CALCE Webinar - Impact of Dwell Time on Thermal Cycle Fatigue of Third Generation Lead-free Solders | Center for Advanced Life Cycle Engineering

CALCE Webinar - Impact of Dwell Time on Thermal Cycle Fatigue of Third Generation Lead-free Solders

Tuesday, February 24, 2026
11:00 a.m.-12:00 p.m.
Zoom
https://web.calce.umd.edu/seminars/cws20260224.htm

The elimination of lead (Pb) in electronics under the European Union's Directive on the Restriction of Hazardous Substances and a similar ban on Pb in printed board assemblies for vehicles under the European Union's End-of-Life Vehicle Regulation has led to the development and marketing of various Pb-free solders. While tin-silver-copper solder (SA305) with a weight composition of 96.5% tin, 3% silver, and 0.5% copper has become an industry standard, durability and aging issues have led to the development and marketing of third-generation lead-free solders. This webinar will discuss the various third-generation lead-free solders, present tests to characterize thermal-cycle durability, and examine the impact of extended dwell time on these third-generation solders.

About Presenter: Michael Osterman is a Research Scientist and the Operations Director for the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland. In addition, he leads the development of the calceSARA software for printed board assembly level reliability assessment. He is also the co-lead of the Solder Performance and Reliability Assurance (SPRA) project (2021-2026), conducted under the Defense Electronics Consortium (DEC), operated by the United States Partnership for Assured Electronics (USPAE), under CIR CS-20-1302 for Lead-Free Defense Electronics. Between 2007 and 2015, Dr. Osterman organized and chaired the International Symposium on Tin Whiskers. He holds a patent for battery health monitoring and has received the Professional Track Faculty Research Award from the University of Maryland and the John A. Wagnon Technical Achievement Award from IMAPS. He is a senior member of IEEE and a member of SMTA.

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