steel Enclosure at the Contact Interfaces of Gasket Joints, J. Xie, M. Pecht, S. Das, J. Nuebel, and B. Zand, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 136-142, March 2000.
The Effect of Corrosion on Shielding Effectiveness of a Zinc-Coated Steel Enclosure, S. Das, J. Neubel, B. Zand, D. Hockanson, J. Xie, and M. Pecht, the 1998 IEEE International Symposium on Electromagnetic Compatibility, pp. 1041-1046, Denver CO, August 1998.
Kinetic Modeling of Corrosion Film on Unloaded Precious Metal Plated Contacts, M. Sun, S. Javadpour, R. Martens, and M. Pecht, Proceeding of 30th International Connector & Interconnection Technology Symposium 1997, USA, pp. 227-244, 1997.
Modeling the Effects of Mixed Flowing Gas Corrosion and Stress Relaxation on Contact Interface Resistance, S. Bhagath and M. Pecht, ASME Journal of Electronic Packaging, Vol. 115, pp. 404-409, Dec. 1993.
Corrosion Modeling in Micorelectronic Packaging, A. Christou, X. Shan, and M. Pecht, International Journal of Microcircuits and Electronic Packaging, Vol. 15, No. 1, First Quarter 1992.
A Corrosion Rate Equation for Microelectronic Die Metallization, M. Pecht and W. Ko, The International Journal for Hybrid Microelectronics, Vol. 13 (2), pp. 41-52, June 1990.
A Model for Moisture Induced Corrosion Failures in Microelectronic Packages, M. Pecht, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13 (2), pp. 383-389, June 1990.