IMAPS- High Temperature Electronics Network (HiTEN 2019) Conference

Monday, July 8, 2019
7:30 a.m.

Patrick McCluskey
mcclupa@umd.edu

Prof. Patrick McCluskey is co-chairing and presenting at the upcoming IMAP International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2019), July 8-10, 2019, being held at St. Anne’s College in the University of Oxford, Oxford, United Kingdom.  At the conference, Prof McCluskey will present on Effect of Bond Pad Thickness on Reliability of Copper Wire Bonds under Extreme Thermal Conditions and Simulating the Effect of Elastic Particle Inclusion on the Mechanical Properties of Transient Liquid Phase Sintered (TLPS) Alloys.

 

October 2019

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