Course Overview
This course introduces the classical reliability concepts and relates the concepts to the physics of failure approach. The information provided in this course will be useful for implementing a physics-of-failure methodology for the life cycle of a product. The participants will learn how to develop and migrate to physics-of-failure based reliability assessment programs. The course will also teach how to facilitate the introduction of the physics-of-failure methodology among the complete supply chain of the product.
Course Outline
1. Reliability Concepts including Class Exercise
- Fundamental reliability concepts
- Failure probability density function
- Hazard rate
- Conditional reliability
- Mean and median time to failure
- Failure definitions
- Classification of failures and failure causes
2. Statistical Distributions in Reliability Assessment
- Probability Distributions
- Weibull
- Exponential
- Normal and Lognormal
- Discrete distributions
- Failure free operating period
3. System Reliability Analysis
- Reliability block diagrams
- Series and parallel systems
- Complex systems
- Redundant systems and limitations
4. Physics of Failure
5. Design for Reliability based on Physics of Failure
6. Defining product requirements
Product life cycle conditions
- Supply-chain with proper reliability capability maturity
- Part and material selection
- Failure modes mechanisms and effects analysis (FMMEA)
- Designing to the usage and process capability of the product
7. IEEE reliability prediction standard 1413
- Mil-Hdbk 217, PRISM, Telcordia and other methods
- Test based methods
- Field data based methods
- Physics of failure methods
Past Customers
|
|
|
*This course has also been presented as a public offering in College Park, MD and Beijing, China.
Related Texts
- Parts Selection and Management
- Guidebook for Managing Silicon Chip Reliability
- The Integrated Product and Process Design and Development
- Product Reliability, Maintainability, and Supportability Handbook
- Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Contact
Michael Pecht
301-405-5323 | education@calce.umd.edu
Bldg. 89, Room 1103
University of Maryland
College Park, MD 20742
Top