SMTA Student Chapter at the University of Maryland | Center for Advanced Life Cycle Engineering

The University of Maryland has one of the world's largest research center focusing on electronics reliability. This center, the Center for Advanced Life Cycle Engineering, was established in 1986. Since then, CALCE has grown to be recognized as one of international leaders in reliability of electronics based on Physics-of-Failure analysis. The wide scope of CALCE's research on reliability of electronics products and systems spans prognostics and health management of electronics, cost modeling, MEMS reliability and more. CALCE is led by founder and director, George Dieter Professor of Mechanical Engineering, Michael Pecht. Professor Pecht is a world renowned reliability engineer and educator with numerous awards.

The SMTA Student Chapter at the University of Maryland, College Park was re-established in 2018. The student chapter is currently advised by Dr. Michael Osterman, who is the director of the CALCE Eletronic Products and Systems Consortium (EPSC) and also actively an active SMTA member.

The University of Maryland SMTA student chapter will hold and participate in several events to provide the members opportunities to interact with other members of the Capital chapter (District of Columbia chapter) and various industry experts.

Faculty Advisor: Dr. Michael Osterman

President : Deng Yun chen
Vice President: Saurabh Saxena
Treasurer: Erick Gutierrez
Secretary: Edmond Elburn

About SMTA

The Surface Mount Technology Association (SMTA), established in 1984, is a non-profit international association of companies and individuals involved in all aspects of the electronics industry. The Association is dedicated to the advancement of the electronics industry through member education and interaction

The SMTA student chapter at the University of Maryland is composed of several graduate students whose focus is in the field of microelectronics and electronics packaging reliability, qualification, and prognostic health management (PHM). Many members are involved in microelectronics reliability through their graduate research at the Center for Advanced Life Cycle Engineering (CALCE).

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SMTA/IMAPS UMD Student Chapter Spring Technical Symposium

Wednesday, March 6, 2019
3:00 p.m.-7:00 p.m.
Johns Hopkins Applied Physics Laboratory (APL), Laurel, MD
Subramani Manoharan
subrdm@umd.edu

The IMAPS Chesapeake Chapter combined with the University of Maryland student chapter of IMAPS and SMTA, will hold its Spring Technical Symposium on March 6th, 2019, at the Applied Physics Laboratory (APL) of Johns Hopkins University. The symposium will focus on emerging trends in electronics packaging and their reliability concerns. This will be the first collaborative meeting between IMAPS and SMTA student chapters, and is expected to attract people with a wide range of background hence providing great networking opportunity for students and professors.

The event will kick off with speeches from eminent speakers on topics covering thermal aspects of power module packaging, bi-metal interface degradation in wire bonds and trends in packaging materials and its reliability. Dinner will be served for all attendees and participants. Selected topics will be presented as posters by the students of University of Maryland during the dinner session.

Additional information can be found here.

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