Microelectronics Powering America's Defense (Tuesday, June 24, 2025)

Matthew Hicks (Northrop Grumman)

Matt Hicks is the Sr. Director of Northrop Grumman’s Foundries, Test & Advanced Packaging (FTAP) organization. This organization consists of the Advanced Technologies Labs (ATL; based in Linthicum Heights, MD), Space Park Foundry (SPF; based in Redondo Beach, CA) and Advanced Packaging (based in Linthicum Heights, MD, Redondo Beach, CA and Apopka, FL). FTAP facilities designs, fabricates, packages, and tests discriminating microelectronic devices that provide enabling system capabilities for defense applications. The FTAP organizations have been delivering microelectronics for over 75 years, with annual deliveries exceeding 1,000,000 devices per year, leveraging over 1,000 staff. FTAP is part of the larger Northrop Grumman Microelectronic Center (NGMC). Hicks previously held positions within NG as a Director of ATL, Program Manager for Space Payloads and Program Manager for Microelectronics. Throughout his career, he has supported programs ranging from fiber optic laser detonators, weak-link sensors, DMEA Trusted Foundry programs, semiconductor heterogeneous integration, advanced-node semiconductor development & integration, digital drop-on- demand printing technology, and several restricted programs. The commonality is providing facilitation and program management support to bring nationally strategic programs from R&D maturity into scaled production. Hicks received his B.S. degree in Electrical Engineering / Microelectronic Engineering from Rochester Institute of Technology and his M.B.A. degree from Temple University. Northrop Grumman solves the toughest problems in space, aeronautics, defense, and cyberspace to meet the ever-evolving needs of our customers worldwide. Our 90,000 employees define possible every day by using science, technology, and engineering to create and deliver advanced systems, products, and services. 

A Global View Versus a U.S. Focus on Outsourced Assembly and Test (OSAT) Facilities to Support Wafer-Level Packaging (Wednesday, June 25, 2025)

Chuck Woychik (NHanced Semiconductors)

Charles Woychik is currently the VP of Sales and Marketing at NHanced Semiconductor, Inc. Previously, he was Senior Director of Advanced Packaging Platforms at SkyWater Technology. Chuck has held technical and managerial positions at i3 Microsystems, Invensas, GE Global Research, and IBM. He holds a Doctorate and Master of Science degree in Materials Science and Engineering from Carnegie-Mellon University. He has a Bachelor of Science degree in Materials Science from the University of Wisconsin, Madison. Chuck has numerous publications and 123 issued US patents to his credit.

Dr. Diganta Das

For more information or questions regarding the technical program (including Professional Development Courses), contact the Conference Chair, Dr. Diganta Das

Kristin Nafstad

For more information or questions regarding event logistics, exhibitions, and sponsorship, contact Kristin Nafstad.