Event
CALCE Webinar - Impact of Dwell Time on Thermal Cycle Fatigue of Third Generation Lead-free Solders
Tuesday, February 24, 2026
11:00 a.m.-12:00 p.m.
Zoom
https://web.calce.umd.edu/seminars/cws20260224.htm
The elimination of lead (Pb) in solders under the European Union's Directive on the Restriction of Hazardous Substances for electronics not explicitly excluded from the directive and similar bans for printed board assemblies in vehicles under the European Union's End-of-Life Vehicle Regulation has led to the development and marketing of various Pb-free solders. While tin-silver-copper solder (SA305) with a weight composition of 3% silver and 0.5% copper, with the remaining balance tin, has become an industry standard, durability and aging issues have led to the development and marketing of third-generation lead-free solders. This webinar will discuss the various third-generation lead-free solders, present tests to characterize thermal-cycle durability, and examine the impact of isothermal aging on these third-generation solders.
About Presenter: Michael Osterman Michael Osterman is a Research Scientist and the Operations Director for the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland. In addition, he leads the development of the calceSARA software for printed board assembly level reliability assessment. He is also the co-lead of the Solder Performance and Reliability Assurance (SPRA) project (2021-2026), conducted under the Defense Electronics Consortium (DEC), operated by the United States Partnership for Assured Electronics (USPAE), under CIR CS-20-1302 for Lead-Free Defense Electronics. Between 2007 and 2015, Dr. Osterman organized and chaired the International Symposium on Tin Whiskers. He holds a patent for battery health monitoring. He has received a Professional Track Faculty Research Award from the University of Maryland and the John A. Wagnon Technical Achievement Award from IMAPS. He has written eight book chapters and over 160 articles. He is a senior member of IEEE and a member of SMTA.
