Thursday, August 06, 2020 | 8:30 AM - 12 Noon
Cameron Shearon, Raytheon Technologies
Michael Ford, Aegis Software
Overview
This class is being offered as part of the SMTA/CALCE Symposium on Counterfeit Parts and Materials.
Traceability is a defense against counterfeiters. When you build in verifiable traceability, you protect your product from being copied. IPC has developed a suite of standards for the electronics industry on traceability.
This course explains how to implement an exact traceability program, based on IPC-1782, to lower the risk and cost of consequences associated with the ingress of counterfeit components. Utilizing automated IIoT data collection with the IPC Connected Factory Exchange (CFX) standard leads to cost-effective, comprehensive data collection. We explain how traceability can be applied, including changes to working practices. We also show how traceability leads to increased quality, productivity, and product reliability.
Topics Covered:
- Risk Identification - the need of traceability
- The benefits of traceability
- Introduction to IPC-1782
- Traceability data collection
- Traceability data storage
- Operational guidelines for traceability data collection
- Meeting regulatory and marketplace requirements
- Traceability as part of the secure supply chain
- Open discussion
This course is for supply-chain managers, designers, component engineers, brand protection specialists, and others.
About the Instructors
Cameron Shearon: Cameron Shearon is a Principal Materials Engineer with Raytheon’s IDS Division. Prior to his current role he was the owner of Shearon-Consulting, co-chair of IPC 1782, and a SMTA Distinguished Speaker. Cameron has given invited speeches at many international events. He earned a BS and MS in Materials Science and Engineering from North Carolina State University. He obtained a Physics minor for his BS and a Solid State Science minor for his MS. Cameron initiated and chaired the development of IPC 1782, a global component traceability standard that contains four traceability levels for materials and four independent traceability levels for the process that was completed in record time with the help of many outstanding contributors, IPC Staff support, and his leadership. As a result of his contribution to this standard, Cameron received a Committee Leadership Award from IPC at IPC APEX EXPO 2017.
He has also worked as a Process Engineer in a Wafer Fab, Failure Analysis Engineer and Product Safety Engineer in an R&D Environment, a Lead Quality Engineer with AT&T’s Global Supply Chain, and a Reliability Engineer with AT&T Labs. ETSI adopted and published his contribution in early 2016, which established the fundamental foundation for his current work of developing a standard portfolio of very granular in situ custom probe level metrics, as well as, an expandable & extendable framework for those metrics along with an associated governance structure for the new global software defined telecommunications networks that can be used by Big Data groups among others to help make everyday decisions. Cameron is chairing the Multi-Standard Development Organization (SDO) metric effort for TM Forum and includes members from ETSI, NIST, and QuEST Forum. In addition, he chaired the NFV Metric Landscape effort for Quest Forum. Cameron has participated as a member in a multiple phase TM Catalyst project that has won several awards (e.g.; Best Technical Contribution, Best In Show, etc.).
Michael Ford: Working for Aegis Software provides Michael the opportunity to apply his software for electronics assembly manufacturing experience to further drive technology solution innovation, satisfying evolving business needs in modern digital manufacturing. Starting his career with Sony, including eight years working in Japan, Michael has been instrumental in creating and evolving revolutionary software solutions for assembly manufacturing, that meet the most demanding expectations. Today, Michael is an established thought leader for Industry 4.0 and digital Smart factories, an active contributor to IPC industry standards, including the Connected Factory Exchange (CFX), traceability & secure supply-chain. In 2020, Michael was given an IPC President’s Award as recognition for contributions towards several standards, that together now are leading to the formation of the new IPC Digital Twin standard. Michael also regularly contributes articles, columns and blogs in several leading industry publications, and was given the iConnect “Good For the Industry” award in 2020.
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