The IMAPS Chesapeake Chapter combined with the University of Maryland student chapter of IMAPS and SMTA, will hold its Spring Technical Symposium on March 6th, 2019, at the Applied Physics Laboratory (APL) of Johns Hopkins University. The symposium will focus on emerging trends in electronics packaging and their reliability concerns. This will be the first collaborative meeting between IMAPS and SMTA student chapters, and is expected to attract people with a wide range of background hence providing great networking opportunity for students and professors.
The event will kick off with speeches from eminent speakers on topics covering thermal aspects of power module packaging, bi-metal interface degradation in wire bonds and trends in packaging materials and its reliability. There will also be exhibits showcasing products and services that are of importance to the electronics packaging and reliability personnel. Dinner will be served for all attendees and participants. Selected topics will be presented as posters by the students of University of Maryland during the dinner session.
Date: Wednesday March 6, 2019
Time: 3 PM - 7 PM
Venue: Johns Hopkins Applied Physics Laboratory (APL), Laurel, MD
Registration: There will be a $10 fee collected at the venue
Speakers and Abstracts
Speaker: Subramani Manoharan
Presentation Title: Interfacial Degradation of Copper Wire Bond in Combined (Thermal Aging + Cycling) Loading Condition
Abstract: Copper (Cu) wire bonds have become the dominant wire material used in microelectronic packages, which has replaced gold (Au) in majority of applications. Cost savings has been the key factor to drive this transition in wire bond material, although there are other advantages to Cu such as better electrical and thermal conductivity, slower intermetallic compound (IMC) formation and reduced wire sweep during transfer molding. However, two critical reliability concerns exist with Cu wire bonds, namely, growth of electrically resistive and brittle IMCs and fatigue of bond wire, which makes them not suitable for harsh environments such as in industrial, military and automotive electronics.
A review of literature shows fracture at wire neck as the most commonly reported failure mode. However, with the growth of IMC at interface, the location of failure shifts to interfacial separation. This is studied in detail through performing thermal cycling experiments with long dwell times at high temperature that promotes interfacial IMC growth, to replicate actual use condition. Additionally, most of the work presented in literature use lab made wire-bonded specimen in their study on test packages, which may not replicate actual commercial off-the-shelf (COTS) parts which have several different geometrical and material parameters. A unique test approach is adopted to study this two part failure and model its failure time by including the myriad of factors that exists in COTS packages. Additionally, critical factors contributing to failure are identified and studied in detail to establish a physics based model to predict failure.
About the Speaker: Subramani Manoharan is a PhD student in Mechanical Engineering at the University of Maryland, College Park. His research focuses on electronics packaging with emphasis on interconnect technology such as wire bonding, lead-free solder and underfills for industrial and commercial applications. His interests also include material characterization and failure analysis of microelectronics. He is member of ASME, IMAPS and IEEE organizations and actively serves as a reviewer for some of their journals.
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