To form a microelectronics device, an active silicon chip requires mechanical and electrical connections to the surrounding components as well as protection from the environment. The technology dealing with these requirements is called “Electronic Packaging” (or IC Packaging).

The objective of this three-hour short course is to introduce the fundamentals of electronic packaging to entry-level engineers and to lay the groundwork for further study in this area. Attendees will master the necessary background, terminologies, and requirements for various packaging technologies.

Course Outline:

  1. Introduction: history of electronic packaging
  2. Interconnect technologies: wire-bond, flip-chip, wafer-level connection
  3. Substrate technology: leadframe, flexible substrate, rigid substrate, coreless substrate
  4. Encapsulation technology: dispensing including capillary underfill, transfer molding, compression molding
  5. Board level assembly: Printed Circuit Board (PCB) (Pre Preg (PPG), Copper Clad Laminate (CCL), surface finish), solder alloy, flux, solder bump fabrication, solder reflow, moisture level sensitivity


Prof. Bongtae Han
301-405-5255 | |
Bldg. 89, Room 1103
University of Maryland
College Park, MD 20742