Professor Bongtae Han Delivers Invited Talk at a Global Semiconductor Event

Professor Bongtae Han of CALCE was invited as an international expert speaker to the 2025 Incheon Global Semiconductor Workshop held on November 25, 2025. At this high-profile event, organized by Inha University and supported by Incheon Metropolitan City, Professor Han delivered an invited talk titled “New Perspective on Advanced Thermoset-based Manufacturing Process: Can We Design the Process?”, highlighting CALCE’s leadership in advanced semiconductor packaging and reliability research.

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The workshop brought together approximately 100 participants from semiconductor companies, universities, research institutes, and industry associations to strengthen a global network among industry, academia, and research institutes, and foster next-generation semiconductor talent. CALCE UMD's participation, through Professor Han's contribution on thermoset-based manufacturing and design-for-reliability concepts, underscored the center's pivotal role in shaping advanced packaging technologies and supporting international collaboration in Korea's rapidly evolving semiconductor ecosystem.

Professor Han’s presentation concluded the workshop’s lineup of distinguished talks by international experts. His insights on thermoset-based manufacturing processes and design-for-reliability approaches offered a fresh analytical perspective, resonating strongly with industry professionals and researchers alike. The session highlighted the importance of integrating material science with process design to achieve robust, high-performance semiconductor systems. As emphasized by other keynote speakers, including Professor Seong Lee of Portland State University and Dr. Bora Balogulu of Intel, the collaborative outlook shared throughout the event reinforced the workshop’s mission to strengthen global partnerships and promote innovation in next-generation semiconductor technologies.

Professor Bongtae Han is Keystone Professor of Mechanical Engineering at the University of Maryland, where he directs the Laboratory for Optomechanics and Micro/Nano Semiconductor/Photonics Systems and is affiliated with the Center for Advanced Life Cycle Engineering. He received his Ph.D. in Engineering Science and Mechanics from Virginia Tech in 1991 after earning B.S. and M.S. degrees in Energy Resources Engineering from Seoul National University in 1981 and 1983, respectively. His research centers on the mechanics and reliability of electronic and photonic packaging, including warpage prediction, stress analysis, and design for reliability in semiconductor and photonics systems. Professor Han is a Fellow of both the Society for Experimental Mechanics and the American Society of Mechanical Engineers, and his honors include the IBM Excellence Award, SEM’s Brewer Award, multiple best paper awards, and the ASME Mechanics Award in the Electronics and Photonics Packaging Division. He has held key editorial roles and currently serves as Editor-in-Chief of the journal Microelectronics Reliability, reflecting his leadership in semiconductor packaging reliability

For more information about CALCE research on advanced semiconductor packaging and optomechanics-based metrology, contact Prof. Bongtae Han.

Published December 10, 2025