The Effect of Epoxy/Glass Interfaces on CAF Failures in Printed Circuit Boards, Bhanu Sood and Michael Pecht, Microelectronics Reliability, Vol. 82, PP. 235-243, March, 2018, DOI: 10.1109/ACCESS.2018.2805281.
Failure of Polymer Aluminum Electrolytic Capacitors Under Elevated Temperature Humidity Environments, Anshul, Shrivastava, Michael Azarian, and Michael Pecht, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2017.
Electronic Circuit Health Estimation Through Kernel Learning, Arvind Vasan and Michael Pecht, IEEE Transactions on Industrial Electronics, Vol. PP, No. 99, July 2017.
Viscoplastic Properties of pressure-less sintered silver materials using indentation, D. Leslie, A. Dasgupta, and Carlos Morillo, Microelectronics Reliability, Vol. 74, 121-130, 2017.
Thermal degradation of Polyimide Insulation and Its Effect on Electromagnetic Coil Impedance, N. Jordan Jameson, Michael H. Azarian, and Michael Pecht, Proceedings of the Society for Machinery Failure Prevention Technology Conference, May 15-18, 2017, Virginia Beach, VA.
Shelf Life Evaluation Method for Electronic and other Components using a Physics of Failure (PoF) Approach, Nga Man Li, Diganta Das,and Michael Pecht, Proceedings of the Society for Machinery Failure Prevention Technology Conference, May 15-18, 2017, Virginia Beach, VA.
Risk Assessment of Transition to Lead-free Electronics Assembly, Guru Prasad Pandian, Diganta Das, Michael Osterman, and Michael Pecht Proceedings of the Society for Machinery Failure Prevention Technology Conference, May 15-18, 2017, Virginia Beach, VA.
Moisture ingress, behavior and prediction inside semiconductor packaging: A review, Bongtae Han and Dae-Suk Kim, Journal of Electronic Packaging, Vol. 139, pp. 1-11, March 2017.
Blister testing for adhesion strength measurement of polymer films subjected to environmental conditions, Kenny Mahan, David Rosen, and Bongtae Han, Journal of Electronic Packaging, Vol. 138, pp. 1-8, December 2016.