CALCE Researchers Present at SMTA International 2025

SMTA International (SMTAI) is the flagship year conference organized by SMTA. SMTAI 2025 brought together professionals in electronics manufacturing and assembly for in-depth technical sessions, workshops, and a products/services exhibition. With over 95 presentations across multiple technical tracks, participants had access to the innovations in surface mount technology, advanced packaging, additive manufacturing, reliability, and emerging trends.

Pecht book cover

CALCE researchers presented two papers at the conference. Jonathan Clyde Martin, an MS student of Prof. Abhijit Dasgupta, presented “Vibration Performance of Low-temperature Tin-Bismuth Based Solders” in the session on Thermal Fatigue and Vibration Reliability of Low Temperature Solder Joints. His study compared low-temperature alloys with SAC305 using matched test vehicles and reliability metrics suited for temperature-sensitive assemblies, providing insights and engaging with attendees from across the electronics supply chain. Idowu Olajire Olatunji, a PhD student of Prof. Abhijit Dasgupta, spoke in the Mechanical Testing session, presenting “Board Design Factors for Vibration Durability Testing of Solder Interconnects.” His research focused on developing a vibration performance metric and defining test vehicles to characterize the vibration fatigue life of solder used in defense electronics. Both students had the opportunity to meet and interact with leading experts and industry professionals involved with electronic packaging reliability.

These contributions are part of the US Department of Defense-funded Solder Performance and Reliability Assurance (SPRA) project led by Dr. Michael Osterman, which is delivering a solder-agnostic performance specification and a comprehensive solder handbook for defense applications. The SPRA test plan generates life and acceleration models for solder interconnects through pilot, characterization, and verification testing, encompassing temperature cycling, shock, vibration, combined loading, and isothermal aging. Together, these studies help advance practical test strategies, quantitative metrics, and reliability guidance for both defense and commercial electronics.

For more information on the projects and the publications, contact Prof. Abhijit Dasgupta and Dr. Michael Osterman.

Published October 27, 2025