CALCE Faculty and Students Participate at InterPACK 2018Members of the CALCE team, including Professors Dasgupta, McCluskey, and Han, traveled to San Francisco for this year’s International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) presented by the Electronics and Photonics Packaging Division (EPPD) of the American Society of Mechanical Engineers (ASME).
InterPACK is an international conference for collaboration over cutting-edge knowledge in the application, development, manufacturing, and research of electronics packaging and heterogeneous integration. This conference serves as the flagship event of the ASME Electronic and Photonic Packaging Division (EPPD), and is highly beneficial in promoting global interactions between industry and academia.
At the conference, Prof. Dasgupta served as an invited participant of two panels “Heterogeneous Integration Roadmap Workshop” (abstract below) and “Data Centers and IT Management,” and participated in EPPD committee meetings to plan for the 2019 InterPACK conference.
During the technical sessions of InterPACK, two of Prof. Dasgupta’s students, Hao Huang and Qian Jiang, presented their papers, “Creep Response of Assemblies Bonded with Pressure Sensitive Adhesive (PSA)” and “Elastic Properties of Few-Grained SAC Solder Joints Based on Anisotropic Multi-Scale Predictive Models,” respectively.
Prof. McCluskey presented the work of his students Erick Gutierrez, Subramani Manoharan, and Maxim Serebreni. This included “Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn” and “Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects.” Prof. McCluskey also served on the “Power Electronics Packaging – Functional Materials” and “Power Electronics, Energy Conversion and Storage” sessions as a co-organizer.
Prof. Han was joined by his current student, Artur Roman, and his former student, Dr. Bulong Wu (currently with Apple) in presenting “Investigation of Moisture Transport through Housing Materials used in Automotive Electronics.” The outcome of his collaboration with Bosch at Germany, “Volumetric and Isochoric Nonlinear Viscoelasticity for Epoxy-Based Polymers: Experimental Characterization and Theoretical Modeling” was also presented by his colleague, Dr. Fabian Welschinger of Bosch.
Abstract for Heterogeneous Integration Roadmap (HIR) Workshop
Our Industry has reinvented itself through multiple disruptive changes in technologies, products and markets. With the rapid migration of logic, memory and applications to the Cloud infrastructures, Data Centers and 5G Networks, the Internet of Things (IoT) to internet of everything (IOE), Autonomous Vehicles, the proliferation of Smart Devices everywhere, and increasing interest in artificial intelligence (AI) & Virtual Reality (VR) , the pace of innovation is increasing to meet these challenges. What are the paths forward?
The IEEE Heterogeneous Integration Technology Roadmap (HIR), is sponsored by the IEEE Electronic Packaging Society (EPS), the Electron Devices Society (EDS), Photonics Society together with ASME EPPD and SEMI. It will address the future directions of heterogeneous integration technologies and applications serving future markets and applications, so very crucial to our profession, our industries, academic and research communities. Following the spirit of ITRS, the HIR is a pre-competitive technology roadmap provides long-term vision to identify the needs of future technology challenges, roadblocks, and potential solutions focused on system integration and broad market applications in order to accelerate progress for the broad electronics industry.
Published September 10, 2018