Polymer materials are involved in almost every aspect of electronic packaging, and thus, their curing and mechanical behavior have become an integral part of package design and reliability assessment. As advanced packaging technologies such as fan-out wafer level packaging, package stacking, embedded packaging, 3-D packaging, etc., are practiced more widely, new polymeric materials are introduced almost daily. Still, less time is allowed to characterize them for predictive modeling due to the shrinking product development cycle time.

The objective of this three-hour short course is to familiarize non-polymer experts (e.g., mechanical, electrical, and process engineers) with the basics of thermosetting polymers used in electronic packaging and to eventually help them practice the knowledge for electronic packaging product development.

Attendees are expected to have a general knowledge of electronic packaging (e.g., Introduction to Electronic Packaging).

Course Outline:

  1. Introduction
    • Cure kinetics
    • Vitrification and glass transition
    • Cure shrinkage
    • Thermal expansion
    • Linear elastic and viscoelastic behavior
    • Hygroscopic swelling
  2. Hygroscopic swelling
    • Cure kinetics models (DCS)
    • Effective cure shrinkage (Fiber Bragg Grating (FBG))
    • Glass transition temperature (Differential scanning calorimetry (DSC), Dynamic Mechanical Analysis (DMA), and Thermal Mechanical Analyzer (TMA))
    • Coefficient of thermal expansion (TMA)
    • Linear elastic and viscoelastic properties (DMA and FBG)
    • Coefficient of hygroscopic swelling (Moire, FBG)
  3. Some considerations for structural modeling


Prof. Bongtae Han
301-405-5255 | education@calce.umd.edu | bthan@umd.edu
Bldg. 89, Room 1103
University of Maryland
College Park, MD 20742