Upcoming CALCE Student Presentations in Industry Conferences

This October, several CALCE students will present their research work in the areas of solder durability and counterfeit detection through side-channel analysis.

Power Spectrum Analysis-Based Counterfeit Screening: A Hardware Comparison - by Devon Richman

This study provides a comparative evaluation of the effectiveness of side-channel power spectrum analysis (PSA) for counterfeit microelectronic component detection using the Chiplytics PSA system and benchtop test and measurement equipment. Independent testing was performed by the University of Maryland's CALCE laboratory and Chiplytics using three signal voltage levels applied to three sets of functionally identical logic gate parts. Data was analyzed using principal component analysis and K-means clustering. The K-means fit was assessed based on the clustering accuracy and the silhouette score. ...

Conference: IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE)

Time: 3:50 pm, October 16

For more information, contact Dr. Michael Azarian and Dr. Diganta Das.

Board Design Factors for Vibration Durability Testing of Solder Interconnects - by Idowu Olajire Olatunji

This study is part of a Solder Performance and Reliability Assurance (SPRA) project, which is developing a performance specification for solders that can be considered for use in defense electronics. Since defense electronics can experience vibration in transport and use, the ability of solder interconnects to maintain low electrical resistance under vibration must be established. As part of the SPRA project, a vibration performance metric for solder interconnects is being established and tests are being conducted to support the development of this metric. In addition to the performance metric, tests are planned to establish a minimum set of data needed to characterize vibration fatigue life of solder. To this end, the test vehicles for these efforts must be defined. ...

Conference: SMTA International

Time: 10:30 am on Wednesday, Oct 22

For more information, contact Prof. Abhijit Dasgupta and Dr. Michael Osterman.

Low-Temperature Solder Vibration Durability - by Jonathan Clyde Martin

Vibration induced mechanical fatigue is a significant reliability concern across multiple industries, such as electronics for automotive, military and consumer applications. With the shift from leaded to lead-free solder materials, SAC305 has emerged as the leading lead-free alternative. Due to its popularity, SAC305 has been researched under vibrational loading and models. In contrast, low melting temperature lead-free solders remain comparatively underexplored, despite their increasing importance in products that are sensitive to reflow-temperature, such as emerging 3D heterogeneous integration components and modules. ...

Conference: SMTA International

Time: 4:00 pm on Thursday, Oct 23

For more information, contact Prof. Abhijit Dasgupta and Dr. Michael Osterman.

Published October 2, 2025