Part 1: Physics of Failure
The Physics-of-Failure (PoF) is the root cause of why, where, and how materials fail under the action of different environmental/operating conditions. Physical models that describe failure processes at the material level are called PoF models. In spite of its simplicity, the PoF models are often confused with the statistics-based empirical models, which do not require the knowledge of root causes of failures and related predictive physical models.
The objective of this two-hour short course is to teach how to develop PoF models and describe the requirements for successful implementation of such models, intended for the design for reliability (DfR) process of electronic packaging products.
- Introduction: durability vs. reliability
- Accelerated life testing
- Board level reliability
- Important failure mechanisms including warpage issues, electrochemical migration, delamination, etc.
- Life prediction methods: deterministic vs. statistical approaches
Part 2: Fundamentals of Moisture Transport in Polymers
Reliability issues associated with moisture have become increasingly important as advanced electronic devices are nowhere more evident than in high-performance products. The transition to the Pb-free solders, which requires higher reflow temperature, makes the problem further exacerbated. Moisture absorbed into electronic packages can initiate many failure mechanisms, in particular, interfacial delamination, degradation of adhesion strength, etc.
The objective of this one-hour short course is (1) to help packaging engineers gain a fundamental understanding of moisture transport in polymers used in electronic packaging and (2) to teach them the procedures to measure the critical hygroscopic properties as well as advanced numerical modeling schemes to predict the moisture diffusion phenomenon.
- How moisture transports?
- How to measure hygroscopic properties?
- Modeling strategies for moisture absorption and desorption
- Moisture level sensitivity; and popcorn effect
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