Prof. Han Visits Samsung, TSMC and USI

Professor Bongtae Han spent much of early August visiting Samsung divisions in Korea and the Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) and Universal Scientific Industrial Co. (USI) in Taiwan.

During his visits, he introduced CALCE to help share research and foster future research collaborations. Specifically, Prof. Han spoke of CALCE’s research in characterization of epoxy molding compounds.

Recent articles by Prof. Han that relate to epoxy molding compounds and characterization include:

Characterization of Linear Viscoelastic Behavior of Epoxy Molding Compound Subjected to Uniaxial Compression and Hydrostatic Pressure

Measurement of Elastic Properties of Epoxy Molding Compound by Single Cylindrical Configuration with Embedded Fiber Bragg Grating Sensor

Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds over Solder Reflow Process Temperature

Published August 20, 2018