Erik Jordan

Bio: Erik Jordan is the Global Sales Manager for Nisene Technology Group.  He specializes in equipping labs with automated decapsulation equipment for Failure Analysis and counterfeit detection.  He has published work with multiple organizations including SMTA, ERAI, CTI, ISTFA as well as multiple Universities to present decapsulation as a failure analysis and counterfeit detection solution.  He is a contributing member of SAE 6081 and served as the head chair for decap on SAE 6171.

Abstract: When counterfeit detection became an industry mainstay, the internal visual portion revolved around matching date and lot codes. Because copper was implemented into newer date/lot codes, it has been slow to emerge in the counterfeit detection world. An often-overlooked portion of internal visual inspection is bond wire integrity.  Because copper bond wires easily react with nitric and sulfuric acid, an IC could be decapsulated and show no bond wires or heavily corroded bond wires. Since copper wire has served as a replacement to gold, and not always documented, that means a sample previously processed with gold wires but now containing copper wires could show wire corrosion, potentially leading to an improperly labeled non-conforming component.Over the years, the industry has accepted counterfeit detections necessity and promoted further industry standards to establish a baseline of testing conformance.  With the evolution of these industry standards, the market has looked for testing methods that allow samples a deeper level of inspection so that greater confidence can be established when determining if a component is conforming or non-conforming. Part of that expanded inspection is maintaining all internal design so detailed inspection can take place as well as other testing like functionality. If a sample with copper bond wires is incorrectly decapsulated and the wires are compromised, the ability to perform those extended inspections is also compromised.