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Prof. Mohamed Alam of Purdue University Discusses Integrated Circuit Reliability

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Prof. Alam at Maryland

Prof. Mohamed Alam, Jai N. Gupta Distinguished Professor at Purdue University, presented a seminar at CALCE on “Moore’s Law and the Journey Ahead: Integrated Circuits in Extreme Environments” on Tuesday, September 9, 2025. His talk explored the growing reliability challenges faced by integrated circuits in military, space, and avionic applications, where harsh environments demand highly specialized packaging such as 2.5D/3D hetero-integration. Prof. Alam provided insights into cross-coupled chip-package-board interactions (CPBIs) and discussed potential solutions to ensure reliable IC operation under extreme conditions. The talk was very informative and entertaining, with personal and historical notes. His talk was attended by CALCE faculty and students and included lively discussions. He also shared his public resources on the design of experiments and transistor reliability. He met with CALCE and UMD researchers on topics of common interest and explored future collaborations.

In addition to these themes, Prof. Alam spoke about the growing challenges of keeping modern integrated circuits reliable under extreme conditions. He noted how today’s advanced transistors and packaging materials introduce new stresses such as heat buildup and environmental sensitivity, making traditional reliability standards less effective. He emphasized the importance of considering real-world deployment environments, including temperature, humidity, and other external factors, when designing electronics. Prof. Alam also underscored the need to integrate reliability principles into design tools, strengthen defenses against counterfeit parts, and adapt to emerging issues such as radiation exposure and climate impacts. Beyond the technical discussion, he reflected on the changing landscape of engineering education, including the growth of international student communities like those at Purdue, and the increasing role of open-access resources in shaping the next generation of engineers.

Prof. Alam is internationally recognized for his pioneering work in semiconductor reliability physics, with a distinguished career spanning Bell Laboratories and Purdue University. A fellow of IEEE, APS, and AAAS, he has received numerous honors, including the IEEE Kiyo Tomiyasu Field Medal, the SRC Technical Excellence Award, and the IEEE EDS Award. His research and teaching have influenced more than half a million students worldwide through both classroom and web-enabled courses.

"Moisture uptake in electronic devices cannot be completely prevented, even with silica particle-filled packaging, due to geometric and physical limitations, and the moisture impacts more than packaging."

For more information on CALCE research in semiconductor reliability, contact Dr. Diganta Das.

For more information about upcoming events at CALCE, click here.

 

 

Published September 10, 2025