AI Enhanced Physical Inspection for Counterfeit Microelectronics

Charles G. Woychik  [NHanced Semiconductors, Inc] and Navid Asadizanjani [University of Florida]

 

Abstract: 

As advanced packaging substrates become primary targets for reverse engineering and cloning, conventional physical and software-based security measures are proving insufficient against modern high-resolution imaging. This work proposes a hardware-level security framework that utilizes micro-electromechanical systems (MEMS) switches to enable dynamic and reconfigurable circuit layout obfuscation. By embedding MEMS arrays within the Si-interposer architecture, the system enforces concealed and randomized routing structures that are resistant to physical inspection and tampering. The methodology leverages heuristic-driven placement and entropy-based analysis to maximize design complexity, effectively deterring adversaries from reconstructing original functionality. This approach ensures that intercepted substrates remain unusable "black boxes" without authorized configuration data, offering a scalable solution for securing critical semiconductor supply chains, especially for defense and high-reliability applications.

This is important because modern electronics power everything from smartphones and cars to medical devices and national infrastructure. If these systems are compromised by counterfeit or reverse-engineered components, it can lead to safety risks, data breaches, and loss of trust in critical technologies. Strengthening hardware-level security helps ensure that the electronics people rely on every day are safe, reliable, and protected from tampering or misuse.

Biography of Charles Woychik

Charles Woychik is currently the VP of Sales and Marketing at NHanced Semiconductor, Inc. Previously, he was Senior Director of Advanced Packaging Platforms at SkyWater Technology. Chuck has held technical and managerial positions at i3 Microsystems, Invensas, GE Global Research, and IBM. He holds a Doctorate and Master of Science degree in Materials Science and Engineering from Carnegie-Mellon University. He has a Bachelor of Science degree in Materials Science from the University of Wisconsin, Madison. Chuck has numerous publications and 123 issued US patents to his credit.

 

Biography of Navid Asadizanjani