The International Microelectronics Assembly and Packaging Society (IMAPS) Chesapeake Chapter and University of Maryland Chapter are seeking submissions for a student poster contest.
Date: Wednesday April 4, 2018 at 3PM.
Open To: All graduate students in the greater DC metro area.
Topics of Interest: Microelectronics packaging, electronics reliability (component, board, and system level), and electronic supply chain.
Abstract Submission Deadline: Monday March 19, 2018. Limited to 200 words.
Decision on Acceptance: 10 abstracts will be selected to be presented for the poster contest. Each finalist will receive a $50 reward.
Application Requirements: Applicants will need to pay $10.00 to participate in the event, and must complete registration through the IMAPS website.
Contest Winners: Judging of the posters by a panel of experts from industry and academia will be based on clarity of work, merit of research, creativity, presentation skills, and overall depth of subject knowledge. The poster authors must be present at the meeting to be considered for awards.
First Prize: $200.00
Second Prize: $150.00
Third Prize: $100.00
For more information on poster contest rules or submissions, contact Edmond Elburn.