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Professor Abhijit Dasgupta 2174 Glenn L. Martin Hall, #88 Phone: 301-405-5251 Email: dasgupta@umd.edu
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Class Timings and Venue Monday and Wednesday 2.00 pm - 3.15 pm 2121 J.M. Patterson Hall (JMP) |
- Introduction
Advanced packaging and heterogeneous integration have permitted the integration of electronics into all manner of products and applications, embedding electronics into every facet of our lives. It has facilitated the mobile computing revolution and has been instrumental in creating wearable electronics, implantable health monitors, and energy-efficient vehicles. The design of electronic systems requires engineering expertise from many different disciplines. In fact, cost, size, weight, manufacturability, quality, reliability, and even commercial success of electronic systems are often more a function of mechanical design than electrical design. The objective of the course is to introduce seniors and first-year graduate students to the principles of mechanical engineering required for designing and manufacturing reliable electronic systems and to lay the groundwork for further study in this area. Students will master the necessary background in science and mathematics to become proficient designers of electronic hardware. Furthermore, interpersonal, teamwork and communication skills will be developed through practical deconstruction and design projects. Course topics will include fundamental principles of active and passive electronic devices; MEMS and microsystems; design of components, circuit boards, connectors, and assemblies; additive and subtractive manufacturing techniques; and vibration, shock, fatigue, and thermal analysis of assemblies. The course will culminate in the deconstruction analysis of actual electronic systems and the design of improved packaging.
- Concepts taught as a part of the course
| Introduction to Electronic Packaging | Organic and Ceramic Substrates |
| Semiconductor Devices and Processing | Electrical Design of Printed Wiring Boards |
| Multilevel chip metallization and Semiconductor Failure | Mechanical Design of Printed Wiring Boards |
| Mechanisms | Manufacture of Printed Wiring Boards and PWB Failure Mechanisms |
| Basics of Packaging – Packaging Taxonomy (Classification) | Lead-free Soldering; Soldering Processes and Defects Thermal Analysis |
| Wirebonding (Al, Au, Cu, Multilayer) | Thermal Management |
| Flip Chip and Alternate Interconnection | Vibration Analysis |
| Die Attach and Leadframe | Drop and Impact Analysis |
| Plastic Encapsulation | Special Topics: Heterogeneous Integration (2.5D/3D, WLFI/FO, SOC/SOP/SIP) |
| Area Array Packaging and Chip Scale Packaging | Special Topics in Electronics Packaging (MEMS, Sensors, Flexible/Wearable Electronics) |
| Physics of Failure Reliability Assessment & Accelerated Testing | Special Topics in Electronics Manufacturing (Additive Manufacturing - Printed Electronics) |
| Power Electronics and Extreme Temperature Electronics | Separable Connectors |
- Overview of the course
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The course will consist of Lectures, HW Assignments, Quizzes, Class project, Graduate project, a Mid-term Exam and a Final Exam.
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The class project will be about the reverse engineering of electronic packaging architecture.
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For the class project, students will be grouped into teams and each team will deconstruct a commercial electronic product and examine the packaging architecture.
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The graduate project will be about the design and reliability assessment of electronic modules
For more information about the Course, Please Contact Prof. Abhijit Dasgupta
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