Implementation Process of SAE 6171

 Thursday June 28, 2018 | 8:30AM - 5:00PM

Dr. Michael H. Azarian

mazarian@calce.umd.edu

BACKGROUND

Counterfeit parts have found their way into every sector of industry, from consumer electronics and appliances to safety-critical areas including avionics, medical devices, and military systems. Parts shortages and obsolescence have provided opportunities for counterfeiters to capitalize on the demand for parts that may be in short supply. Counterfeits have even found their way into parts of the supply chain that would not normally be doubted. The variety and volume of counterfeit parts in circulation has been growing as counterfeiters devise increasingly sophisticated and devious methods of covering their tracks.

Prior to the availability of standards that govern test methods for counterfeit part detection and avoidance, organizations and test laboratories developed widely varying approaches to mitigating the risk. This led to inconsistencies and gaps in the processes, technologies, and quantitative risk assessment methodologies needed to address the problem.

SAE established the G-19A Test Laboratory Standards Development Committee to develop a risk-based testing standard for counterfeit detection and avoidance. Over the past six years, subject matter experts and interested parties from industry, government, academia, and test laboratories have come together to develop a set of twelve documents that set out requirements and recommendations for risk assessment, test procedures and selection, sampling criteria, training, workmanship, and reporting associated with detection of counterfeit electrical, electronic, and electromechanical parts. In October 2016 these documents were published as the AS6171 family of standards, consisting of a general requirements document and eleven slash sheets covering the test methods and the risk-based selection of test sequences for counterfeit part detection. Their impact will be difficult to underestimate, as they fill a huge void in industry’s arsenal for combating a pernicious threat.

COURSE DESCRIPTION

This full-day course will provide a thorough introduction to the requirements and hierarchy of the AS6171 Test Methods Standard for Suspect/Counterfeit Electrical, Electronic, and Electromechanical (EEE) Parts. It will cover the General Requirements document, the Test Evaluation method, and the ten test methods that were all published in 2016.

Following a brief introduction to the electronics supply chain and an overview of the types of counterfeit parts, the first half of the course will focus on the General Requirements document combined with the selection and evaluation of test sequences for counterfeit part detection. An emphasis will be placed on practical implementation of the requirements, illustrated with examples wherever possible. This portion will address:

  • Overview of AS6171 document scope, structure and hierarchy
  • Key concepts and definitions
  • Risk assessment
  • Risk-based test sequence selection, including defects associated with various types of counterfeit parts and the confidence of detecting them using the various test methods
  • Sampling plans
  • Analysis and interpretation of results
  • Training and certification

The second half of the course will cover the ten individual test methods and their requirements. For each test method, a primer will be given on its purpose in the context of counterfeit EEE part detection, the associated procedure and equipment, and any special requirements concerning sample preparation or handling, reporting and personnel training. Wherever possible, specific examples and data will be presented of applications to detection of counterfeit parts. The list of covered test methods consists of:

  • External Visual Inspection (EVI) (including remarking, resurfacing, weight, dimensions, SEM)
  • X-Ray Fluorescence (XRF) (including lead finish, thickness)
  • Delid/Decapsulation Physical Analysis (DDPA)
  • Radiological Inspection (RI): X-ray imaging
  • Acoustic Microscopy (AM): external and internal
  • Electrical Test: Curve Trace, Full DC, Key Electrical Parameters for AC, Switching, and Functional Tests; ambient or over temperature (including environmental, burn-in, seal)
  • Raman Spectroscopy: materials identification
  • Fourier Transform Infrared Spectroscopy (FTIR): materials identification
  • Thermogravimetric Analysis (TGA): material analysis
  • Design Recovery (DR): device layout and function

To close out the course, a brief overview will be given of new test methods currently under development by the G-19A committee that are intended for release at a future date.


Top