Event

On March 25, 2026, the Center for Advanced Life Cycle Engineering will hold its Reliability Science for Electronics Symposium. This meeting will be a Zoom-only only. The meeting will include an overview of CALCE research activities, followed by several detailed research project presentations. The meeting will be open to all CALCE members. For non-CALCE organizations interested in attending, please contact Dr. Osterman.

Registration to open on or before 2/25/2026

Topics include:

• Ripple Current Testing of Multilayer Ceramic Capacitors (MLCCs) for Correlation with Selection Criteria
• Rapid Assessment of Electronic Assemblies Using Side-Channel Power Modulation Analysis
• Modeling and Physical Analysis of Lubrication in Lightly Loaded Contacts Undergoing Fretting
• HDI Laminate Reliability Concerns.
• Feature Size-based Dimensional Data for Component Reliability Assessment.
• Microstructure-sensitive Grain-scale Model for Cyclic Fatigue in Oligocrystalline SAC Interconnects
• Coating Durability in Electronic Products
• Thermal Cycle Reliability Models for Lead-free High-Performance Solder Interconnects and Wafer Level Package Solder Interconnect Tests
• Reliability of Low-Temperature Solder Interconnects
• Tin Whisker Mitigation and Risk