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CALCE Webinar - Chip Packaging Process-induced Stresses: Can We Go Beyond Prediction and Design It?
Tuesday, July 14, 2026 11:00 a.m.-12:00 p.m.Register Today Abstract Semiconductor packaging manufacturing processes utilize thermosets, filled with inorganic fillers (e.g., silica particles), to encapsulate and protect semiconductor chips. Compression molding is more frequently employed for...
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CALCE Webinar - Chip Packaging Process-induced Stresses: Can We Go Beyond Prediction and Design It?
Register Today Abstract Semiconductor packaging manufacturing processes utilize thermosets, filled with inorganic fillers (e.g., silica particles), to encapsulate and protect...
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Graduate Course: Applications of AI in Reliability - Fall 2026
Applications of AI in Reliability: Prognostics and Systems Health Management (Fall 2026 Graduate Course) Prof. Michael G....
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CALCE Reliability Science for Electronics Symposium - Fall 2026
On October 14, 2026, the Center for Advanced Life Cycle Engineering will hold its Reliability Science for Electronics Symposium. This meeting will be held in the Kay Boardroom, Kim...
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CALCE Failure Analysis of Electronics Short Course
An intensive 4-day course on Failure Analysis of Electronics is being offered by CALCE. The four-day course will cover specimen preparation and materials analysis techniques applicable...
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