Michael Osterman
Recent Publications
Risk Assessment of Transition to Lead-free Electronics Assembly, Guru Prasad Pandian, Diganta Das, Michael Osterman, and Michael Pecht Proceedings of the Society for Machinery Failure Prevention Technology Conference, May 15-18, 2017, Virginia Beach, VA.
Reliability of Conformal Coated Surface Mount Packages, Deng Yun Chen and Michael Osterman, IEEE 2016 Accelerated Stress Testing and Reliability (ASTR) Conference, September 28-30, 2016, Pensacola, Florida.
Reliability of Corner Staked Surface Mount Packages, Deng Yun Chen and Michael Osterman, IEEE 2016 Accelerated Stress Testing and Reliability (ASTR) Conference, September 28-30, 2016, Pensacola, Florida.
A Life Model for Supercapacitors, Nick Williard, Dongcheon Baek, Jong Won Park, Byung-Oh Choi, Michael Osterman, and Michael Pecht, IEEE Transactions On Device and Materials Reliability, Vol. 15, No. 4, December 2015.
Influence of Varying H2S Concentration and Humidity Levels on ImAg and OSP Surface Finishes, Amer Charbaji, Michael Osterman, and Michael Pecht, International Journal of Mechanical Engineering and Technology (IJMET), December 2015.
Evaluation of ENEPIG and Immersion Silver Surface Finishes Under Drop Loading, Adam Pearl, Michael Osterman, and Michael Pecht, Journal of ELECTRONIC MATERIALS, @ 2015 The Minerals, Metals & Materials Society, DOI: 10.1007/s11664-015-4104-y.
Evaluating the Impact of Dwell Time on Solder Interconnect Durability under Bending Loads, Sandeep Menon, Michael Osterman and Michael Pecht , Journal of Electronic Materials. DOI: 10.1007/s11664-015-3931-1.
An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model, Elviz George, Michael Osterman and Michael Pecht , Microelectronics Reliability 55, pp 582-587, Feb - March 2015, DOI:10.1016/S0026-2714(15)00039-6.
High Lead (over 85 %) Solder in the Electronics Industry: RoHS Exemptions and Alternatives, Sandeep Menon, Elviz George, Michael Osterman and Michael Pecht , Journal of Materials Science: Materials in Electronics, March 4 2015, DOI: 10.1007/s10854-015-2940-4.
| Upcoming Travel: Conferences, Events, and Guest Lectures | |
|---|---|
| Event and Location | Date |
| CALCE 2019 Fall Technical Reivew and Roadmapping Meeting | October 23 - 24, 2019 |
| Four-Day Failure Analysis of Electronics Short Course | November 19 - 22, 2019 |
Diganta Das
Recent Publications
Analysis of Indentation Measured Mechanical Properties on Multilayer Ceramic Capacitors (MLCCs) , Nga Man Li, Subramani Manoharan, Diganta Das, and Patrick McCluskey, Microelectronics Reliability, Vols. 88-90, 528-533, September 2018, doi: 10.1016/j.microrel.2018.07.116.
Managing Electonrics Part Changes in the Supply Chain, Michael Pecht, Francois Dagorn, Diganta Das, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, Issue 5, PP. 883-895, April, 2018, DOI: 10.1109/TCPMT.2017.2768999.
Shelf Life Evaluation Method for Electronic and other Components using a Physics of Failure (PoF) Approach, Nga Man Li, Diganta Das,and Michael Pecht, Proceedings of the Society for Machinery Failure Prevention Technology Conference, May 15-18, 2017, Virginia Beach, VA.
Risk Assessment of Transition to Lead-free Electronics Assembly, Guru Prasad Pandian, Diganta Das, Michael Osterman, and Michael Pecht Proceedings of the Society for Machinery Failure Prevention Technology Conference, May 15-18, 2017, Virginia Beach, VA.
Impact of Dormancy Periods on Power Cycling of Insulated Gate Bipolar Transistors (IGBTS), Nathan Valentine and Diganta Das, 2016 IEEE Accelerated Stress Testing & Reliability Conference (ASTR), Pensacola Beach, FL, 2016, pp. 1-6.
Critical review of U.S. Military environmental stress screening (ESS) handbook, Nga Man Li and Diganta Das, 2016 IEEE Accelerated Stress Testing & Reliability Conference (ASTR), Pensacola Beach, FL, 2016, pp. 1-10.
Effect of Epoxy Flux Underfill on Thermal Cycling Reliability of Sn-8Zn-3Bi Lead-Free Solder in a Sensor Application, M. Mostofizadeh, M. Najari, D. Das, M. Pecht, and L. Frisk, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2016, pp. 2169-2175.
Thermal cycling reliability of Sn-Zn lead-free solders in sensor application, M. Mostofizadeh, D. Das, M. Pecht, and L. Frisk, IEEE 65th Electronic Components and Technology Conference (ECTC), 2015.
Failure Analyses of Modern Power Semiconductor Devices, N. Valentine, B. Sood, D. Das, M. Pecht, IMAPS 48th International Symposium on Microelectronics, Orlando, FL, October 27-29, 2015.
| Upcoming Travel: Conferences, Events, and Guest Lectures | |
|---|---|
| Event and Location | Date |
| Symposium on Counterfeit Parts and Materials | June 25 - 27, 2019 |
| CALCE 2019 Fall Technical Review and Roadmapping Meeting | October 23 - 24, 2019 |
Siddhartha Das
| Current Students | |
|---|---|
| Name | Research Area |
| Beihan Zhao | 3D Printing with CNT Based Inks |
| Yanbin Wang | Fabrication and Characterization of CNT-based Ink and Syringe Printing of CNT-based Composites |
| Vishal Sankar Sivasankar | Modeling of Aerosol Jet Printing Process |
| Chenglin Yi (Postdoc) | Aerosol Jet 3D Printing for Comfortable Surfaces |
Recent Publications
Flexible, Bio-Compatible Nanofluidic Ion Conductor, Chengwei Wang, Sha Wang, Guang Chen, Weiqing Kong, Weiwei Ping, Jiaqi Dai, Glenn Pastel, Hua Xie, Shuaiming He, Siddhartha Das, and Liangbing Hu, Chemistry of Materials, PP, 19 October, 2018, DOI: 10.1021/acs.chemmater.8b03006.
Direct-Write Printed, Solid-Core Solenoid Inductors with Commercially Relevant Inductances, Yaun Gu, Donghun Park, David Bowen, Siddhartha Das, and Daniel R. Hines, Advanced Materials Technologies, PP. 1-7, 1800312, DOI: 10.1002/admt.201800312.
The Effect of Droplet Sizes on Overspray in Aerosol-Jet Printing, Guang Chena, Yuan Gua, Harvey Tsangb, Daniel R. Hinesc, and Siddhartha Das, Advanced Engineering Materials, PP. 1-13, 2018, DOI: 10.1002/adem.201701084.
Inkwells for on-demand deposition rate measurement in aerosol-jet based 3D printing, Yuan Gu, David Gutierrez, Siddhartha Das, and D. R. Hines, Journal of Micromechanics and Microengineering, Vol. 29, Issue 9, PP. 1.9, August 22, 2017.
Aerosol-Jet Printed Fillets for Well-Formed Electrical Connections between Different Leveled Surfaces, Yuan Gu, Daniel R. Hines, Victor Yun, Michael Antoniak, and Siddhartha Das, Advanced Materials Technologies, Vol. 2, Issue 11, PP. 1-9, September 21, 2017.
Abhijit Dasgupta
| Current Students | |
|---|---|
| Name | Research Area |
| Dengyun Chen | Accelerated Testing of Electronic Assemblies Under Thermal Cycling and Drop Loading |
| Abhishek Nitin Deshpande | Solder Characterization and Modeling |
| Qian Jiang | Characterization and Anisotropic Modeling for Solders, Reliability of Copper RDL in WLCSP |
| Jonathan Kordell | Fiber Optic Sensors for Prognostic Health Monitoring |
| Beihan Zhao | 3D Printable Inks Characterization and Reliability Testing of 3D Printed Electronics |
| Christopher Riso | 3D Printed Electronic Components |
| Prabhat Janamanchi | Adhesive Joint Reliability |
| David Leslie | Combined Thermal Cycling and Vibration Fatigue of PWAs, Moisture Ingress into Electronics Enclosures, Characterization of Sintered Silver Interconnects |
| Xiao Lin | Fatigue Damage Caused by Multiaxial Vibration Excitation in Electronic Assemblies |
| Recent Graduates | |
|---|---|
| Name | Year and Placement |
| Hao Huang, Ph.D. | 2019 |
| Neil Dalal, M.S. | 2018, Johns Hopkins Applie Physics Laboratory |
| Sam Massa, M.S. | 2018, Northrop Grumman |
| Raman Sridharan, M.S. | 2017, Data Physics Inc. |
| Elaine Lin, M.S. | 2016, Aerospace Corp. |
Recent Publications
Viscoplastic Properties of pressure-less sintered silver materials using indentation, D. Leslie, A. Dasgupta, and Carlos Morillo, Microelectronics Reliability, Vol. 74, 121-130, 2017.
Influence of Secondary Impact on Printed Wiring Assemblies Part II: Competing Failure Modes in Surface Mount Components, Jingshi Meng and Abhijit Dasgupta, J. Electron. Packag, June 2017.
MEMS Packaging Reliability in Board-Level Drop Tests Under Severe Shock and Impact Loading Conditions Part I: Experiment, Jingshi Meng, Abhijit Dasgupta, and Stuart Douglas, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 6, Issue 11 , pp. 1595-1603. November 2016.
Influence of Secondary Impact on Printed Wiring Assemblies Part I: High Frequency 'Breathing Mode' Deformations in the Printed Wiring Board, Jingshi Meng, Abhijit Dasgupta, Journal of Electronic Packaging, Vol. 138, pp. 010914 1-12, March 2016.
Creep fatigue models of solder joints: A critical review, E.H. Wong, W.D. Van Driel, A. Dasgupta, and M. Pecht,Microelectronics Reliability, Vol. 59, pp 1-12, April 2016, DOI:10.1016/j.microrel.2016.01.013.
Effect of gold and copper in AUSN4 deposition and isothermal durability of SAC305 solder joints, Subhasis Mukherjee, Carlos Morillo, Lay-Ling Ong, Julie Silk and Abhijit Dasgupta, Surface Mount Technology Association, Vol 29, Issue 1, 20-30, March 2016.
| Upcoming Travel: Conferences, Events, and Guest Lectures | |
|---|---|
| Event and Location | Date |
| 20th Eurosime, Hanover, Germany | March 24-27 |
Bongtae Han
| Current Students | |
|---|---|
| Name | Research Area |
| Hyun-Seop Lee | Electronic packaging and reliability, characterization of polymers |
| Jack Yang | Reliability of semiconductor packaging, Uncertainty propagation analysis |
| Changsu Kim | Electronic packaging and reliability, characterization of polymers |
| Sukrut Phansalkar | Reliability of semiconductor packaging, Uncertainty propagation analysis |
| Recent Graduates | |
|---|---|
| Name | Year and Placement |
| Artur Roman, M.S.. | 2019, Microsoft |
| Bulong Wu, Ph.D. | 2018, Apple (Display) |
| Hsiu-Ping Wei, Ph.D. | 2018, Apple (Reliability) |
| Byung Kim, M.S. | 2018, Northrup Grumman |
| Dae-Suk Kim, Ph.D. | 2017, Qualcomm |
Recent Publications
Challenges and Research Issues of Data Management in IoT for Large-Scale Petrochemical Plants , Lei Shu, Mithun Mukherjee, Michael Pecht, Noel Crespi, and Son N. Han, IEEE Systems Journal, Vol. 12, No. 3, PP. 2509 - 2523, September, 2018, doi: 10.1109/JSYST.2017.2700268.
Characterization of Linear Viscoelastic Behavior of Epoxy Molding Compound Subjected to Uniaxial Compression and Hydrostatic Pressure, Hyun-Seop Lee, Yong Sun, Changsu Kim, and Bongtae Han, IEEE Transactions on Components, Packaging and Manufacturing Technology, July 2018.
Advanced Mechanical/Optical Configuration of Real-Time Moiré Interferometry for Thermal Deformation Analysis of Fan-Out Wafer Level Package, Bulong Wu, Bongate Han, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2805873.
In Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor, Alexandru Prisacaru, Alicja Palczynska, Przemyslaw Gromala, Andreas Theissler, Bongtae Han, Guo Qi Zhang, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2816259.
Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit Using Stress Sensor as In Situ Load Counter, Bulong Wu1, Alexandru Prisacaru, Alicja Palczynska, Przemyslaw Gromala, Bongtae Han, Dae-Suk Kim, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2816259.
Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment, Bongtae Han, Chandradip Patel, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2816259.
Measurement of Elastic Properties of Epoxy Molding Compound by Single Cylindrical Configuration with Embedded Fiber Bragg Grating Sensor, Yimao Sun, Hyun-Seop Lee, Bongate Han, Experimental Mechanics, Vol: 57, Issue: 2, pp. 313-324, 2017 .
Measurement of Temperature-Dependent Elastic Constants of Epoxy Molding Compound by Fiber Bragg Grating Sensor Method, Y. Sun, H.-S. Lee, and B. Han, Experimental Mechanics , 57, pp. 313-324: DOI: 10.1007/s11340-016-0215-5 (2017).
Deconvolution of Spectral Power Distribution of HighPower, Pu Zhang, Dae-Suk Kim, Bongate Han, Applied Optics, Vol: 56, Issue: 20, pp. 5590-5598.
Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method, Hsiu-Ping Wei, Byeng Dong Yuon, Bongtae Han, Hyuk Shin, Ilho Kim, and Hojeong Moon, Microelectronics Reliability, Vol: 78, pp. 319-330, November 2017.
Deconvolution of spectral power distribution of high-power laser diode arrays, Pu Zhang, Dae-Suk Kim, and Bongtae Han ,Applied Optics, Vol. 56, Issue 20, pp. 5590-5598, July 2017.
| Upcoming Travel: Conferences, Events, and Guest Lectures | |
|---|---|
| Event and Location | Date |
Patrick McCluskey
| Current Students | |
|---|---|
| Name | Research Area |
| He Yun | Reliability of Power Converters in Aerospace Application |
| Erick Guiterez |
Transient Liquid Phase Sintering Power Module Reliability
|
| Nga Man Jennifa Li |
Multilayer Ceramic Capacitor Behavior and Reliability Storage Reliability
|
| Subramani Manoharan |
Reliability of Wire Bonds Study of Underfills for BGA/WLP packages
|
| Yonatan Soddon | Thermal Management of Aerospace Electronics |
| Zhaoxi Yao | Thermal Management of Aerospace Electronics |
| Recent Graduates | |
|---|---|
| Name | Year and Placement |
| Seyed Ali Moeini, Ph.D. | 2018, Apple |
| Hannes Greve, Ph.D. | 2017, Intel |
| David Squiller, Ph.D. | 2017, Northrop Grumman |
| Daniel Power, M.S. | 2016, Northrop Gruman |
Recent Publications
Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment, Subramani Manoharan, Chandradip Patel, Patrick McCluskey, and Michael Pecht, IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2018.2816259
Analysis of Indentation Measured Mechanical Properties on Multilayer Ceramic Capacitors (MLCCs) , Nga Man Li, Subramani Manoharan, Diganta Das, and Patrick McCluskey, Microelectronics Reliability, Vols. 88-90, 528-533, September 2018, doi: 10.1016/j.microrel.2018.07.116.
Mechanism of Wire Bond Shear Testing, Subramani Manoharan, Chandradip Patel, Stevan hunter, and Patrick McCluskey, Microelectronics Reliability, Vols. 88-90, September 2018, doi: 10.1016/j.microrel.2018.06.061.
Physics-of-Failure, Condition Monitoring and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review, Hyunseok Oh, Bongtae Han, Patrick McCluskey, Changwoon Han and Byeng D. Youn. IEEE Transactions of Power Electronics, Vol. 30, No. 5, May 2015.
Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications, P. Quintero, P. McCluskey, and B. Koenei, Microelectronics Reliability, Vol. 54, Issue 1, pp 220-225, January 2014, DOI:10.1016/j.microrel.2013.08.002.
| Upcoming Travel: Conferences, Events, and Guest Lectures | |
|---|---|
| Event and Location |
Date |
| IMAPS High Temperature Electronics Network, Oxford, UK | July 8 - 10, 2019 |
Peter Sandborn
Recent Publications
A Modified Levelized Cost of Energy Model to Provide Purchase Prices and Price Schedules to Power Purchase Agreement, Maira Bruck, Navid Goudarzi, and Peter Sandborn, Proceedings of the European Wind Energy Association, Hamburg, Germany, Sept. 2016.
A Levelized Cost of Energy (LCOE) Model for Wind Farms that Includes Power Purchase Agreement (PPA) Energy Delivery Limits, Maira Bruck, Navid Goudarzi, and Peter Sandborn, Proceedings of the ASME 2016 Power Conference, PowerEnergy2016.
The Effect of Yaw Error on the Reliability of Wind Turbine Blades, Roozbeh Bakhshi and Peter Sandborn, Proceedings of the ASME 2016 Power Conference, PowerEnergy2016.
Context-driven decisions for railway maintenance, R. Villarejo, D. Galar, P. Sandborn and U. Kumar, Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit, Vol. 230 No. 5, pp. 1469-1483, July 2016.
PHM-Based Wind Turbine Maintenance Optimization Using Real Options, X. Lei and P.A. Sandborn, International Journal of Prognostics and Health Management, Vol. 7, No. 1, 2016.
Applying Forgotten Lessons in Field Reliability Data Analysis to Performance-Based Support Contracts, E. Settanni, N. E. Thenent, L. B. Newnes, G. Parry, Y. M. Goh, and P. Sandborn, Engineering Management Journal, Vol. 28, No. 1, pp. 3-13, 2016, http://dx.doi.org/10.1080/10429247.2015.1130508.
| Upcoming Travel: Conferences, Events, and Guest Lectures | |
|---|---|
| Event and Location | Date |
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