Event
CALCE Webinar - Drop Interconnect Durability under Elevated Temperature and Multiaxial Loading
Thursday, August 14, 2025
11:00 a.m.-12:00 p.m.
Zoom
https://web.calce.umd.edu/seminars/cws20250814.htm
Electronics structures are subjected to mechanical shock in transport and use. To assure reliability, mechanical shock tests are conducted using drop tower testers, which provide one-axis testing under room conditions. However, products may be subjected to multiaxial mechanical shocks and elevated temperatures in transport and use. Shock loads are a particular concern for bonded structures such as electrical interconnects. This webinar will examine approaches for multiaxial and elevated-temperature testing, with a focus on the durability of electrical interconnects.
About the Presenter: Abhijit Dasgupta is Jeong H. Kim Professor of Mechanical Engineering at the University of Maryland (UMD), with research experience in the microscale and nanoscale mechanics and reliability physics of engineered materials used in conventionally and additively manufactured heterogeneous flexible electronic systems and intelligent microsystems. He holds a Ph.D. in Theoretical and Applied Mechanics from the University of Illinois at Urbana-Champaign (UIUC) and has been a principal investigator at the Center for Advanced Life Cycle Engineering (CALCE) at UMD for over 30 years, conducting research in reliability physics, design for reliability, accelerated stress testing, and real-time health management. He has published over 300 articles and conference papers; served on editorial boards of three international archival journals; presented over 50 workshops and short courses; helped form research and educational roadmaps for the electronics industry, and provided consulting services to numerous industry leaders. He has presented numerous keynote talks at international conferences, received 6 best-paper awards, and received 8 major awards in recognition of his research and educational contributions. He is an ASME Fellow, past Chair of the ASME Electronic and Photonic Packaging Division (EPPD), past member of the ASME Design, Manufacturing, and Materials Segment Leadership Team (DMM-SLT), and Current Chair of the Reliability Technology Working Group in the Heterogeneous Integration Roadmap (HIR) Team sponsored by IEEE/ASME/SEMI/IEPS/EDS.
