- A complete listing of Test Methods is available at here -
- Military vs. Industry Specification Cross References are available here -
Authority | Standard | Test Method | Title |
JEDEC | JESD-22 | 22-A100-A | Cycled Temperature Humidity Bias Life Test |
JEDEC | JESD-22 | 22-A101-B | Steady State Temperature Humidity Bias Life Test |
JEDEC | JESD-22 | 22-A102-B | Accelerated Moisture Resistance - Unbiased Autoclave |
JEDEC | JESD-22 | 22-A103-A | High Temperature Storage Life |
JEDEC | JESD-22 | 22-A104-A | Temperature Cycling |
JEDEC | JESD-22 | 22-A105-B | Power and Temperature Cycling |
JEDEC | JESD-22 | 22-A106-A | Salt Atmosphere |
JEDEC | JESD-22 | 22-A107-A | Bias Life |
JEDEC | JESD-22 | 22-A108-A | Highly-Accelerated Temperature and Humidity Stress Test (HAST) |
JEDEC | JESD-22 | 22-A110-B | Vibration, Variable Frequency |
JEDEC | JESD-22 | 22-B103-A | Mechanical shock |
JEDEC | JESD-22 | 22-B104-A | High Temperature Continuity |
JEDEC | JESD-22 | 22-C-100-A | Physical Shock, Multilayer Printed Wiring Board |
IPC | TM-650 | 2.6.5 | Temperature Cycling, Printed Wiring Board |
IPC | TM-650 | 2.6.6B | Temperature |
IPC | TM-650 | 2.6.7A | Thermal Shock and Continuity, Printed Board |
IPC | TM-650 | 2.6.7.1 | Thermal Shock--Polymer Solder Mask Coatings |
IPC | TM-650 | 2.6.7.2 | Thermal Shock, Continuity and Microsection, Printed Board |
IPC | TM-650 | 2.6.9 | Vibration, Rigid Printed Wiring |
IPC | TM-650 | 2.6.13 | Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring |
IPC | TM-650 | 2.6.14A | Resistance to Electrochemical Migration, Polymer Solder Mask |
IPC | TM-650 | 2.6.15B | Corrosion, Flux |
IPC | TM-650 | 2.6.19 | Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards |
DEFENSE DEPT. | MIL-STD-8838 | 1005.8 | Steady state life |
DEFENSE DEPT. | MIL-STD-8838 | 1006 | Intermittent life |
DEFENSE DEPT. | MIL-STD-8838 | 1007 | Agree life |
DEFENSE DEPT. | MIL-STD-8838 | 1009.8 | Salt atmosphere (corrosion) |
DEFENSE DEPT. | MIL-STD-8838 | 1010.7 | Temperature cycling |
DEFENSE DEPT. | MIL-STD-8838 | 1011.9 | Thermal shock |
DEFENSE DEPT. | MIL-STD-8838 | 1016 | Life/reliability characterization tests |
DEFENSE DEPT. | MIL-STD-8838 | 1031 | Thin film corrosion test |
DEFENSE DEPT. | MIL-STD-8838 | 1033 | Endurance life test |
DEFENSE DEPT. | MIL-STD-8838 | 2001.2 | Constant acceleration |
DEFENSE DEPT. | MIL-STD-8838 | 2002.3 | Mechanical shock |
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