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Dr. Patrick McCluskey is a Professor of Mechanical Engineering at the University of Maryland, College Park, and the Department’s Director of Undergraduate Studies. He has over 25 years of research experience in the areas of thermal management, reliability, and packaging of electronic systems for use in extreme temperature environments and power applications. Dr. McCluskey has co-authored three books, 5 US Patents, and over 175 peer-reviewed technical articles with nearly 4000 citations. He is an associate editor of the IEEE Transactions on Components, Packaging, and Manufacturing Technology, co-chair of the Integrated Power Electronics technical working group of the IEEE Heterogeneous Integration Roadmap, Awards Director, and Member of the Board of Governors of the IEEE Electronic Packaging Society, Fellow and Member of the Executive Council of IMAPS, and a member of ASME and AIAA.
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